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SK22-TP Schottky Diode Equivalent & Substitute Parts
Part Overview
The SK22-TP is a 20V, 2A Schottky rectifier diode manufactured by Micro Commercial Co in a DO-214AA (SMB) surface mount package. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and production requirements. Substitute parts must maintain electrical performance across reverse voltage, forward current, and thermal operating ranges while conforming to the same package and mounting specifications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 20 | V |
| Current - Average Rectified (Io) | 2 | A |
| Voltage - Forward (Vf) (Max) @ If | 550 mV @ 2 A | mV |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | ns |
| Current - Reverse Leakage @ Vr | 500 µA @ 20 V | µA |
| Package / Case | DO-214AA, SMB | — |
| Mounting Type | Surface Mount | — |
| Operating Temperature - Junction | -55°C ~ 125°C | °C |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution eligibility for the SK22-TP is determined by the following critical parameters:
Mandatory Matching Criteria:
- Voltage - DC Reverse (Vr) (Max): 20 V
- Current - Average Rectified (Io): 2 A
- Package / Case: DO-214AA, SMB
- Mounting Type: Surface Mount
- Technology: Schottky
- Speed: Fast Recovery ≤ 500ns, > 200mA (Io)
Allowable Variation Ranges:
- Voltage - Forward (Vf) (Max) @ If: 440 mV to 550 mV @ 2 A
- Current - Reverse Leakage @ Vr: 400 µA to 500 µA @ 20 V
- Operating Temperature - Junction: Minimum -55°C, Maximum 125°C or higher
- Capacitance @ Vr, F: 150 pF to 230 pF @ 4V, 1MHz (where specified)
All identified substitute parts meet these criteria and maintain functional equivalence within the specified electrical and thermal operating envelope.
Parameter Comparison
| Parameter | SK22-TP (Main) | B220-13-F | CMSH2-20 TR13 PBFREE | SL22-E3/52T | SS22-E3/5BT | SS22T3G |
|---|---|---|---|---|---|---|
| Manufacturer | Micro Commercial Co | Diodes Incorporated | Central Semiconductor Corp | Vishay General Semiconductor | Vishay General Semiconductor | onsemi |
| Voltage - DC Reverse (Vr) (Max) | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| Current - Average Rectified (Io) | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A |
| Voltage - Forward (Vf) (Max) @ If | 550 mV @ 2 A | 500 mV @ 2 A | 500 mV @ 2 A | 440 mV @ 2 A | 500 mV @ 2 A | 500 mV @ 2 A |
| Speed | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA |
| Current - Reverse Leakage @ Vr | 500 µA @ 20 V | 500 µA @ 20 V | 500 µA @ 20 V | 400 µA @ 20 V | 400 µA @ 20 V | 400 µA @ 40 V |
| Capacitance @ Vr, F | 230 pF @ 4V, 1MHz | 200 pF @ 4V, 1MHz | 150 pF @ 4V, 1MHz | Not specified | Not specified | Not specified |
| Package / Case | DO-214AA, SMB | DO-214AA, SMB | DO-214AA, SMB | DO-214AA, SMB | DO-214AA, SMB | DO-214AA, SMB |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature - Junction | -55°C ~ 125°C | -65°C ~ 150°C | -65°C ~ 150°C | -55°C ~ 125°C | -65°C ~ 125°C | -55°C ~ 150°C |
| Product Status | Obsolete | Active | Active | Active | Active | Last Time Buy |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
Active Production Status: B220-13-F (Diodes Incorporated), CMSH2-20 TR13 PBFREE (Central Semiconductor Corp), SL22-E3/52T (Vishay General Semiconductor), and SS22-E3/5BT (Vishay General Semiconductor) are all classified as Active products and represent the primary substitution options for the obsolete SK22-TP. These parts maintain full electrical equivalence and are supported by current manufacturing processes.
Last Time Buy Status: SS22T3G (onsemi) is designated as Last Time Buy. This classification indicates limited future availability and should be selected only when other active alternatives are unavailable or when existing inventory commitments require continuation.
Compliance Certification: All substitute parts maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity ratings, ensuring compatibility with current manufacturing and environmental standards. REACH status is unaffected across all options.
Forward Voltage Performance: SL22-E3/52T exhibits the lowest forward voltage specification at 440 mV @ 2 A, compared to the SK22-TP specification of 550 mV @ 2 A. This represents improved efficiency characteristics. All other substitutes specify 500 mV @ 2 A, which remains within acceptable operating parameters.
Reverse Leakage Characteristics: SL22-E3/52T, SS22-E3/5BT, and SS22T3G demonstrate reduced reverse leakage at 400 µA @ 20 V, compared to the SK22-TP specification of 500 µA @ 20 V. This represents improved leakage performance.
Temperature Operating Range: B220-13-F and CMSH2-20 TR13 PBFREE extend the maximum junction temperature to 150°C, providing enhanced thermal margin. SL22-E3/52T maintains the original -55°C to 125°C range. SS22-E3/5BT and SS22T3G offer intermediate thermal specifications.
Frequently Asked Questions (FAQ)
Q: Can SK22-TP be directly replaced with any of the listed substitutes?
A: Yes. All listed substitute parts maintain the mandatory electrical parameters: 20 V reverse voltage, 2 A average rectified current, DO-214AA SMB package, and surface mount configuration. Direct PCB-level substitution is supported without circuit modification.
Q: What is the significance of the forward voltage differences between substitutes?
A: Forward voltage variations (440 mV to 550 mV @ 2 A) fall within the acceptable operating envelope for Schottky rectifier applications. Lower forward voltage values (SL22-E3/52T at 440 mV) result in reduced power dissipation and improved efficiency. Selection should be based on thermal design requirements and power budget constraints.
Q: Are there packaging differences between the substitute parts?
A: All substitute parts use the DO-214AA (SMB) surface mount package. Packaging format variations exist between Cut Tape (CT) & Digi-Reel® and Tape & Reel (TR) options. These represent supply chain and handling differences only and do not affect electrical performance or PCB compatibility.
Q: Why is SS22T3G marked as Last Time Buy?
A: Last Time Buy designation indicates that onsemi has announced end-of-life for this product. Existing inventory is available, but future production is not planned. This part should be selected only when other active alternatives are constrained or when existing design commitments require continuation.
Q: Do the substitute parts meet the same compliance standards as SK22-TP?
A: Yes. All substitute parts are ROHS3 compliant, REACH unaffected, and carry MSL 1 (Unlimited) moisture sensitivity ratings, matching the SK22-TP compliance profile.
Q: What is the impact of reverse leakage current differences?
A: Reverse leakage variations (400 µA to 500 µA @ 20 V) are within normal Schottky diode operating parameters. Lower leakage values (400 µA) represent improved performance characteristics and reduced standby power consumption. Selection impact is application-dependent and typically negligible in most rectification circuits.
Q: Can substitutes be mixed within a single design or production run?
A: Yes. All substitute parts maintain electrical equivalence within specified parameters. Mixed sourcing is supported from a functional standpoint. Supply chain and procurement considerations should be evaluated separately.
Q: What is the operating temperature range consideration for substitute selection?
A: The SK22-TP operates from -55°C to 125°C. Substitute parts offer equivalent or extended ranges. B220-13-F and CMSH2-20 TR13 PBFREE extend to 150°C maximum, providing additional thermal margin. Selection should align with application thermal requirements and system design specifications.
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