SFH 4656-Z Equivalent & Substitute Parts

Part Overview

The SFH 4656-Z is an Infrared (IR) Emitter manufactured by ams-OSRAM USA INC., designed for applications requiring 850nm wavelength emission at 70mA forward current. This component is classified as Active product status and is RoHS3 compliant. The SFH 4656-Z is packaged in 2-SMD, No Lead surface mount configuration with right-angle orientation, suitable for compact circuit board designs. Substitute parts are identified when equivalent functional performance is required due to component availability, design revision, or application-specific requirements within the allowed electrical and mechanical parameter ranges.

Substiute Parts

SFH 4656-Z

ams-OSRAM USA INC.In Stock: 2756SFH 4656-Z Datasheet

Current PartRFQ

SFH 4350

ams-OSRAM USA INC.In Stock: 15337SFH 4350 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SFH 4656-Z are identified based on the following criteria:

Functional Equivalence Parameters:

• Type: Infrared (IR) Emitter
• Wavelength range: 850nm nominal (860nm acceptable within IR spectrum)
• Forward current capability: 70mA minimum required
• Forward voltage: 1.5V to 1.6V typical range
• Radiant intensity: Minimum 16mW/sr at rated current
• Viewing angle: 26° to 30° acceptable range
• Operating temperature: -40°C to 100°C maintained

Compliance & Status Parameters:

• Product Status: Active
• RoHS Status: ROHS3 Compliant
• REACH Status: REACH Unaffected
• ECCN: EAR99

The SFH 4350 is identified as a substitute part. While it differs in mounting type (Through Hole vs. Surface Mount), package configuration (Radial vs. 2-SMD), and orientation (Top View vs. Side View), it maintains functional equivalence in IR emission characteristics within the specified wavelength and current operating ranges.

Parameter Comparison

Engineering Selection Recommendations

SFH 4656-Z Primary Selection: The SFH 4656-Z is the specified component for applications requiring surface mount, right-angle orientation with 2-SMD, No Lead packaging. This configuration is suitable for compact PCB layouts with side-view emission geometry. The component maintains Active product status with ROHS3 compliance and REACH unaffected classification, confirming regulatory compliance for current manufacturing standards.

SFH 4350 Substitute Selection: The SFH 4350 is applicable when through-hole mounting and radial package configuration are acceptable within the circuit design. This substitute maintains Active product status, ROHS3 compliance, and REACH unaffected status. The SFH 4350 operates at higher maximum forward current (100mA vs. 70mA) and delivers greater radiant intensity (200mW/sr @ 100mA vs. 16mW/sr @ 70mA), providing increased optical output capability. The wavelength shift from 850nm to 860nm remains within the infrared spectrum and is functionally equivalent for most IR detection applications. Moisture sensitivity level improves from MSL 2 (1 Year) to MSL 1 (Unlimited), indicating superior moisture resistance.

Selection between these parts depends on circuit board layout constraints, mounting technology availability, and required optical output levels. Both components satisfy compliance and active product status requirements.

Frequently Asked Questions (FAQ)

Q: Can the SFH 4350 directly replace the SFH 4656-Z in an existing PCB design?

A: Direct PCB replacement is not possible due to fundamental package and mounting differences. The SFH 4656-Z uses surface mount 2-SMD, No Lead configuration with right-angle orientation, while the SFH 4350 uses through-hole radial mounting with top-view orientation. Circuit board redesign is required to accommodate the SFH 4350, including pad layout modification and component placement adjustment.

Q: What is the wavelength difference between 850nm and 860nm, and does it affect application compatibility?

A: The 10nm wavelength difference places both components within the infrared spectrum. The SFH 4656-Z operates at 850nm and the SFH 4350 at 860nm. Both wavelengths are within the near-infrared range and are functionally equivalent for standard IR detection applications. Application-specific requirements should be evaluated based on detector sensitivity curves and optical filter specifications.

Q: Why does the SFH 4350 have higher radiant intensity than the SFH 4656-Z?

A: The SFH 4350 is rated for 200mW/sr @ 100mA, while the SFH 4656-Z is rated for 16mW/sr @ 70mA. The higher intensity in the SFH 4350 results from both increased maximum forward current capability (100mA vs. 70mA) and inherent optical design differences between the two package configurations. The radiant intensity values are measured at their respective maximum rated currents.

Q: Are both parts RoHS3 compliant?

A: Yes, both the SFH 4656-Z and SFH 4350 are ROHS3 compliant and REACH unaffected, confirming compliance with current environmental and regulatory standards for electronic component manufacturing.

Q: What is the significance of the Moisture Sensitivity Level (MSL) difference?

A: The SFH 4656-Z has MSL 2 (1 Year), indicating moisture sensitivity with a one-year floor life under controlled storage conditions. The SFH 4350 has MSL 1 (Unlimited), indicating superior moisture resistance with unlimited floor life. This difference affects component storage, handling, and shelf-life management during manufacturing and assembly processes.

Q: Can the SFH 4350 be operated at 70mA to match the SFH 4656-Z current specification?

A: Yes, the SFH 4350 has a maximum forward current rating of 100mA, allowing operation at 70mA. However, the radiant intensity output at 70mA would differ from the specified 200mW/sr @ 100mA rating. Operating parameters at reduced current levels should be confirmed against the SFH 4350 datasheet specifications.

Q: What are the packaging differences between the two parts?

A: The SFH 4656-Z is supplied in Tape & Reel (TR) packaging for automated surface mount assembly. The SFH 4350 is supplied in Bulk packaging for manual or selective assembly processes. These packaging formats reflect the different mounting technologies and assembly methods required for each component type.