SM662GAA-BDST Equivalent & Substitute Parts

Part Overview

The SM662GAA-BDST is a 128Gbit eMMC NAND Flash memory IC manufactured by Silicon Motion, Inc., designed for non-volatile storage applications. This component features TLC (Triple-Level Cell) NAND technology in a 100-BGA (14x18) surface mount package. The part is classified as Obsolete, which necessitates identification of functionally equivalent alternatives for ongoing design support and procurement continuity.

Substiute Parts

SM662GAA-BDST

Silicon Motion, Inc.In Stock: 918SM662GAA-BDST Datasheet

Current PartRFQ

SM662GAA-BEST

Silicon Motion, Inc.In Stock: 773SM662GAA-BEST Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM662GAA-BDST is determined by strict equivalence across the following critical parameters:

• Memory Capacity: 128Gbit capacity requirement
• Memory Technology: NAND Flash TLC architecture
• Memory Interface: eMMC protocol compatibility
• Package Configuration: 100-BGA (14x18) form factor
• Memory Organization: 16G x 8 bit organization
• Operating Temperature: -40°C to 85°C range
• Environmental Compliance: ROHS3 certification
• Moisture Sensitivity: MSL 3 rating

The SM662GAA-BEST meets all substitution criteria as a functionally equivalent part within the Ferri-eMMC® series from Silicon Motion, Inc.

Parameter Comparison

Engineering Selection Recommendations

The SM662GAA-BEST is the direct equivalent substitute for the SM662GAA-BDST. Both components share identical electrical and mechanical specifications across all critical parameters. The primary distinction is product status: the SM662GAA-BDST is classified as Obsolete, while the SM662GAA-BEST maintains Active status.

Selection of the SM662GAA-BEST is supported by:

• Full parameter equivalence in memory capacity, technology, interface, and package configuration
• Identical operating temperature range and environmental compliance certifications
• Matching RoHS3 compliance and MSL 3 moisture sensitivity rating
• Availability as an Active product from the same manufacturer and series

Both parts carry identical ECCN and HTSUS classifications, confirming regulatory equivalence.

Frequently Asked Questions (FAQ)

Q: Can the SM662GAA-BEST directly replace the SM662GAA-BDST in existing designs?

A: Yes. The SM662GAA-BEST is electrically and mechanically equivalent to the SM662GAA-BDST across all specified parameters, including memory capacity, interface protocol, package dimensions, and operating conditions.

Q: What is the significance of the product status difference?

A: The SM662GAA-BDST is Obsolete, indicating discontinued production and limited availability. The SM662GAA-BEST is Active, ensuring ongoing manufacturing support and procurement availability.

Q: Are the package dimensions identical?

A: Yes. Both parts use the 100-BGA (14x18) package configuration with identical 100-LBGA case specifications.

Q: Do both parts meet the same environmental and compliance standards?

A: Yes. Both components are ROHS3 compliant, carry MSL 3 moisture sensitivity rating, and share identical ECCN and HTSUS classifications.

Q: Is the eMMC interface protocol identical between these parts?

A: Yes. Both parts implement the eMMC memory interface standard with identical 16G x 8 memory organization.

Q: What is the operating temperature range for both parts?

A: Both the SM662GAA-BDST and SM662GAA-BEST operate across the -40°C to 85°C temperature range.