SF13G R1G Equivalent & Substitute Parts

Part Overview

The SF13G R1G is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 150 V DC reverse voltage and 1 A average rectified current in a through-hole DO-204AL (DO-41) axial package. This component is classified as Active product status and is RoHS3 compliant with unlimited moisture sensitivity level.

Substitute parts become necessary when the SF13G R1G reaches end-of-life status, when inventory constraints occur, or when alternative packaging formats are required for specific circuit board designs. The substitute parts listed maintain electrical equivalence within the specified parameter ranges while offering different manufacturer options, packaging configurations, and availability profiles.

Substiute Parts

SF13G R1G

Taiwan Semiconductor CorporationIn Stock: 1101SF13G R1G Datasheet

Current PartRFQ

EGP10C-E3/54

Vishay General Semiconductor - Diodes DivisionIn Stock: 10595EGP10C-E3/54 Datasheet

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MUR115G

onsemiIn Stock: 4360MUR115G Datasheet

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MURA215T3G

onsemiIn Stock: 388375MURA215T3G Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the SF13G R1G is determined by strict equivalence across the following critical parameters:

Mandatory Equivalence Parameters:

• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 1 A minimum
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
• RoHS3 Compliance: Required
• Moisture Sensitivity Level: 1 (Unlimited)

Acceptable Variation Parameters:

• Reverse Recovery Time (trr): Values at or below 50 ns are acceptable
• Current - Reverse Leakage @ Vr: Values at or below 5 µA @ 150 V are acceptable
• Voltage - Forward (Vf) (Max) @ If: Values at or below 950 mV @ 1 A are acceptable
• Operating Temperature - Junction: Extended ranges are acceptable
• Mounting Type: Through Hole configurations only
• Package / Case: DO-204AL, DO-41, or Axial configurations

Substitute Parts Identified:

1. EGP10C-E3/54 (Vishay General Semiconductor - Diodes Division): Meets all mandatory parameters with identical electrical ratings. Packaging format is Cut Tape (CT). Reverse recovery time of 50 ns is within acceptable range.

2. MUR115G (onsemi): Meets all mandatory parameters with identical electrical ratings. Product status is Obsolete. Reverse recovery time of 35 ns matches the main part. Operating temperature range extends to 175°C.

3. MURA215T3G (onsemi): Exceeds current rating at 2 A (main part rated 1 A). Mounting type is Surface Mount (SMA package), which differs from through-hole requirement. This part does not qualify as a direct substitute due to package incompatibility and current rating mismatch.

Parameter Comparison

Engineering Selection Recommendations

EGP10C-E3/54 (Vishay General Semiconductor - Diodes Division)

This part is the primary substitute for the SF13G R1G. Both components maintain identical electrical specifications across voltage, current, and speed parameters. The EGP10C-E3/54 carries Active product status, ensuring continued availability and manufacturer support. RoHS3 compliance and unlimited moisture sensitivity level match the main part. The reverse recovery time of 50 ns is within acceptable tolerance. Packaging is Cut Tape (CT) format, suitable for automated assembly processes. This substitute is recommended for new designs and ongoing production where inventory of the SF13G R1G is constrained.

MUR115G (onsemi)

This part meets all electrical equivalence criteria with identical voltage and current ratings. The reverse recovery time of 35 ns matches the main part specification. Forward voltage drop of 875 mV @ 1 A is superior to the main part at 950 mV @ 1 A. Operating temperature range extends to 175°C, providing thermal margin beyond the SF13G R1G specification. However, MUR115G carries Obsolete product status, indicating discontinued manufacturing and limited future availability. This substitute is suitable only for legacy system maintenance or when existing inventory is available. New designs should not incorporate this part.

MURA215T3G (onsemi)

This part does not qualify as a direct substitute for the SF13G R1G. Although voltage and speed specifications are equivalent, the current rating of 2 A exceeds the 1 A requirement of the main part. More critically, the MURA215T3G is a surface-mount component in SMA package format, whereas the SF13G R1G requires through-hole axial mounting. Package incompatibility prevents direct substitution in existing circuit board designs. The product status is Last Time Buy, indicating imminent discontinuation. This part is not recommended for SF13G R1G replacement applications.

Frequently Asked Questions (FAQ)

Q: Can the EGP10C-E3/54 be used as a direct replacement for the SF13G R1G in existing circuit boards?

A: Yes. The EGP10C-E3/54 maintains identical electrical specifications and through-hole axial packaging. Both components are rated for 150 V, 1 A, and fast recovery operation. The Cut Tape packaging format does not affect electrical performance or mechanical fit in through-hole applications.

Q: What is the significance of the reverse recovery time difference between SF13G R1G (35 ns) and EGP10C-E3/54 (50 ns)?

A: Both parts are classified as fast recovery diodes with recovery times well below 500 ns. The 15 ns difference does not affect functional equivalence in standard rectification applications. The EGP10C-E3/54 remains suitable for the same circuit topologies as the SF13G R1G.

Q: Why is MUR115G listed as a substitute if it is Obsolete?

A: MUR115G is included for reference in legacy system maintenance scenarios where existing inventory may be available. The part meets all electrical equivalence criteria. However, Obsolete status means no new manufacturing occurs, and future availability cannot be guaranteed. New designs should prioritize Active status parts such as EGP10C-E3/54.

Q: Can MURA215T3G replace the SF13G R1G in a through-hole circuit board design?

A: No. MURA215T3G is a surface-mount component in SMA package format, incompatible with through-hole board layouts. Additionally, the 2 A current rating exceeds the 1 A specification of the SF13G R1G. This part is not suitable for SF13G R1G replacement.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts carry RoHS3 Compliant status, matching the environmental compliance requirement of the SF13G R1G. All parts also maintain unlimited moisture sensitivity level (MSL 1).

Q: What packaging formats are available for SF13G R1G substitutes?

A: EGP10C-E3/54 is supplied in Cut Tape (CT) format. MUR115G packaging format is not specified in the provided data. Both maintain DO-204AL, DO-41, Axial package specifications required for through-hole mounting. MURA215T3G uses SMA surface-mount packaging and is not compatible with through-hole designs.

Q: Which substitute part offers the best thermal performance?

A: MUR115G provides the widest operating temperature range at -65°C ~ 175°C, compared to SF13G R1G at -55°C ~ 150°C. EGP10C-E3/54 operates to 150°C maximum. For applications requiring extended temperature operation, MUR115G is superior, provided Obsolete status does not present supply constraints.

Q: Is the forward voltage drop difference between substitutes significant?

A: MUR115G exhibits 875 mV @ 1 A forward drop, compared to 950 mV @ 1 A for both SF13G R1G and EGP10C-E3/54. The 75 mV difference represents approximately 8% lower power dissipation in MUR115G. This may be beneficial in power-sensitive applications, but does not affect functional equivalence or circuit compatibility.