SM662GEA-AC eMMC Memory IC Equivalent & Substitute Parts

Part Overview

The SM662GEA-AC is a Ferri-eMMC® NAND Flash memory IC manufactured by Silicon Motion, Inc., featuring a 100-BGA (14x18) package configuration. This component utilizes MLC (Multi-Level Cell) NAND Flash technology with eMMC 5.0 interface protocol. The part is classified as obsolete, necessitating identification of active equivalent alternatives that maintain electrical and mechanical compatibility for system integration and production continuity.

Substiute Parts

SM662GEA-AC

Silicon Motion, Inc.In Stock: 1148SM662GEA-AC Datasheet

Current PartRFQ

SM662GEB BEST

Silicon Motion, Inc.In Stock: 1067SM662GEB BEST Datasheet

MFR RecommendedRFQ

SM662GEC BFSS

Silicon Motion, Inc.In Stock: 1167SM662GEC BFSS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM662GEA-AC is determined by strict adherence to the following parameters:

Mandatory Compatibility Parameters:

• Manufacturer: Silicon Motion, Inc. (same manufacturer ensures design continuity)
• Base Product Number: SM662 (ensures platform compatibility)
• Memory Interface: eMMC (protocol compatibility)
• Package / Case: 100-LBGA (14x18) (mechanical and electrical pin compatibility)
• Mounting Type: Surface Mount (assembly process compatibility)
• Operating Temperature Range: -40°C ~ 85°C (thermal envelope compatibility)
• RoHS Status: ROHS3 Compliant (regulatory compliance)
• Moisture Sensitivity Level: 3 (168 Hours) (handling and storage requirements)

Variable Parameters (Non-Restrictive for Substitution):

• Memory Technology: FLASH - NAND (MLC, TLC, or SLC variants acceptable)
• Memory Size: Capacity differences permitted based on system requirements
• Memory Organization: Bit organization variations acceptable
• Product Status: Active alternatives preferred over obsolete

The SM662GEA-AC qualifies two active substitute parts that maintain all mandatory compatibility parameters while offering enhanced or alternative memory technology specifications.

Parameter Comparison

Engineering Selection Recommendations

Both substitute parts maintain full electrical and mechanical compatibility with the SM662GEA-AC through identical package geometry, thermal specifications, and interface protocols. Selection between SM662GEB BEST and SM662GEC BFSS depends on capacity and endurance requirements:

SM662GEB BEST offers 256Gbit capacity with TLC (Triple-Level Cell) technology, providing higher storage density suitable for applications requiring maximum data capacity within the same physical footprint.

SM662GEC BFSS provides 160Gbit capacity with SLC (Single-Level Cell) technology, delivering superior write cycle endurance and data retention characteristics for applications prioritizing reliability and longevity over maximum capacity.

Both alternatives carry Active product status, ensuring continued manufacturing availability and supply chain stability. All three parts maintain identical RoHS3 compliance and REACH unaffected status, supporting regulatory requirements across global markets.

Frequently Asked Questions (FAQ)

Q: Can SM662GEB BEST or SM662GEC BFSS be used as direct replacements for SM662GEA-AC?

A: Yes. Both substitute parts maintain identical package geometry (100-LBGA 14x18), eMMC interface protocol, operating temperature range (-40°C ~ 85°C), and surface mount configuration. Electrical and mechanical compatibility is assured.

Q: What is the primary difference between the substitute parts?

A: SM662GEB BEST uses TLC (Triple-Level Cell) technology with 256Gbit capacity, while SM662GEC BFSS uses SLC (Single-Level Cell) technology with 160Gbit capacity. TLC provides higher density; SLC provides superior write endurance.

Q: Are there any handling or storage differences between these parts?

A: All three parts share identical Moisture Sensitivity Level (MSL) rating of 3 (168 Hours), requiring identical handling, storage, and reflow procedures.

Q: Why is the SM662GEA-AC classified as obsolete?

A: Obsolete status indicates the part is no longer in active production. SM662GEB BEST and SM662GEC BFSS are active alternatives that fulfill the same functional role with enhanced specifications.

Q: Do all parts comply with environmental regulations?

A: Yes. All three parts are ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory standards.

Q: What determines substitution eligibility?

A: Substitution is based on manufacturer (Silicon Motion, Inc.), base product number (SM662), memory interface (eMMC), package type (100-LBGA 14x18), operating temperature range, and compliance certifications. Memory technology and capacity variations are acceptable.