SCT2160KEC Equivalent & Substitute Parts Reference

Part Overview

The SCT2160KEC from Rohm Semiconductor is an N-Channel SiC power MOSFET designed for high-voltage switching applications. It features a drain-to-source voltage of 1200 V and continuous drain current of 22 A (Tc), with a maximum power dissipation of 165 W (Tc). This component is supplied in a TO-247-3 through-hole package. The SCT2160KEC product status is "Obsolete," making it necessary to identify compatible and equivalent substitutes for continued design support, repair, or maintenance activities.

Substiute Parts

SCT2160KEC
Rohm SemiconductorIn Stock: 1151SCT2160KEC Datasheet
SCT2160KEC
Current Part
SCT2160KEGC11
Rohm SemiconductorIn Stock: 757SCT2160KEGC11 Datasheet
SCT2160KEGC11
Direct
SCT2160KEHRC11
Rohm SemiconductorIn Stock: 1598SCT2160KEHRC11 Datasheet
SCT2160KEHRC11
Parametric Equivalent
IXFH30N85X
IXYSIn Stock: 928IXFH30N85X Datasheet
IXFH30N85X
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IXFH32N100X
IXYSIn Stock: 936IXFH32N100X Datasheet
IXFH32N100X
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IXFX40N90P
IXYSIn Stock: 1131IXFX40N90P Datasheet
IXFX40N90P
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MSC180SMA120B
Microchip TechnologyIn Stock: 993MSC180SMA120B Datasheet
MSC180SMA120B
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Key Parameters

Parameter Value
Manufacturer Part Number SCT2160KEC
Category Transistors, FETs, MOSFETs
FET Type N-Channel
Technology SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss) 1200 V
Current - Continuous Drain (Id) @ 25°C 22A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 18V
Rds On (Max) @ Id, Vgs 208mOhm @ 7A, 18V
Vgs(th) (Max) @ Id 4V @ 2.5mA
Gate Charge (Qg) (Max) @ Vgs 62 nC @ 18 V
Vgs (Max) +22V, -6V
Input Capacitance (Ciss) (Max) @ Vds 1200 pF @ 800 V
Power Dissipation (Max) 165W (Tc)
Operating Temperature 175°C (TJ)
Mounting Type Through Hole
Supplier Device Package TO-247
Package / Case TO-247-3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Substitute Part Grouping Explanation

Groupings for the SCT2160KEC equivalent and substitute parts are strictly based on the following explicit parameters: FET type (N-Channel), technology type (SiCFET/MOSFET as provided), maximum drain-to-source voltage (Vdss), maximum continuous drain current (Id), Rds(on), gate threshold voltage (Vgs(th)), maximum gate charge (Qg), input capacitance (Ciss), maximum power dissipation, operating temperature, mounting type, and package (TO-247/TO-247-3 variants). Substitution is further conditioned by product compliance (RoHS, REACH, MSL, ECCN), package case, and product status (active vs obsolete).

Parameter Comparison

Part Number Technology Vdss Id (Tc) Rds On (Max) Vgs(th) (Max) Qg (Max) Ciss (Max) Power Dissipation (Max) Operating Temperature (TJ) Mounting Type Package / Case RoHS Status MSL REACH ECCN Product Status
SCT2160KEC SiCFET 1200 V 22A 208mOhm @ 7A, 18V 4V @ 2.5mA 62 nC @ 18 V 1200 pF @ 800 V 165W 175°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Obsolete
SCT2160KEGC11 SiCFET 1200 V 22A 208mOhm @ 7A, 18V 4V @ 2.5mA 62 nC @ 18 V 1200 pF @ 800 V 165W 175°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Active
SCT2160KEHRC11 SiCFET 1200 V 22A 208mOhm @ 7A, 18V 4V @ 2.5mA 62 nC @ 18 V 1200 pF @ 800 V 165W 175°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Active
IXFH30N85X MOSFET 850 V 30A 220mOhm @ 500mA, 10V 5.5V @ 2.5mA 68 nC @ 10 V 2460 pF @ 25 V 695W 150°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Active
IXFH32N100X MOSFET 1000 V 32A 220mOhm @ 16A, 10V 6V @ 4mA 130 nC @ 10 V 4075 pF @ 25 V 890W 150°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Active
IXFX40N90P MOSFET 900 V 40A 230mOhm @ 20A, 10V 6.5V @ 1mA 230 nC @ 10 V 14000 pF @ 25 V 960W 150°C Through Hole TO-247-3 Variant ROHS3 1 Unaffected EAR99 Active
MSC180SMA120B MOSFET 1200 V 21A 225mOhm @ 8A, 20V 4.5V @ 500µA 36 nC @ 20 V 530 pF @ 1000 V 147W 175°C Through Hole TO-247-3 ROHS3 1 Unaffected EAR99 Active

Engineering Selection Recommendations

When selecting an engineering substitute for the SCT2160KEC, preference should be given to parts with an active product status, matching RoHS compliance (ROHS3), MSL 1 (Unlimited), REACH Unaffected status, and the same or compatible ECCN (EAR99). The mechanical package should match (TO-247-3 or variant) to ensure compatibility with existing board layouts and heat sinking.

Frequently Asked Questions (FAQ)

Q1: What criteria are used for determining an equivalent MOSFET substitute?
A: Equivalency is based on FET type, technology, drain-to-source voltage (Vdss), continuous drain current (Id), on-resistance (Rds On), gate threshold voltage (Vgs(th)), gate charge (Qg), input capacitance (Ciss), package compatibility, power dissipation, operating temperature, product compliance, and status.

Q2: Why is the package type critical when selecting substitutes?
A: The package type (such as TO-247-3) determines physical and thermal compatibility with the PCB and heat sinking. Only packages specified in the input parameters are considered compatible.

Q3: Are all substitutes electrically identical to the SCT2160KEC?
A: Only parametric equivalents (based strictly on provided parameters) are considered identical. Similar parts may differ in technology, voltage rating, on-resistance, or maximum rated currents, but comply with the group parameters explicitly listed.

Q4: How do compliance parameters like RoHS and REACH affect substitution?
A: Substitute selections require matching or compatible compliance designations to meet environmental and regulatory standards as specified (e.g., ROHS3, REACH Unaffected, MSL 1).

Q5: Can I use parts with different maximum Vdss or Id values as substitutes?
A: Only the specific parameters provided in the comparison are considered. Substitute components with differing Vdss or Id values are listed under "similar" parts as per input. Direct equivalence only exists where these parameters match.

Q6: How is product status relevant for substitutes?
A: Obsolete products may no longer be available in the supply chain. Selection prioritizes active parts to ensure ongoing availability and long-term service support.

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