SL2ICS5311EW/V7,00 Equivalent & Substitute Parts

Part Overview

The SL2ICS5311EW/V7,00 is an RFID Transponder IC operating at 14.66MHz, designed for EPC and ISO 15693 applications in die form. This component is classified as obsolete, making identification of active equivalent parts essential for ongoing design support and procurement continuity. The transition to active substitute parts ensures access to current inventory and manufacturer support.

Substiute Parts

SL2ICS5311EW/V7,00

NXP SemiconductorsIn Stock: 1095SL2ICS5311EW/V7,00 Datasheet

Current PartRFQ

SL2S5302FUD,003

NXP USA Inc.In Stock: 1160SL2S5302FUD,003 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SL2ICS5311EW/V7,00 is determined by the following critical parameters:

• Operating Frequency: 14.66MHz (required match)
• Package Type: Die form (required match)
• Mounting Type: Surface Mount (required match)
• Supported Standards: ISO 15693 compatibility (minimum requirement)
• Product Status: Active status (ensures ongoing availability)
• RoHS Compliance: ROHS3 Compliant (regulatory requirement match)

The substitute part SL2S5302FUD,003 meets all substitution criteria. It maintains the same 14.66MHz frequency, die package configuration, and surface mount capability. The substitute supports ISO 15693 and ISO 18000-3 standards, providing equivalent or enhanced protocol support. Both parts are manufactured by NXP and maintain ROHS3 compliance.

Parameter Comparison

Engineering Selection Recommendations

The SL2S5302FUD,003 is the qualified substitute for the obsolete SL2ICS5311EW/V7,00. Selection is based on:

• Frequency Equivalence: Both operate at 14.66MHz, ensuring RF compatibility
• Package Compatibility: Die form with surface mount capability maintains assembly process compatibility
• Standards Alignment: ISO 15693 support in the substitute ensures protocol compatibility with the original part
• Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status
• Availability: The substitute is active and currently in stock, providing procurement continuity
• Manufacturer Continuity: Both parts are NXP products, ensuring design consistency and technical support

Frequently Asked Questions (FAQ)

Q: Can SL2S5302FUD,003 directly replace SL2ICS5311EW/V7,00 in existing designs?

A: Yes. Both parts operate at 14.66MHz in die form with surface mount configuration. The substitute supports ISO 15693, which is common to both parts. Verify that your application does not require EPC-specific features exclusive to the original part.

Q: What is the difference in standards support between these parts?

A: The original part supports EPC and ISO 15693. The substitute supports ISO 15693 and ISO 18000-3. ISO 15693 is the common standard. If your application requires EPC-only operation, confirm compatibility with the substitute's standard set.

Q: Are there packaging differences between these die parts?

A: Both parts are supplied as dies in surface mount configuration. The original part specifies wafer-level supply, while the substitute is supplied in bulk packaging. For die-level integration, confirm your assembly process accommodates the substitute's packaging format.

Q: What are the voltage and temperature specifications for the substitute?

A: The substitute operates at 1.5V to 1.7V supply voltage with an operating temperature range of -40°C to 85°C. The original part does not specify these parameters. Confirm your application requirements align with the substitute's specifications.

Q: Why is the original part obsolete?

A: Product obsolescence is determined by the manufacturer. The substitute represents the current active equivalent from NXP, ensuring access to ongoing inventory and technical support.