SIP1X32-014BLF Equivalent & Substitute Parts

Part Overview

The SIP1X32-014BLF is a 32-position SIP (Single In-line Package) socket manufactured by Amphenol ICC (FCI). This through-hole component features tin-plated beryllium copper mating contacts and brass post contacts, designed for IC and transistor socket applications. The part is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and component procurement.

Substiute Parts

SIP1X32-014BLF

Amphenol ICC (FCI)In Stock: 1109SIP1X32-014BLF Datasheet

Current PartRFQ

310-43-132-41-001000

Mill-Max Manufacturing Corp.In Stock: 867310-43-132-41-001000 Datasheet

MFR RecommendedRFQ

319-10-164-00-001000

Mill-Max Manufacturing Corp.In Stock: 1019319-10-164-00-001000 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the SIP1X32-014BLF is determined by the following critical parameters:

• Number of Positions: 32 positions required
• Pitch - Mating: 0.100" (2.54mm) standard spacing
• Mounting Type: Through hole configuration
• Termination: Solder termination
• Contact Material - Mating: Beryllium copper or equivalent
• Flammability Rating: UL94 V-0 compliance
• Moisture Sensitivity: MSL 1 (Unlimited)

The substitute parts listed below meet these core electrical and mechanical parameters. The first substitute (310-43-132-41-001000) is a receptacle connector with matching pitch and position count. The second substitute (319-10-164-00-001000) is a spring mating target with doubled position count (64 positions) at the same pitch, suitable for applications requiring expanded contact density at identical spacing.

Parameter Comparison

Engineering Selection Recommendations

310-43-132-41-001000 is the primary substitute for direct replacement applications. This part maintains the 32-position, 0.100" pitch configuration and through-hole solder termination of the original SIP1X32-014BLF. Both parts share UL94 V-0 flammability compliance and MSL 1 rating. The substitute is manufactured by Mill-Max and carries active product status with ROHS3 compliance, providing long-term availability and regulatory alignment. The contact finish differs (gold versus tin), which may affect contact resistance characteristics in specific applications.

319-10-164-00-001000 is applicable only in applications where increased contact density is acceptable. This 64-position spring mating target maintains the 0.100" pitch but doubles the position count. This part is suitable for designs that can accommodate the expanded contact array while maintaining the same pitch spacing. Product status is active with ROHS3 compliance.

Frequently Asked Questions (FAQ)

Q: Can 310-43-132-41-001000 be used as a direct replacement for SIP1X32-014BLF?

A: Yes, for applications requiring 32 positions at 0.100" pitch with through-hole solder termination. Both parts meet UL94 V-0 and MSL 1 specifications. The contact finish difference (gold versus tin) should be evaluated for your specific electrical requirements.

Q: What is the key difference between the two substitute parts?

A: 310-43-132-41-001000 maintains the 32-position configuration of the original part. 319-10-164-00-001000 provides 64 positions at the same 0.100" pitch, suitable only for applications where additional contact positions are required and the expanded footprint is acceptable.

Q: Are both substitute parts actively manufactured?

A: Yes. Both 310-43-132-41-001000 and 319-10-164-00-001000 carry active product status from Mill-Max Manufacturing Corp., ensuring ongoing availability and supply chain stability.

Q: How does the gold contact finish of the substitutes compare to the tin finish of the original?

A: Gold plating provides superior corrosion resistance and lower contact resistance compared to tin. The gold-plated substitutes are suitable for applications where enhanced reliability and lower insertion force are beneficial.

Q: Are the substitute parts RoHS compliant?

A: Yes. Both substitute parts are ROHS3 compliant, meeting current regulatory requirements for electronic component manufacturing and distribution.