SM661PX8-AC Equivalent & Substitute Parts

Part Overview

The SM661PX8-AC is a Ferri-eMMC memory IC manufactured by Silicon Motion, Inc., featuring a 153-ball BGA package with 4.5 mm height. This component is classified as obsolete, making identification of suitable substitute parts essential for ongoing system support and production continuity. The part operates within industrial temperature ranges and maintains ROHS3 compliance with Moisture Sensitivity Level 3 rating.

Substiute Parts

SM661PX8-AC

Silicon Motion, Inc.In Stock: 1064SM661PX8-AC Datasheet

Current PartRFQ

SM662PXB BESS

Silicon Motion, Inc.In Stock: 854SM662PXB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SM661PX8-AC is determined by the following critical parameters:

• Manufacturer: Silicon Motion, Inc. (Ferri-eMMC series compatibility)
• Package Type: 153-BGA form factor with matching ball count and pitch
• Memory Interface: eMMC protocol compliance
• RoHS Compliance: ROHS3 Compliant status
• Moisture Sensitivity Level: MSL 3 (168 Hours) rating
• REACH Status: REACH Unaffected classification

The SM662PXB BESS qualifies as a direct substitute based on alignment across all critical parameters. Both components share identical package specifications, compliance certifications, and environmental ratings, enabling functional equivalence in applications requiring Ferri-eMMC memory solutions.

Parameter Comparison

Engineering Selection Recommendations

The SM662PXB BESS is the designated manufacturer-recommended substitute for the obsolete SM661PX8-AC. Selection of this substitute is supported by:

• Compliance Alignment: Both components maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory continuity in regulated applications.
• Package Compatibility: Identical 153-BGA (11.5x13) package specifications enable direct PCB layout compatibility without redesign.
• Environmental Rating: Matching MSL 3 (168 Hours) moisture sensitivity levels ensure equivalent handling and storage requirements.
• Active Product Status: The SM662PXB BESS maintains active production status, providing supply chain continuity and long-term availability compared to the obsolete SM661PX8-AC.
• Memory Technology: Both components utilize FLASH - NAND (SLC) technology with eMMC interface protocol, ensuring functional equivalence in system applications.

Frequently Asked Questions (FAQ)

Q: Can the SM662PXB BESS be used as a direct replacement for SM661PX8-AC in existing designs?

A: Yes. Both components share identical package specifications (153-BGA 11.5x13), compliance certifications (ROHS3, REACH Unaffected), and environmental ratings (MSL 3). No PCB modifications are required for substitution.

Q: What is the primary advantage of selecting SM662PXB BESS over SM661PX8-AC?

A: The SM662PXB BESS maintains active product status with ongoing manufacturer support and supply availability, whereas the SM661PX8-AC is obsolete. This ensures long-term sourcing reliability and technical support continuity.

Q: Are there differences in moisture sensitivity handling between these components?

A: No. Both components carry identical MSL 3 (168 Hours) ratings, requiring equivalent moisture control procedures during storage, handling, and assembly processes.

Q: What compliance certifications apply to both components?

A: Both the SM661PX8-AC and SM662PXB BESS are ROHS3 Compliant and REACH Unaffected, maintaining regulatory compliance for industrial and commercial applications.

Q: Is the operating temperature range identical between both parts?

A: The SM662PXB BESS specifies an operating temperature range of -25°C ~ 85°C. The SM661PX8-AC operating temperature range is not provided in available documentation.