SM661GE4-AC Equivalent & Substitute Parts

Part Overview

The SM661GE4-AC is a Ferri-eMMC memory IC in 100-ball BGA packaging manufactured by Silicon Motion, Inc. This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement. The part functions as a non-volatile flash memory solution for embedded multimedia card applications. Due to its obsolete status, sourcing equivalent alternatives is necessary for design continuity and production sustainability.

Substiute Parts

SM661GE4-AC

Silicon Motion, Inc.In Stock: 795SM661GE4-AC Datasheet

Current PartRFQ

SM662GEB BESS

Silicon Motion, Inc.In Stock: 1209SM662GEB BESS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SM661GE4-AC is determined by the following critical parameters:

• Manufacturer Alignment: Silicon Motion, Inc. maintains product line continuity within its Ferri-eMMC series
• Package Compatibility: 100-ball BGA (14x18mm) footprint ensures mechanical and electrical pin compatibility
• Memory Interface Standard: eMMC interface protocol compatibility
• Regulatory Compliance: ROHS3 and REACH status alignment
• Moisture Sensitivity Classification: MSL 3 rating consistency for handling and storage requirements

The SM662GEB BESS qualifies as a manufacturer-recommended substitute based on these parameters. Both parts share identical packaging, regulatory compliance status, and moisture sensitivity specifications, enabling direct substitution in applications requiring eMMC memory solutions.

Parameter Comparison

Engineering Selection Recommendations

The SM662GEB BESS is the manufacturer-recommended substitute for the obsolete SM661GE4-AC. Selection of this alternative is supported by:

• Identical Packaging: Both parts utilize 100-ball BGA (14x18mm) configuration, ensuring direct PCB footprint compatibility
• Regulatory Equivalence: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and compliance requirements
• Moisture Handling Parity: Identical MSL 3 classification ensures equivalent handling, storage, and reflow process requirements
• Active Product Status: The SM662GEB BESS maintains active production status, ensuring long-term availability and supply chain stability compared to the obsolete SM661GE4-AC
• Export Classification Alignment: Both parts share identical ECCN classification, maintaining consistency in regulatory documentation and export compliance

Frequently Asked Questions (FAQ)

Q: Can the SM662GEB BESS be used as a direct replacement for the SM661GE4-AC?

A: Yes. Both parts share identical 100-BGA (14x18mm) packaging, eMMC interface protocol, RoHS3 compliance, MSL 3 rating, and REACH status. The SM662GEB BESS is the manufacturer-recommended substitute.

Q: What is the primary reason for substitution?

A: The SM661GE4-AC is classified as obsolete. The SM662GEB BESS maintains active production status, ensuring component availability and supply chain continuity.

Q: Are there any differences in handling or storage requirements?

A: No. Both parts carry identical Moisture Sensitivity Level 3 (168 Hours) classification, requiring the same handling procedures, storage conditions, and reflow process parameters.

Q: Does the substitute part maintain the same regulatory compliance?

A: Yes. Both parts are ROHS3 compliant, REACH unaffected, and share identical ECCN classification (3A991B1A), ensuring equivalent regulatory standing.

Q: What memory specifications does the SM662GEB BESS provide?

A: The SM662GEB BESS offers 80Gbit capacity with 10G x 8 memory organization, utilizing FLASH-NAND (SLC) technology with eMMC interface protocol and operating temperature range of -40°C to 85°C.

Q: Are there any packaging differences between the two parts?

A: No. Both parts use identical 100-LBGA packaging with 14x18mm dimensions, ensuring mechanical and electrical compatibility without PCB redesign.