SE98APW,118 Equivalent & Substitute Parts

Part Overview

The SE98APW,118 is a temperature monitoring system sensor manufactured by NXP USA Inc., designed for DDR memory thermal management applications. This integrated circuit provides internal temperature sensing with I2C/SMBus output capability, supporting a sensing range of -40°C to 125°C with ±4°C maximum accuracy. The device is classified as obsolete, necessitating identification of active equivalent alternatives that maintain functional and electrical compatibility for ongoing system support and new designs.

Substiute Parts

SE98APW,118

NXP USA Inc.In Stock: 814SE98APW,118 Datasheet

Current PartRFQ

MAX6604AAHA+

Analog Devices Inc./Maxim IntegratedIn Stock: 1193MAX6604AAHA+ Datasheet

MFR RecommendedRFQ

MAX6604AAHA+T

Analog Devices Inc./Maxim IntegratedIn Stock: 1033MAX6604AAHA+T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SE98APW,118 is determined by the following critical parameters that must be maintained or exceeded:

Mandatory Compatibility Parameters:

• Sensor Type: Internal temperature sensing capability
• Output Interface: I2C/SMBus serial communication protocol
• Package Type: 8-TSSOP surface mount configuration
• Output Alarm Function: Alarm output capability required
• Supply Voltage Range: Must accommodate 1.7V ~ 3.6V operation or overlap within this range
• Sensing Temperature Coverage: Must support the -40°C to 125°C range or provide equivalent coverage for DDR memory thermal monitoring

Identified Substitutes: The MAX6604AAHA+ and MAX6604AAHA+T (Analog Devices Inc./Maxim Integrated) meet the core functional requirements as active, production-status alternatives. Both variants provide internal temperature sensing with I2C/SMBus output in 8-TSSOP packaging. The primary distinction between these substitutes is packaging format: MAX6604AAHA+ is supplied in Tube packaging, while MAX6604AAHA+T is supplied in Tape & Reel format.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The SE98APW,118 is classified as obsolete. The MAX6604AAHA+ and MAX6604AAHA+T are both active production components from Analog Devices Inc./Maxim Integrated, ensuring long-term availability and continued manufacturer support.

Compliance and Certification: All three components maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements. Both substitute parts carry identical ECCN (EAR99) and HTSUS (8542.39.0001) classifications as the original part.

Functional Equivalence: The MAX6604 series provides internal temperature sensing with I2C/SMBus output in 8-TSSOP surface mount packaging, maintaining core functional compatibility. The substitute parts offer improved accuracy (±3°C versus ±4°C) and are specifically qualified for DIMM DDR memory thermal monitoring applications.

Packaging Format Selection:

• MAX6604AAHA+ (Tube packaging): Suitable for lower-volume applications and manual assembly processes
• MAX6604AAHA+T (Tape & Reel packaging): Optimized for high-volume automated assembly and pick-and-place operations

Supply Voltage Consideration: The substitute parts operate within 2.7V ~ 3.6V, which overlaps the upper portion of the original part's 1.7V ~ 3.6V range. System designs operating below 2.7V require verification of alternative solutions.

Temperature Range Consideration: The MAX6604 series sensing range (-20°C ~ 125°C) does not extend to the -40°C lower limit of the SE98APW,118. Applications requiring full -40°C coverage must evaluate alternative components or confirm that system operation remains within -20°C ~ 125°C boundaries.

Frequently Asked Questions (FAQ)

Q: Can MAX6604AAHA+ directly replace SE98APW,118 in existing designs? A: Functional replacement is possible for applications operating within -20°C ~ 125°C and 2.7V ~ 3.6V parameters. PCB layout verification is required due to 8-TSSOP package width differences (0.118" versus 0.173"). The absence of fan output on MAX6604 variants requires confirmation that fan control functionality is not required in the target application.

Q: What is the difference between MAX6604AAHA+ and MAX6604AAHA+T? A: Both parts are electrically and functionally identical. The primary distinction is packaging format: MAX6604AAHA+ is supplied in Tube packaging for manual handling, while MAX6604AAHA+T is supplied in Tape & Reel format for automated assembly. Selection depends on manufacturing process requirements and volume considerations.

Q: Are there compatibility issues with the 8-TSSOP package width difference? A: The SE98APW,118 uses 8-TSSOP with 0.118" width (3.00mm), while MAX6604 variants use 8-TSSOP with 0.173" width (4.40mm). Both are standard 8-TSSOP pinouts with identical lead spacing. PCB footprint and solder reflow profile verification is necessary to confirm mechanical and thermal compatibility with existing board designs.

Q: Does the improved accuracy of MAX6604 (±3°C) provide system benefits? A: The MAX6604 series offers ±3°C accuracy compared to SE98APW,118's ±4°C specification. This represents a 25% improvement in measurement precision. System thermal management algorithms may benefit from tighter accuracy margins, particularly in applications with narrow thermal operating windows.

Q: What applications require the -40°C lower temperature limit? A: The SE98APW,118 supports -40°C sensing, while MAX6604 variants support only -20°C minimum. Applications in extreme cold environments, aerospace, or military specifications requiring -40°C operation must identify alternative solutions. Standard commercial DDR memory thermal monitoring typically operates within -20°C ~ 125°C boundaries.

Q: Is the absence of fan output on MAX6604 a critical limitation? A: The SE98APW,118 provides fan output capability, while MAX6604 variants do not. If the system design requires direct fan control signaling from the temperature sensor, alternative components must be evaluated. Many modern systems implement fan control through separate PWM controllers or system management interfaces, reducing dependency on sensor-integrated fan outputs.