SM661PE4-AC Equivalent & Substitute Parts Reference

Part Overview

The SM661PE4-AC is a FERRI-eMMC memory IC manufactured by Silicon Motion, Inc., featuring a 153-ball BGA package with 4.5mm height. This component is classified as a memory IC and is currently marked as obsolete. Due to its discontinued status, identifying functionally equivalent substitute parts is essential for ongoing system support, design updates, and inventory management. The obsolete designation necessitates evaluation of active alternative components that maintain compatibility with existing applications.

Substiute Parts

SM661PE4-AC

Silicon Motion, Inc.In Stock: 750SM661PE4-AC Datasheet

Current PartRFQ

SM662PEB BESS

Silicon Motion, Inc.In Stock: 830SM662PEB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The SM662PEB BESS has been identified as a manufacturer-recommended substitute for the SM661PE4-AC. The substitution is based on the following criteria:

Common Substitution Parameters:

• Manufacturer: Both parts are manufactured by Silicon Motion, Inc.
• Memory Category: Both are classified as memory components
• Technology: Both utilize FLASH - NAND (SLC) technology
• Interface: Both implement eMMC interface protocol
• Compliance: Both maintain ROHS3 compliance and REACH unaffected status
• Regulatory Classification: Both share identical ECCN (3A991B1A) classification
• Moisture Sensitivity: Both rated at MSL 3 (168 Hours)

Key Difference: The SM662PEB BESS features a 100-ball BGA package (14x18mm) compared to the 153-ball BGA of the SM661PE4-AC. This represents a package footprint change that requires PCB layout evaluation during substitution.

Parameter Comparison

Engineering Selection Recommendations

The SM662PEB BESS is the manufacturer-recommended substitute for the obsolete SM661PE4-AC. Both components maintain identical regulatory compliance profiles, including ROHS3 certification and REACH unaffected status. Both share the same ECCN classification (3A991B1A), ensuring consistent export control treatment.

The primary consideration for substitution is the package footprint transition from 153-ball BGA to 100-ball BGA. This change requires PCB layout modification and revalidation of signal integrity and thermal management characteristics. The SM662PEB BESS is currently in active production status, ensuring long-term availability and supply chain stability compared to the obsolete SM661PE4-AC.

Both components utilize identical eMMC interface protocol and FLASH - NAND (SLC) technology, supporting functional compatibility at the system level. The SM662PEB BESS provides 80Gbit memory capacity with specified operating temperature range of -40°C to 85°C.

Frequently Asked Questions (FAQ)

Q: Can the SM662PEB BESS directly replace the SM661PE4-AC without PCB modifications?

A: No. The SM662PEB BESS uses a 100-ball BGA package (14x18mm) while the SM661PE4-AC uses a 153-ball BGA package. PCB layout redesign is required to accommodate the different ball count and footprint dimensions.

Q: Are the regulatory and compliance certifications identical between these parts?

A: Yes. Both components are ROHS3 compliant, REACH unaffected, and share the same ECCN classification (3A991B1A). MSL ratings are identical at level 3 (168 Hours).

Q: What is the primary reason for substitution?

A: The SM661PE4-AC is obsolete and no longer in production. The SM662PEB BESS is the manufacturer-recommended active alternative, ensuring continued availability and supply chain support.

Q: Do both parts use the same memory interface protocol?

A: Yes. Both components implement the eMMC interface protocol and utilize FLASH - NAND (SLC) technology for memory storage.

Q: What are the key differences between these components?

A: The primary differences are package configuration (153-ball vs. 100-ball BGA), product status (obsolete vs. active), and specified memory capacity (80Gbit for the substitute). Both maintain identical compliance certifications and interface protocols.