SI8235AB-AM1 Equivalent & Substitute Parts

Part Overview

The SI8235AB-AM1 is a 4A gate driver with capacitive coupling isolation rated for 2500Vrms, designed for two-channel isolated gate drive applications in automotive-grade systems. This device features a 14-QFN (5x5) surface mount package and operates across the -40°C to 125°C temperature range with AEC-Q100 qualification.

The SI8235AB-AM1 is designated as Last Time Buy, indicating that this specific part number will no longer be manufactured. Identification of equivalent substitute parts is necessary to ensure continued availability and design continuity for new production and maintenance applications.

Substiute Parts

SI8235AB-AM1

Skyworks Solutions Inc.In Stock: 678SI8235AB-AM1 Datasheet

Current PartRFQ

SI8235AB-AM

Skyworks Solutions Inc.In Stock: 1095SI8235AB-AM Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SI8235AB-AM1 is determined by equivalence across the following critical parameters:

Electrical Equivalence Criteria:

• Capacitive coupling isolation technology
• 2500Vrms isolation voltage rating
• 2-channel configuration
• 20kV/µs common mode transient immunity
• 4A peak output current capability
• 2A/4A output high/low current ratings
• 6.5V to 24V output supply voltage range
• 45ns maximum propagation delay (both rising and falling edges)
• 5.6ns maximum pulse width distortion
• 12ns typical rise and fall time

Mechanical and Environmental Equivalence Criteria:

• Surface mount package technology
• Automotive-grade qualification (AEC-Q100)
• Operating temperature range of -40°C to 125°C
• Multi-agency approval (CQC, CSA, UL, VDE)

The SI8235AB-AM1 (14-QFN package) and SI8235AB-AM (14-LGA package) share identical electrical specifications and automotive qualifications. The primary difference is the package form factor: QFN versus LGA. Both packages are 5x5mm surface mount configurations suitable for equivalent PCB layout implementations.

Parameter Comparison

Engineering Selection Recommendations

The SI8235AB-AM serves as the direct electrical and functional equivalent to the SI8235AB-AM1. Both devices are manufactured by Skyworks Solutions Inc. and maintain identical electrical performance specifications across all critical parameters including isolation voltage, output current ratings, propagation delay, and timing characteristics.

Compliance and Certification: Both parts carry automotive-grade qualification with multi-agency approvals (CQC, CSA, UL, VDE), ensuring suitability for automotive applications requiring high-reliability isolated gate drive functionality.

Product Status Consideration: The SI8235AB-AM1 is designated Last Time Buy, while the SI8235AB-AM maintains Active product status. This status difference indicates that the SI8235AB-AM will continue to be manufactured and supported by Skyworks Solutions Inc., making it the appropriate selection for new designs and ongoing production requirements.

Package Form Factor: The primary distinction between these parts is the package technology: the SI8235AB-AM1 uses a 14-QFN (Quad Flat No-lead) package, while the SI8235AB-AM uses a 14-LGA (Land Grid Array) package. Both packages maintain identical 5x5mm footprint dimensions and surface mount mounting type. PCB layout modifications are required to accommodate the different pad configurations between QFN and LGA packages.

Frequently Asked Questions (FAQ)

Q: Are the SI8235AB-AM1 and SI8235AB-AM electrically identical?

A: Yes. Both devices share identical electrical specifications including 2500Vrms isolation voltage, 4A peak output current, 20kV/µs common mode transient immunity, 45ns propagation delay, and 5.6ns pulse width distortion. They operate across the same -40°C to 125°C temperature range and support the same 6.5V to 24V output supply voltage.

Q: What is the difference between the QFN and LGA packages?

A: The SI8235AB-AM1 uses a 14-QFN (Quad Flat No-lead) package with gull-wing leads, while the SI8235AB-AM uses a 14-LGA (Land Grid Array) package with solder balls or pads on the bottom surface. Both are 5x5mm surface mount packages. The LGA package typically offers improved thermal performance and higher reliability in high-vibration environments. PCB layout and reflow profiles differ between these package types.

Q: Can I use SI8235AB-AM in place of SI8235AB-AM1 without design changes?

A: Electrical substitution is direct; however, PCB layout modifications are required due to the different package form factors. The QFN package requires gull-wing lead routing, while the LGA package requires bottom-side pad connections. Reflow soldering parameters also differ between package types.

Q: Why is the SI8235AB-AM1 designated as Last Time Buy?

A: Last Time Buy designation indicates that Skyworks Solutions Inc. will discontinue manufacturing the SI8235AB-AM1. The SI8235AB-AM (Active status) is the recommended replacement for continued production and new designs.

Q: Are both parts qualified for automotive applications?

A: Yes. Both the SI8235AB-AM1 and SI8235AB-AM carry automotive-grade qualification with AEC-Q100 certification and multi-agency approvals (CQC, CSA, UL, VDE), meeting automotive reliability and safety standards.

Q: What are the moisture sensitivity levels for these parts?

A: The SI8235AB-AM1 has MSL 2 (1 Year), while the SI8235AB-AM has MSL 3 (168 Hours). MSL 3 indicates a shorter shelf life after moisture absorption. Proper storage in dry conditions is required for both parts.

Q: Do these devices support the same isolation voltage and common mode transient immunity?

A: Yes. Both devices provide 2500Vrms isolation voltage and 20kV/µs common mode transient immunity, making them suitable for high-voltage isolated gate drive applications in power conversion and motor control circuits.