SE97TP,128 Equivalent & Substitute Parts

Part Overview

The SE97TP,128 is a temperature monitoring system (sensor) designed for DIMM DDR memory applications. Manufactured by NXP USA Inc., this integrated circuit provides internal temperature sensing with I2C/SMBus serial output in an 8-HWSON (2x3) surface mount package. The device operates across -40°C to 125°C with ±3°C accuracy and includes alarm and fan control outputs.

The SE97TP,128 is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for systems utilizing this temperature monitoring function.

Substiute Parts

SE97TP,128

NXP USA Inc.In Stock: 796SE97TP,128 Datasheet

Current PartRFQ

SE97BTP,547

NXP SemiconductorsIn Stock: 4060SE97BTP,547 Datasheet

MFR RecommendedRFQ

AT30TSE002A-MAH-T

Microchip TechnologyIn Stock: 786AT30TSE002A-MAH-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the SE97TP,128 are identified based on the following critical parameters that determine functional compatibility:

Primary Substitution Criteria:

• Sensor Type: Internal temperature sensing capability
• Sensing Temperature Range: -40°C ~ 125°C minimum coverage
• Output Interface: I2C/SMBus serial communication protocol
• Package Type: 8-WFDFN Exposed Pad (8-HWSON or 8-WDFN equivalent)
• Supply Voltage: 3V ~ 3.6V operating range
• Mounting: Surface mount configuration
• Compliance: ROHS3 compliant, REACH unaffected

Identified Substitutes:

1. SE97BTP,547 (NXP Semiconductors) – Direct manufacturer line continuation with identical functional specifications and package footprint. Active product status with higher inventory availability.

2. AT30TSE002A-MAH-T (Microchip Technology) – Cross-manufacturer alternative meeting core substitution criteria with compatible I2C/SMBus interface, package footprint, and operating temperature range. Offers enhanced accuracy specification (±1°C at 75°C ~ 95°C).

Parameter Comparison

Engineering Selection Recommendations

SE97BTP,547 (NXP Semiconductors): This is the manufacturer-recommended primary substitute. It maintains identical functional specifications, package footprint, and electrical characteristics as the SE97TP,128. The SE97BTP,547 is in active production status with established supply chain availability. Selection of this part eliminates design modification requirements and preserves all original circuit functionality including fan control output. MSL rating of 3 (168 hours) requires standard moisture control during storage and assembly.

AT30TSE002A-MAH-T (Microchip Technology): This cross-manufacturer alternative meets core substitution criteria with compatible I2C/SMBus interface and 8-WFDFN package footprint. The AT30TSE002A-MAH-T operates across -20°C to 125°C (narrower low-temperature range than the original -40°C specification) and provides enhanced accuracy of ±1°C within the 75°C to 95°C test window. This part does not include dedicated fan control output; applications requiring fan control functionality must implement this through external logic. The expanded supply voltage range (2.7V ~ 3.6V) provides additional design flexibility. MSL rating of 3 (168 hours) applies. Selection requires verification that the -20°C minimum operating temperature and absence of fan output do not conflict with system requirements.

Frequently Asked Questions (FAQ)

Q: Can SE97BTP,547 be used as a direct replacement for SE97TP,128?

A: Yes. SE97BTP,547 is the manufacturer-recommended substitute with identical electrical specifications, package footprint, and functional outputs. No circuit modifications are required.

Q: What are the key differences between SE97BTP,547 and AT30TSE002A-MAH-T?

A: SE97BTP,547 is an NXP product maintaining full feature parity with the original SE97TP,128, including fan control output. AT30TSE002A-MAH-T is a Microchip alternative that omits fan control output and has a minimum operating temperature of -20°C instead of -40°C. Both share I2C/SMBus interface and 8-WFDFN package compatibility.

Q: Are the package footprints identical between all three parts?

A: The SE97TP,128 and SE97BTP,547 use 8-HWSON (2x3) packaging. The AT30TSE002A-MAH-T uses 8-WDFN (2x3) packaging. Both are 8-WFDFN Exposed Pad variants with compatible PCB footprints for surface mount assembly.

Q: Does the AT30TSE002A-MAH-T support fan control output?

A: No. The AT30TSE002A-MAH-T provides output switch and programmable limit functionality but does not include dedicated fan control output. Applications requiring fan control must implement this function through external circuitry or microcontroller logic.

Q: What is the significance of the MSL rating difference?

A: SE97TP,128 has MSL 1 (unlimited moisture exposure tolerance). SE97BTP,547 and AT30TSE002A-MAH-T have MSL 3 (168-hour moisture exposure limit). MSL 3 components require standard moisture control during storage and assembly to prevent solder joint degradation. This is standard industry practice and does not affect field performance.

Q: Can AT30TSE002A-MAH-T be used in applications requiring -40°C operation?

A: No. AT30TSE002A-MAH-T minimum operating temperature is -20°C. Applications requiring -40°C operation must use SE97TP,128 or SE97BTP,547.

Q: What is the accuracy specification for each part across the full operating temperature range?

A: SE97TP,128 and SE97BTP,547 specify ±3°C accuracy across -40°C to 125°C. AT30TSE002A-MAH-T specifies ±1°C accuracy within 75°C to 95°C and ±3°C accuracy across the full -20°C to 125°C range.