SM661PE8-ACS Equivalent & Substitute Parts

Part Overview

The SM661PE8-ACS is a FERRI-eMMC memory IC manufactured by Silicon Motion, Inc., featuring a 153-ball BGA package with 4.5mm height. This component is classified as a Memory IC and is currently marked as Obsolete product status. Due to its obsolete classification, identifying functionally compatible substitute parts is essential for ongoing system support, design updates, and procurement continuity. The part maintains ROHS3 compliance and REACH unaffected status, with Moisture Sensitivity Level 3 (168 Hours).

Substiute Parts

SM661PE8-ACS
Silicon Motion, Inc.In Stock: 919SM661PE8-ACS Datasheet
SM661PE8-ACS
Current Part
SM662PEB BESS
Silicon Motion, Inc.In Stock: 830SM662PEB BESS Datasheet
SM662PEB BESS
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SM661PE8-ACS
Manufacturer Silicon Motion, Inc.
Category Memory
Description FERRI-eMMC BGA 153-B eMMC 4.5 ML
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS Code 8524.61.0000

Substitute Part Grouping Explanation

The SM662PEB BESS has been identified as a manufacturer-recommended substitute for the SM661PE8-ACS. Substitution eligibility is determined by the following criteria:

  • Manufacturer Consistency: Both parts are manufactured by Silicon Motion, Inc., ensuring design continuity and technical support alignment
  • Product Category: Both components belong to the Memory IC category with eMMC interface technology
  • Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements
  • Moisture Sensitivity: Both parts share MSL 3 (168 Hours) classification, requiring identical handling and storage protocols
  • Export Classification: Both parts carry the same ECCN code (3A991B1A), maintaining consistent export control compliance
  • Series Compatibility: The SM662PEB BESS belongs to the Ferri-eMMC® series, maintaining architectural compatibility with the SM661 base product line

Parameter Comparison

Parameter SM661PE8-ACS (Main Part) SM662PEB BESS (Substitute)
Manufacturer Silicon Motion, Inc. Silicon Motion, Inc.
Category Memory Memory
Memory Type Not Specified Non-Volatile
Memory Format Not Specified FLASH
Technology Not Specified FLASH - NAND (SLC)
Memory Interface eMMC eMMC
Package Type BGA 153-B 100-LBGA (14x18)
Mounting Type Surface Mount Surface Mount
Operating Temperature Not Specified -40°C ~ 85°C
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN Code 3A991B1A 3A991B1A

Engineering Selection Recommendations

The SM662PEB BESS is the manufacturer-recommended substitute for the obsolete SM661PE8-ACS. Selection of this substitute is supported by:

  • Active Product Status: The SM662PEB BESS maintains Active product status, ensuring continued manufacturer support, availability, and technical documentation
  • Regulatory Compliance Continuity: Both parts maintain identical ROHS3 compliance and REACH unaffected status, eliminating compliance re-qualification requirements
  • Handling Protocol Alignment: Identical MSL 3 (168 Hours) ratings ensure no changes to component storage, handling, or assembly procedures
  • Export Control Consistency: Matching ECCN codes (3A991B1A) maintain export compliance frameworks without modification
  • Series Continuity: Both components operate within the Silicon Motion Ferri-eMMC® ecosystem, supporting design architecture consistency

Frequently Asked Questions (FAQ)

Q: Why is the SM661PE8-ACS marked as Obsolete? A: The SM661PE8-ACS has reached end-of-life status within Silicon Motion's product portfolio. The SM662PEB BESS represents the active successor within the Ferri-eMMC® series.

Q: Are there physical package differences between the SM661PE8-ACS and SM662PEB BESS? A: Yes. The SM661PE8-ACS uses a 153-ball BGA package (4.5mm height), while the SM662PEB BESS uses a 100-ball BGA package (14x18mm footprint). PCB layout modifications are required for substitution.

Q: Do both parts require identical handling procedures? A: Yes. Both components share MSL 3 (168 Hours) classification, requiring identical moisture control, storage temperature, and assembly protocols.

Q: Is the eMMC interface compatible between these parts? A: Both parts implement eMMC interface technology. However, the different package configurations (153-BGA vs. 100-BGA) require electrical and mechanical re-qualification at the board level.

Q: What compliance certifications apply to the SM662PEB BESS? A: The SM662PEB BESS maintains ROHS3 compliance, REACH unaffected status, and carries ECCN code 3A991B1A, matching the regulatory framework of the SM661PE8-ACS.

Q: Is the SM662PEB BESS the only available substitute? A: Based on manufacturer recommendations and the provided substitute list, the SM662PEB BESS is the identified equivalent part for the SM661PE8-ACS.

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