SLW5S-1C7LF Equivalent & Substitute Parts

Part Overview

The SLW5S-1C7LF is a 5-position FFC/FPC vertical connector manufactured by Amphenol ICC (FCI) with 1.00mm pitch and through-hole mounting. This part is currently obsolete, making substitute components necessary for new designs and ongoing production requirements. The connector features Zero Insertion Force (ZIF) operation, tin-plated phosphor bronze contacts, and polyamide housing rated for UL94 V-0 flammability.

Substiute Parts

SLW5S-1C7LF

Amphenol ICC (FCI)In Stock: 1186SLW5S-1C7LF Datasheet

Current PartRFQ

HLW5S-2C7LF

Amphenol ICC (FCI)In Stock: 1013HLW5S-2C7LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SLW5S-1C7LF is determined by the following critical parameters:

• Position Count: 5 positions (fixed requirement)
• Pitch: 0.039" (1.00mm) (fixed requirement)
• Mounting Type: Through Hole (fixed requirement)
• Connector Orientation: Vertical - 1 Sided (fixed requirement)
• Voltage Rating: 100V minimum (fixed requirement)
• Current Rating: 1A minimum (fixed requirement)
• Operating Temperature Range: -55°C ~ 85°C (fixed requirement)
• Flammability Rating: UL94 V-0 (fixed requirement)
• Contact Material: Phosphor Bronze with Tin finish (fixed requirement)
• Termination Type: Kinked Pin (fixed requirement)
• FFC/FPC Thickness: 0.33mm (fixed requirement)

The HLW5S-2C7LF meets all critical electrical and mechanical parameters required for direct substitution. Variations in housing material (PBT vs. Polyamide), height above board (5.90mm vs. 5.50mm), mating cycles (30 vs. 20), and locking features do not prevent functional equivalence when the core parameters align.

Parameter Comparison

Engineering Selection Recommendations

The HLW5S-2C7LF is the direct substitute for the obsolete SLW5S-1C7LF. Both components share identical electrical specifications, contact materials, termination methods, and flammability ratings. The HLW5S-2C7LF carries Active product status, ensuring continued availability and manufacturing support.

The HLW5S-2C7LF provides enhanced durability with 30 mating cycles compared to 20 cycles for the original part. The increased height above board (5.90mm vs. 5.50mm) and PBT housing material (versus polyamide) represent design improvements that maintain full electrical and mechanical compatibility. Both parts are RoHS compliant and suitable for applications requiring UL94 V-0 flammability certification.

Frequently Asked Questions (FAQ)

Q: Can the HLW5S-2C7LF directly replace the SLW5S-1C7LF in existing designs?

A: Yes. Both connectors share identical position count, pitch, voltage rating, current rating, operating temperature range, contact materials, and termination type. The electrical and mechanical interfaces are fully compatible.

Q: What is the significance of the height difference (5.50mm vs. 5.90mm)?

A: The HLW5S-2C7LF has a 0.40mm greater height above the PCB. This difference must be verified against available board space in your application. If vertical clearance is constrained, this parameter requires design review.

Q: Why does the HLW5S-2C7LF have 30 mating cycles instead of 20?

A: The HLW5S-2C7LF incorporates design improvements that extend connector durability. This provides additional reliability margin for applications with frequent mating and unmating cycles.

Q: Are there differences in housing material between these parts?

A: Yes. The SLW5S-1C7LF uses polyamide (PA) nylon with glass fill, while the HLW5S-2C7LF uses polybutylene terephthalate (PBT) with glass fill. Both materials meet UL94 V-0 flammability requirements and maintain electrical performance specifications.

Q: Is the HLW5S-2C7LF available in production quantities?

A: Yes. The HLW5S-2C7LF carries Active product status with current inventory availability, unlike the obsolete SLW5S-1C7LF.

Q: Do both parts require the same PCB footprint?

A: The through-hole termination, position count, and 1.00mm pitch are identical, ensuring PCB footprint compatibility. The increased height above board does not affect footprint dimensions but may impact component placement in high-density layouts.