SM662GAC-BDSS Equivalent & Substitute Parts

Part Overview

The SM662GAC-BDSS is a FLASH NAND (SLC) Memory IC manufactured by Silicon Motion, Inc., with a capacity of 160Gbit in eMMC format. This component is packaged in a 153-BGA (11.5x13mm) configuration and operates across the industrial temperature range of -40°C to 85°C. The part is classified as obsolete, necessitating identification of equivalent alternatives for ongoing design requirements and procurement needs.

Substiute Parts

SM662GAC-BDSS

Silicon Motion, Inc.In Stock: 971SM662GAC-BDSS Datasheet

Current PartRFQ

SM662GAC-BESS

Silicon Motion, Inc.In Stock: 770SM662GAC-BESS Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662GAC-BDSS is determined by strict equivalence across the following critical parameters:

Mandatory Equivalence Parameters:

• Memory Type: Non-Volatile FLASH
• Technology: FLASH - NAND (SLC)
• Memory Size: 160Gbit
• Memory Organization: 20G x 8
• Memory Interface: eMMC
• Operating Temperature Range: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Series: Ferri-eMMC®
• RoHS Compliance: ROHS3 Compliant
• Moisture Sensitivity Level: 3 (168 Hours)

The SM662GAC-BESS meets all mandatory equivalence parameters. The primary distinction between the main part and its substitute lies in the package configuration (BGA pin count and dimensions) and product status (obsolete versus active).

Parameter Comparison

Engineering Selection Recommendations

The SM662GAC-BESS serves as a functional equivalent to the SM662GAC-BDSS based on electrical and functional parameters. Both components share identical memory specifications, interface protocols, and compliance certifications.

Product Status Consideration: The SM662GAC-BDSS is classified as obsolete, while the SM662GAC-BESS maintains active product status. This distinction is significant for long-term supply chain planning and component availability.

Compliance Alignment: Both parts maintain ROHS3 compliance and identical moisture sensitivity ratings, ensuring compatibility with current manufacturing and environmental standards.

Package Configuration Difference: The primary design consideration involves the BGA package variant. The SM662GAC-BDSS utilizes a 153-BGA (11.5x13mm) configuration, whereas the SM662GAC-BESS employs a 100-BGA (14x18mm) configuration. This difference requires PCB layout and footprint redesign during component substitution.

Frequently Asked Questions (FAQ)

Q: Are the SM662GAC-BDSS and SM662GAC-BESS electrically interchangeable?

A: Both components share identical memory capacity (160Gbit), organization (20G x 8), interface protocol (eMMC), and operating temperature range (-40°C ~ 85°C). Electrical functionality is equivalent. Physical package differences require PCB redesign.

Q: What is the primary reason for substituting the SM662GAC-BDSS?

A: The SM662GAC-BDSS is classified as obsolete. The SM662GAC-BESS, with active product status, provides continued availability and supply chain support for equivalent functionality.

Q: Do both parts require identical PCB footprints?

A: No. The SM662GAC-BDSS uses a 153-BGA (11.5x13mm) footprint, while the SM662GAC-BESS uses a 100-BGA (14x18mm) footprint. PCB layout modifications are necessary for substitution.

Q: Are there differences in compliance or environmental ratings?

A: Both components maintain ROHS3 compliance and identical Moisture Sensitivity Level 3 (168 Hours) ratings. No compliance differences exist.

Q: What is the base product number for both parts?

A: Both the SM662GAC-BDSS and SM662GAC-BESS share the base product number SM662, indicating they are variants within the same product family.

Q: Is packaging format a consideration for substitution?

A: The SM662GAC-BESS is supplied in Tray packaging. Packaging format does not affect electrical or functional equivalence but may influence handling and storage procedures.