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SF32G-TP Equivalent & Substitute Parts
Part Overview
The SF32G-TP is a general-purpose rectifier diode manufactured by Micro Commercial Co, rated for 100 V DC reverse voltage and 3 A average rectified current in a DO-201AD axial through-hole package. This component is classified as "Not For New Designs," indicating it has reached end-of-life status. Identifying equivalent and substitute parts is necessary for maintaining legacy systems, supporting existing production lines, and ensuring design continuity where this diode is currently specified.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 100 | V |
| Current - Average Rectified (Io) | 3 | A |
| Voltage - Forward (Vf) (Max) @ If | 950 mV @ 3 A | mV |
| Reverse Recovery Time (trr) | 35 | ns |
| Current - Reverse Leakage @ Vr | 5 | µA @ 100 V |
| Package / Case | DO-201AD, Axial | — |
| Mounting Type | Through Hole | — |
| Operating Temperature - Junction | -65°C ~ 150°C | °C |
| Technology | Standard | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitute parts for the SF32G-TP are identified based on strict electrical and mechanical parameter matching within the general-purpose rectifier diode category. The substitution logic is based on the following key parameters:
Electrical Matching Criteria:
- Voltage - DC Reverse (Vr) (Max): 100 V
- Current - Average Rectified (Io): 3 A
- Voltage - Forward (Vf) (Max) @ If: 950 mV @ 3 A
- Speed Classification: Fast Recovery ≤ 500 ns, > 200 mA (Io)
- Reverse Recovery Time (trr): ≤ 50 ns (acceptable tolerance)
- Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Mechanical Matching Criteria:
- Package / Case: DO-201AD, Axial
- Mounting Type: Through Hole
- Operating Temperature Range: -65°C to 150°C (or compatible subset)
Compliance Matching Criteria:
- RoHS3 Compliant
- REACH Unaffected
Parts meeting all electrical, mechanical, and compliance criteria are classified as direct substitutes. Variations in secondary parameters such as capacitance or reverse recovery time within acceptable engineering tolerances do not disqualify a part from substitution eligibility.
Parameter Comparison
| Parameter | SF32G-TP (Main) | SF32GHA0G (Substitute) | EGP30B (Equivalent) |
|---|---|---|---|
| Manufacturer | Micro Commercial Co | Taiwan Semiconductor Corporation | Fairchild Semiconductor |
| Voltage - DC Reverse (Vr) (Max) | 100 V | 100 V | 100 V |
| Current - Average Rectified (Io) | 3 A | 3 A | 3 A |
| Voltage - Forward (Vf) (Max) @ If | 950 mV @ 3 A | 950 mV @ 3 A | 950 mV @ 3 A |
| Speed | Fast Recovery ≤ 500 ns, > 200 mA (Io) | Fast Recovery ≤ 500 ns, > 200 mA (Io) | Fast Recovery ≤ 500 ns, > 200 mA (Io) |
| Reverse Recovery Time (trr) | 35 ns | 35 ns | 50 ns |
| Current - Reverse Leakage @ Vr | 5 µA @ 100 V | 5 µA @ 100 V | 5 µA @ 100 V |
| Capacitance @ Vr, F | 50 pF @ 4 V, 1 MHz | 80 pF @ 4 V, 1 MHz | 95 pF @ 4 V, 1 MHz |
| Package / Case | DO-201AD, Axial | DO-201AD, Axial | DO-201AD, Axial |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Operating Temperature - Junction | -65°C ~ 150°C | -55°C ~ 150°C | -65°C ~ 150°C |
| Product Status | Not For New Designs | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Not specified |
| Qualification | — | AEC-Q101 | — |
Engineering Selection Recommendations
SF32GHA0G (Taiwan Semiconductor Corporation): This part is the primary substitute for the SF32G-TP. It matches all critical electrical parameters (100 V, 3 A, 950 mV forward voltage, 35 ns reverse recovery time) and maintains identical mechanical compatibility in the DO-201AD axial package. The SF32GHA0G is classified as Active product status, ensuring ongoing availability and supply chain stability. It carries AEC-Q101 automotive qualification, providing additional reliability assurance for applications requiring automotive-grade components. The operating temperature range is -55°C to 150°C, which covers the upper portion of the SF32G-TP range; applications requiring the full -65°C lower limit should verify thermal requirements. RoHS3 compliance is maintained. This substitute is suitable for direct replacement in legacy systems and ongoing production support.
EGP30B (Fairchild Semiconductor): This part is a parametric equivalent offering identical electrical performance in the core specifications (100 V, 3 A, 950 mV forward voltage). The reverse recovery time is 50 ns, which is within acceptable tolerance for fast recovery diode applications. The EGP30B is classified as Active product status. Capacitance is higher at 95 pF compared to 50 pF in the SF32G-TP, which may affect high-frequency switching performance in sensitive applications. The operating temperature range matches the SF32G-TP at -65°C to 150°C. RoHS status is not specified in the provided data. This part is suitable for applications where the higher capacitance does not impact circuit performance and where Fairchild Semiconductor supply chain is preferred.
Selection Basis: Both substitute parts are Active products, eliminating obsolescence risk associated with the SF32G-TP's "Not For New Designs" status. The SF32GHA0G is recommended as the primary choice due to identical reverse recovery time and AEC-Q101 qualification. The EGP30B serves as an alternative where Fairchild Semiconductor supply relationships are established or where the slightly higher reverse recovery time is acceptable for the application.
Frequently Asked Questions (FAQ)
Q: Can the SF32GHA0G be used as a direct replacement for the SF32G-TP in all applications?
A: The SF32GHA0G matches all critical electrical parameters and package specifications. The operating temperature minimum is -55°C versus -65°C for the SF32G-TP. Applications operating below -55°C require verification that the SF32GHA0G meets thermal requirements. All other electrical and mechanical parameters are identical.
Q: What is the difference in reverse recovery time between the SF32G-TP and EGP30B?
A: The SF32G-TP has a reverse recovery time of 35 ns, while the EGP30B is rated at 50 ns. Both are classified as fast recovery diodes. The 15 ns difference may be significant in high-frequency switching applications; circuit performance should be verified if switching frequency exceeds 1 MHz.
Q: Why does the EGP30B have higher capacitance than the SF32G-TP?
A: The EGP30B is rated at 95 pF @ 4 V, 1 MHz compared to 50 pF for the SF32G-TP. Capacitance variation is a normal characteristic among different manufacturers' diode designs. Higher capacitance may affect switching speed and EMI performance in high-frequency circuits. Applications sensitive to capacitance should verify circuit performance with the EGP30B before production implementation.
Q: Are all substitute parts RoHS3 compliant?
A: The SF32GHA0G is explicitly RoHS3 compliant. The EGP30B RoHS status is not specified in the provided technical data. Verification with the supplier is required if RoHS3 compliance is a mandatory requirement.
Q: Does the SF32GHA0G AEC-Q101 qualification affect its use in non-automotive applications?
A: AEC-Q101 qualification indicates the part meets automotive reliability standards. This qualification does not restrict use in non-automotive applications; it provides additional assurance of component reliability and quality control. Non-automotive applications benefit from this higher qualification level.
Q: What is the impact of the SF32GHA0G's -55°C minimum operating temperature on legacy system support?
A: The SF32G-TP operates from -65°C to 150°C. The SF32GHA0G operates from -55°C to 150°C. If the legacy system requires operation below -55°C, the SF32GHA0G is not suitable. The EGP30B maintains the full -65°C to 150°C range and should be used for applications requiring the extended low-temperature specification.
Q: Can the SF32G-TP be used in new designs?
A: The SF32G-TP is marked "Not For New Designs," indicating end-of-life status. New designs should use either the SF32GHA0G or EGP30B to ensure long-term component availability and supply chain continuity.
Q: Are there packaging differences between the substitute parts?
A: All three parts use the DO-201AD axial through-hole package. Physical dimensions and PCB footprints are identical. No layout or assembly modifications are required when substituting between these parts.
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