SIP1X13-001BLF Equivalent & Substitute Parts

Part Overview

The SIP1X13-001BLF is a 13-position SIP socket manufactured by Amphenol ICC (FCI), designed for through-hole mounting applications. This component features gold-plated beryllium copper mating contacts with tin-plated brass posts, housed in a polyphenylene sulfide (PPS) glass-filled frame rated UL94 V-0. The product is classified as obsolete, necessitating identification of active equivalent components to maintain design continuity and ensure procurement availability for new production runs and field replacements.

Substiute Parts

SIP1X13-001BLF
Amphenol ICC (FCI)In Stock: 1091SIP1X13-001BLF Datasheet
SIP1X13-001BLF
Current Part
310-43-113-41-001000
Mill-Max Manufacturing Corp.In Stock: 846310-43-113-41-001000 Datasheet
310-43-113-41-001000
MFR Recommended
319-10-164-00-001000
Mill-Max Manufacturing Corp.In Stock: 1019319-10-164-00-001000 Datasheet
319-10-164-00-001000
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SIP1X13-001BLF
Manufacturer Amphenol ICC (FCI)
Category Sockets for ICs, Transistors
Product Status Obsolete
Type SIP
Number of Positions 13 (1 x 13)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Termination Solder
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating UL94 V-0
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Substitute Part Grouping Explanation

Substitution eligibility for the SIP1X13-001BLF is determined by the following critical parameters:

Primary Matching Criteria:

  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Termination: Solder
  • Material Flammability Rating: UL94 V-0
  • Moisture Sensitivity Level: 1 (Unlimited)
  • REACH Status: REACH Unaffected

Substitute Parts Identified:

310-43-113-41-001000 (Mill-Max Manufacturing Corp.) qualifies as a functional equivalent. This 13-position receptacle connector maintains identical mating pitch (0.100"), gold contact finish, beryllium copper mating contacts, through-hole solder termination, UL94 V-0 flammability rating, and MSL 1 classification. The component is active in production status.

319-10-164-00-001000 (Mill-Max Manufacturing Corp.) does not qualify as a direct substitute. While this spring mating target connector shares the 0.100" pitch, gold contact finish, through-hole mounting, and UL94 V-0 rating, it is specified for 64 positions rather than 13 positions. The contact count mismatch and different connector type (mating target versus socket) preclude functional equivalence for applications requiring a 13-position SIP socket.

Parameter Comparison

Parameter SIP1X13-001BLF 310-43-113-41-001000 319-10-164-00-001000
Manufacturer Amphenol ICC (FCI) Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp.
Product Status Obsolete Active Active
Number of Positions 13 (1 x 13) 13 64
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Brass Alloy
Mounting Type Through Hole Through Hole Through Hole
Termination Solder Solder Solder
Material Flammability Rating UL94 V-0 UL94 V-0 UL94 V-0
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

310-43-113-41-001000 is the qualified substitute for SIP1X13-001BLF applications. This component maintains all critical electrical and mechanical parameters: 13-position configuration, 0.100" mating pitch, gold-plated beryllium copper contacts, through-hole solder termination, and UL94 V-0 flammability compliance. The substitute is active in production status, ensuring long-term procurement availability. Both components share identical MSL 1 classification and REACH unaffected status. The substitute additionally provides ROHS3 compliance certification.

319-10-164-00-001000 is not suitable for direct substitution. The 64-position contact count and mating target connector type are incompatible with applications designed for a 13-position SIP socket. Selection of this component would require complete circuit redesign and PCB layout modification.

Frequently Asked Questions (FAQ)

Q: Can 310-43-113-41-001000 be used as a direct replacement for SIP1X13-001BLF?

A: Yes. Both components share identical position count (13), mating pitch (0.100"), contact finish (gold), contact material (beryllium copper), mounting type (through hole), solder termination, and UL94 V-0 flammability rating. The substitute is active in production, addressing the obsolescence status of the original component.

Q: Why is 319-10-164-00-001000 listed if it cannot substitute?

A: This component is included in the provided substitute list but does not meet substitution criteria. The 64-position configuration and mating target connector type are fundamentally incompatible with the 13-position SIP socket requirement. Position count mismatch alone disqualifies this component from functional equivalence.

Q: What are the critical parameters for SIP socket substitution?

A: Position count, mating pitch, contact finish, contact material, mounting type, and termination method are the primary determinants. For the SIP1X13-001BLF, all substitute candidates must maintain 13 positions, 0.100" pitch, gold finish, beryllium copper contacts, through-hole mounting, and solder termination.

Q: Are there compliance differences between the original and substitute?

A: Both components maintain REACH unaffected and MSL 1 status. The substitute (310-43-113-41-001000) provides additional ROHS3 compliance certification, which may be advantageous for applications subject to RoHS directives.

Q: What is the contact finish thickness difference between components?

A: SIP1X13-001BLF and 310-43-113-41-001000 both specify 30.0µin (0.76µm) mating contact finish thickness. The 319-10-164-00-001000 specifies 10.0µin (0.25µm), which is not relevant due to position count incompatibility.

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