SIP050-1X29-160BLF Equivalent & Substitute Parts

Part Overview

The SIP050-1X29-160BLF is a 29-position SIP (Single In-line Package) socket manufactured by Amphenol ICC (FCI). This through-hole connector features gold-plated mating contacts and tin-plated brass posts, designed for IC and transistor socket applications. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

Substiute Parts

SIP050-1X29-160BLF
Amphenol ICC (FCI)In Stock: 786SIP050-1X29-160BLF Datasheet
SIP050-1X29-160BLF
Current Part
346-43-129-41-013000
Mill-Max Manufacturing Corp.In Stock: 1004346-43-129-41-013000 Datasheet
346-43-129-41-013000
MFR Recommended
SL-129-G-12
Samtec Inc.In Stock: 879SL-129-G-12 Datasheet
SL-129-G-12
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number SIP050-1X29-160BLF
Manufacturer Amphenol ICC (FCI)
Category Sockets for ICs, Transistors
Type SIP
Number of Positions 29 (1 x 29)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Termination Solder
Product Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the SIP050-1X29-160BLF are identified based on the following critical parameters that determine functional compatibility:

Primary Matching Criteria:

  • Number of positions: 29 (1 x 29)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact finish - Mating: Gold
  • Contact material - Mating: Beryllium Copper
  • Mounting type: Through Hole
  • Moisture Sensitivity Level: 1 (Unlimited)

Acceptable Variations:

  • Termination method: Solder or Press-Fit
  • Contact finish - Post: Tin or Gold
  • Housing material: PCT/Polyester variants
  • Operating temperature range (when specified)
  • Product status: Active substitutes preferred for obsolete parts

The two identified substitutes meet these core electrical and mechanical requirements while offering active product status and improved availability.

Parameter Comparison

Parameter SIP050-1X29-160BLF (Main) 346-43-129-41-013000 (Mill-Max) SL-129-G-12 (Samtec)
Manufacturer Amphenol ICC (FCI) Mill-Max Manufacturing Corp. Samtec Inc.
Product Status Obsolete Active Active
Number of Positions 29 (1 x 29) 29 (1 x 29) 29
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm) 30.0µin (0.76µm) 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper Beryllium Copper Beryllium Copper
Mounting Type Through Hole Through Hole Through Hole
Termination Solder Press-Fit Solder
Contact Finish - Post Tin Tin Gold
Contact Finish Thickness - Post 200.0µin (5.08µm) 200.0µin (5.08µm) 10.0µin (0.25µm)
Termination Post Length 0.095" (2.41mm) 0.175" (4.45mm) 0.095" (2.41mm)
Operating Temperature Not specified -55°C ~ 125°C -55°C ~ 125°C
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

346-43-129-41-013000 (Mill-Max Manufacturing Corp.)

This substitute maintains identical mating contact specifications and pitch geometry. The press-fit termination method provides an alternative to solder attachment, suitable for applications where soldering is not preferred. The longer termination post length (0.175" vs. 0.095") must be verified against PCB design specifications. Active product status and ROHS3 compliance support long-term availability and regulatory requirements.

SL-129-G-12 (Samtec Inc.)

This substitute provides identical mating contact specifications and pitch geometry with solder termination matching the original design. The gold-plated post finish differs from the tin-plated original but maintains electrical compatibility. Samtec's active product status and ROHS3 compliance ensure continued availability. The identical termination post length (0.095") provides direct mechanical compatibility with existing PCB designs.

Both substitutes satisfy the core electrical and mechanical requirements for 29-position, 0.100" pitch through-hole socket applications with gold-plated beryllium copper mating contacts.

Frequently Asked Questions (FAQ)

Q: Can the 346-43-129-41-013000 be used as a direct replacement for the SIP050-1X29-160BLF?

A: The 346-43-129-41-013000 matches all critical electrical parameters and mating contact specifications. However, the longer termination post length (0.175" vs. 0.095") requires verification against PCB hole depth and design specifications. The press-fit termination method differs from the original solder attachment and must be compatible with assembly processes.

Q: What is the primary difference between the two substitute options?

A: The 346-43-129-41-013000 uses press-fit termination with longer posts, while the SL-129-G-12 uses solder termination with post length matching the original design. The SL-129-G-12 provides closer mechanical compatibility for existing PCB layouts.

Q: Are both substitutes compliant with current regulatory standards?

A: Both substitutes are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements. The original SIP050-1X29-160BLF regulatory status was not specified in available documentation.

Q: Does the gold post finish on the SL-129-G-12 affect compatibility?

A: The gold post finish on the SL-129-G-12 maintains electrical compatibility with the tin-plated original. Both finishes are suitable for solder attachment and provide equivalent contact resistance characteristics for through-hole applications.

Q: What is the significance of the MSL rating for these components?

A: All three parts carry MSL 1 (Unlimited) rating, indicating no moisture sensitivity restrictions. These components do not require special moisture control during storage, handling, or assembly.

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