SIP1X16-014BLF Equivalent & Substitute Parts

Part Overview

The SIP1X16-014BLF is a 16-position single in-line (SIP) socket connector manufactured by Amphenol ICC (FCI). This through-hole component features tin-plated beryllium copper mating contacts and brass posts, designed for IC and transistor socket applications. The product is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement.

Substiute Parts

SIP1X16-014BLF
Amphenol ICC (FCI)In Stock: 785SIP1X16-014BLF Datasheet
SIP1X16-014BLF
Current Part
319-10-164-00-001000
Mill-Max Manufacturing Corp.In Stock: 1019319-10-164-00-001000 Datasheet
319-10-164-00-001000
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SIP1X16-014BLF
Manufacturer Amphenol ICC (FCI)
Category Sockets for ICs, Transistors
Type SIP Socket
Number of Positions 16 (1 x 16)
Pitch - Mating 0.100" (2.54mm)
Pitch - Post 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Termination Post Length 0.125" (3.18mm)
Flammability Rating UL94 V-0
Product Status Obsolete
Moisture Sensitivity Level 1 (Unlimited)
RoHS Status Not specified

Substitute Part Grouping Explanation

Substitution of the SIP1X16-014BLF is based on the following critical parameters that must align for functional equivalence:

  • Pitch (Mating and Post): 0.100" (2.54mm) — determines PCB footprint compatibility
  • Mounting Type: Through Hole — required for board assembly method
  • Contact Configuration: Single row arrangement — maintains spatial compatibility
  • Contact Material and Finish: Tin-plated contacts — ensures electrical performance and solderability
  • Termination Method: Solder — compatible with standard PCB assembly processes

The identified substitute part, 319-10-164-00-001000 from Mill-Max Manufacturing Corp., shares the critical pitch specification (0.100" / 2.54mm) and through-hole mounting type. However, this part functions as a spring mating target connector with 64 positions, representing a different connector category and contact architecture compared to the original SIP socket design.

Parameter Comparison

Parameter SIP1X16-014BLF (Main Part) 319-10-164-00-001000 (Substitute)
Manufacturer Amphenol ICC (FCI) Mill-Max Manufacturing Corp.
Connector Type SIP Socket Spring Mating Target
Number of Positions/Contacts 16 64
Pitch 0.100" (2.54mm) 0.100" (2.54mm)
Number of Rows 1 1
Mounting Type Through Hole Through Hole
Contact Material Beryllium Copper (mating), Brass (post) Brass Alloy
Contact Finish Tin Gold
Product Status Obsolete Active
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99

Engineering Selection Recommendations

The SIP1X16-014BLF is an obsolete product, necessitating alternative component identification for new procurement and system maintenance. The substitute part 319-10-164-00-001000 maintains compatibility in critical mechanical parameters: both components feature 0.100" (2.54mm) pitch spacing and through-hole mounting architecture.

Key considerations for selection:

  • Product Status: The substitute part is active and currently available, addressing supply chain continuity for the obsolete SIP1X16-014BLF.
  • Compliance: Both parts carry EAR99 export classification and MSL 1 moisture sensitivity rating, indicating equivalent handling and storage requirements.
  • Contact Architecture: The substitute employs a spring mating target design with gold-plated contacts, differing from the original tin-plated socket design. This architectural difference requires verification of mechanical and electrical compatibility within the specific application context.
  • Position Count: The substitute provides 64 positions compared to the original 16 positions, necessitating careful evaluation of board layout and connector footprint requirements.

Frequently Asked Questions (FAQ)

Q: Can the 319-10-164-00-001000 directly replace the SIP1X16-014BLF in existing designs?

A: Both components share 0.100" (2.54mm) pitch spacing and through-hole mounting, establishing mechanical compatibility at the footprint level. However, the substitute features a different connector type (spring mating target versus socket), different contact count (64 versus 16), and different contact finish (gold versus tin). Application-specific verification is required.

Q: What is the significance of the pitch specification in connector substitution?

A: Pitch determines the spacing between contact positions and directly defines the PCB footprint. Both the main part and substitute maintain 0.100" (2.54mm) pitch, ensuring compatibility with existing board layouts designed for this standard spacing.

Q: How do contact finish differences affect substitution?

A: The main part features tin-plated contacts; the substitute features gold-plated contacts. Contact finish influences solderability, corrosion resistance, and electrical performance. Gold plating typically provides superior corrosion resistance and contact reliability compared to tin plating.

Q: What does MSL 1 (Unlimited) moisture sensitivity mean?

A: MSL 1 indicates the component has unlimited shelf life and requires no special moisture control during storage or handling. Both the main part and substitute carry this rating, indicating equivalent moisture sensitivity characteristics.

Q: Why is the substitute part listed as active while the main part is obsolete?

A: Product status reflects current manufacturer support and availability. The substitute's active status indicates ongoing production and availability through authorized distributors, addressing supply continuity for applications requiring 0.100" pitch through-hole connectors.

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