SF5403-TAP Equivalent & Substitute Parts

Part Overview

The SF5403-TAP is a general-purpose rectifier diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 300 V DC reverse voltage and 3 A average rectified current. This through-hole component operates across a junction temperature range of -55°C to 175°C and features fast recovery characteristics with a 50 ns reverse recovery time. The part is currently active in production and maintains full RoHS3 compliance with unlimited moisture sensitivity rating (MSL 1). Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, manufacturing discontinuation, or application-specific packaging preferences.

Substiute Parts

SF5403-TAP
Vishay General Semiconductor - Diodes DivisionIn Stock: 1154SF5403-TAP Datasheet
SF5403-TAP
Current Part
EGP30F
Fairchild SemiconductorIn Stock: 3665EGP30F Datasheet
EGP30F
MFR Recommended

Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 300 V
Current - Average Rectified (Io) 3 A
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3 A
Reverse Recovery Time (trr) 50 ns
Current - Reverse Leakage @ Vr 5 µA @ 300 V
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io) -
Mounting Type Through Hole -
Operating Temperature - Junction -55 to 175 °C
Package / Case SOD-64, Axial -
RoHS Status ROHS3 Compliant -

Substitute Part Grouping Explanation

Substitution of the SF5403-TAP is permissible when the following critical electrical parameters are maintained at or above the specified values:

  • Voltage - DC Reverse (Vr) (Max): 300 V minimum
  • Current - Average Rectified (Io): 3 A minimum
  • Reverse Recovery Time (trr): 50 ns maximum
  • Current - Reverse Leakage @ Vr: 5 µA maximum at 300 V
  • Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
  • Mounting Type: Through Hole
  • Technology: Standard

Substitute parts must be through-hole axial diodes with equivalent or superior electrical ratings. Package form factor differences (SOD-64 versus DO-201AD) are acceptable provided the through-hole mounting requirement is satisfied and physical dimensions accommodate the application's printed circuit board layout.

Parameter Comparison

Parameter SF5403-TAP (Vishay) EGP30F (Fairchild) Match Status
Voltage - DC Reverse (Vr) (Max) 300 V 300 V Equivalent
Current - Average Rectified (Io) 3 A 3 A Equivalent
Voltage - Forward (Vf) (Max) @ If 1.1 V @ 3 A 1.25 V @ 3 A Substitute Higher
Reverse Recovery Time (trr) 50 ns 50 ns Equivalent
Current - Reverse Leakage @ Vr 5 µA @ 300 V 5 µA @ 300 V Equivalent
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io) Equivalent
Mounting Type Through Hole Through Hole Equivalent
Operating Temperature - Junction -55 to 175°C -65 to 150°C Substitute Narrower
Package / Case SOD-64, Axial DO-201AD, Axial Different Form Factor

Engineering Selection Recommendations

The EGP30F from Fairchild Semiconductor qualifies as a direct electrical substitute for the SF5403-TAP based on matched voltage, current, and recovery time specifications. Both components are active products with standard technology classification and maintain compliance with international regulatory standards (ECCN EAR99, HTSUS 8541.10.0080).

Electrical Compatibility: The EGP30F meets all critical electrical parameters. Forward voltage is 0.15 V higher at rated current (1.25 V versus 1.1 V), which remains within acceptable tolerance for general-purpose rectification applications. Reverse recovery time, leakage current, and voltage ratings are identical.

Temperature Range Consideration: The SF5403-TAP operates to 175°C junction temperature, while the EGP30F maximum is 150°C. Applications requiring operation above 150°C junction temperature require the SF5403-TAP or equivalent parts with extended temperature ratings.

Package Form Factor: The SF5403-TAP uses SOD-64 axial packaging, while the EGP30F uses DO-201AD axial packaging. Both are through-hole components with different physical dimensions. PCB layout and hole spacing must accommodate the selected package geometry.

Compliance Status: Both parts are RoHS3 compliant and REACH unaffected, supporting equivalent environmental and regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can the EGP30F replace the SF5403-TAP in all applications?

A: The EGP30F is electrically compatible for applications operating at junction temperatures up to 150°C. Applications requiring operation above 150°C must use the SF5403-TAP or parts with equivalent extended temperature ratings. Physical package dimensions differ between SOD-64 and DO-201AD, requiring PCB layout verification.

Q: What is the significance of the forward voltage difference between these parts?

A: The EGP30F forward voltage is 1.25 V at 3 A compared to 1.1 V for the SF5403-TAP. This 0.15 V difference results in slightly higher power dissipation in the substitute part. For general-purpose rectification, this difference is typically acceptable. High-efficiency or thermally constrained applications should evaluate the impact on total circuit power dissipation.

Q: Are both parts suitable for high-frequency switching applications?

A: Both the SF5403-TAP and EGP30F are classified as fast recovery diodes with 50 ns reverse recovery time and support switching frequencies above 200 mA. They are suitable for standard switching applications within their rated voltage and current specifications.

Q: What are the physical differences between SOD-64 and DO-201AD packages?

A: SOD-64 and DO-201AD are both axial through-hole packages with different physical dimensions and lead spacing. PCB hole diameter, spacing, and component clearance requirements differ between packages. Verify mechanical compatibility with the target PCB layout before substitution.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the SF5403-TAP and EGP30F are RoHS3 compliant, REACH unaffected, and classified under ECCN EAR99 and HTSUS 8541.10.0080. They meet equivalent environmental and regulatory requirements for commercial applications.

Q: What is the reverse leakage current specification, and why is it important?

A: Both parts specify 5 µA maximum reverse leakage current at 300 V. Reverse leakage determines the diode's blocking capability and affects circuit performance in high-impedance applications. Identical specifications ensure equivalent performance in these applications.

Q: Can these parts be used interchangeably in PCB designs without modification?

A: Electrical substitution is direct based on ratings. Physical substitution requires PCB layout modification due to different package dimensions. Verify hole spacing, lead diameter, and component clearance for the selected package before assembly.

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