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SDL-136-T-12 Equivalent & Substitute Parts
Part Overview
The SDL-136-T-12 is a 72-position receptacle connector manufactured by Samtec Inc., designed for board-to-board applications with 0.100" (2.54mm) pitch spacing. This connector features through-hole solder termination, gold-plated mating contacts, and operates across the industrial temperature range of -55°C to 125°C. The part is Active status and ROHS3 compliant, making it suitable for modern electronic assemblies requiring reliable interconnection in standard pitch configurations.
Equivalent and substitute parts are identified to support procurement flexibility, inventory management, and design continuity when the primary part number becomes unavailable or when alternative contact finish specifications are required.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Connector Type | Receptacle |
| Number of Positions | 72 |
| Pitch - Mating | 0.100" (2.54mm) |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Termination | Solder |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 125°C |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Contact Material | Beryllium Copper |
| Series | SDL |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution eligibility for the SDL-136-T-12 is determined by strict equivalence across the following critical parameters:
- Connector type (Receptacle)
- Number of positions (72)
- Pitch spacing (0.100" / 2.54mm)
- Row configuration (2 rows at 0.100" spacing)
- Mounting method (Through Hole)
- Termination type (Solder)
- Fastening mechanism (Push-Pull)
- Mating contact finish (Gold)
- Operating temperature range (-55°C ~ 125°C)
- Insulation material (Liquid Crystal Polymer)
- Contact material (Beryllium Copper)
- Series designation (SDL)
- Regulatory compliance (ROHS3)
The SDL-136-G-12 qualifies as a direct substitute based on identical values across all critical parameters. The difference between these parts lies in the post contact finish specification, where the SDL-136-T-12 does not specify a post finish, while the SDL-136-G-12 specifies gold plating at 10.0µin (0.25µm) on the post contacts.
Parameter Comparison
| Parameter | SDL-136-T-12 | SDL-136-G-12 |
|---|---|---|
| Manufacturer | Samtec Inc. | Samtec Inc. |
| Category | Rectangular Connectors | Rectangular Connectors |
| Series | SDL | SDL |
| Connector Type | Receptacle | Receptacle |
| Number of Positions | 72 | 72 |
| Pitch - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Number of Rows | 2 | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole |
| Termination | Solder | Solder |
| Fastening Type | Push-Pull | Push-Pull |
| Contact Finish - Mating | Gold (30.0µin / 0.76µm) | Gold (30.0µin / 0.76µm) |
| Contact Finish - Post | Not specified | Gold (10.0µin / 0.25µm) |
| Insulation Color | Black | Black |
| Insulation Height | 0.095" (2.41mm) | 0.095" (2.41mm) |
| Contact Length - Post | 0.095" (2.41mm) | 0.095" (2.41mm) |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C |
| Insulation Material | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) |
| Contact Shape | Circular | Circular |
| Contact Material | Beryllium Copper | Beryllium Copper |
| Base Product Number | SDL-136 | SDL-136 |
| Product Status | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | EAR99 | EAR99 |
| HTSUS | 8536.69.4040 | 8536.69.4040 |
Engineering Selection Recommendations
Both the SDL-136-T-12 and SDL-136-G-12 maintain Active product status and full ROHS3 compliance, ensuring continued availability and regulatory alignment for new designs and production environments. Selection between these parts should be based on post contact finish requirements specific to the application's electrical and environmental specifications.
The SDL-136-T-12, with unspecified post contact finish, is suitable for applications where post contact plating is not a critical design parameter. The SDL-136-G-12, with gold-plated post contacts at 10.0µin (0.25µm), provides enhanced corrosion resistance on the solder-side contacts and may be preferred in high-reliability or corrosive environment applications.
Both parts share identical mating contact specifications, mechanical dimensions, and thermal operating ranges, ensuring direct interchangeability at the board-level interface.
Frequently Asked Questions (FAQ)
Q: Can SDL-136-G-12 be used as a direct replacement for SDL-136-T-12?
A: Yes. Both parts are identical across all critical functional parameters including connector type, position count, pitch spacing, row configuration, mounting method, termination type, and operating temperature range. The difference is limited to post contact finish specification.
Q: What is the significance of the post contact finish difference?
A: The post contact finish refers to the plating on the solder-side contacts. SDL-136-T-12 does not specify a post finish, while SDL-136-G-12 specifies gold plating at 10.0µin (0.25µm). This affects corrosion resistance and solderability characteristics of the through-hole termination.
Q: Are both parts suitable for board-to-board applications?
A: Yes. Both parts are classified as board-to-board style receptacle connectors with push-pull fastening and through-hole solder termination, making them suitable for standard PCB interconnection applications.
Q: Do both parts meet current regulatory requirements?
A: Yes. Both SDL-136-T-12 and SDL-136-G-12 are ROHS3 compliant and REACH unaffected, meeting current environmental and hazardous substance regulations.
Q: What is the operating temperature range for these connectors?
A: Both parts operate across -55°C to 125°C, supporting industrial and commercial temperature environments.
Q: Are these parts available in different packaging options?
A: Both parts are supplied in tube packaging as standard.
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