SC16IS760IPW,128 Equivalent & Substitute Parts

Part Overview

The SC16IS760IPW,128 is a dual-channel UART controller with integrated RS232 and RS485 interface support, featuring I2C and SPI communication protocols. Manufactured by NXP Semiconductors, this component is packaged in a 24-TSSOP form factor and operates across a supply voltage range of 2.5V to 3.3V with a maximum supply current of 6mA. The device has reached obsolete product status, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements.

Substiute Parts

SC16IS760IPW,128

NXP SemiconductorsIn Stock: 100193SC16IS760IPW,128 Datasheet

Current PartRFQ

SC16IS760IBS,128

NXP USA Inc.In Stock: 3242SC16IS760IBS,128 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SC16IS760IPW,128 is determined by the following critical parameters:

Electrical Compatibility:

• Protocol support (RS232, RS485)
• Interface protocols (I2C, SPI, UART)
• Supply voltage range (2.5V, 3.3V)
• Supply current specification (6mA)
• Operating temperature range (-40°C to 95°C)

Mechanical & Compliance Compatibility:

• Base product number (SC16IS760)
• RoHS3 compliance
• MSL rating (1 - Unlimited)
• REACH compliance status

The SC16IS760IBS,128 qualifies as a direct substitute based on identical electrical specifications and compliance certifications. The primary distinction lies in package form factor: the substitute uses 24-HVQFN (4x4) packaging instead of 24-TSSOP, which affects PCB layout and thermal characteristics but maintains full functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

The SC16IS760IBS,128 is the manufacturer-recommended substitute for the obsolete SC16IS760IPW,128. Both components share identical electrical specifications, supply voltage requirements, current consumption, and operating temperature ranges. Both maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment.

The primary consideration for component selection is package form factor. The SC16IS760IPW,128 uses 24-TSSOP packaging, while the SC16IS760IBS,128 uses 24-HVQFN (4x4) packaging. This difference requires PCB layout modification but does not affect functional performance or electrical compatibility. The substitute's active product status ensures long-term availability and supply chain continuity compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can SC16IS760IBS,128 directly replace SC16IS760IPW,128 without design changes?

A: Electrical and functional replacement is direct. However, the different package form factor (24-HVQFN versus 24-TSSOP) requires PCB layout redesign. Pin assignments and electrical connections remain compatible.

Q: What is the primary reason for substitution?

A: The SC16IS760IPW,128 has reached obsolete status. The SC16IS760IBS,128 is the active equivalent from the same manufacturer, ensuring continued availability and supply chain reliability.

Q: Are there compliance differences between the two parts?

A: No. Both parts maintain identical RoHS3 compliance, REACH unaffected status, and MSL rating of 1 (Unlimited).

Q: How do the package differences affect thermal performance?

A: The 24-HVQFN (4x4) package includes an exposed pad for enhanced thermal dissipation compared to the 24-TSSOP package. This may improve thermal characteristics in applications with elevated ambient temperatures or high current draw.

Q: Are the supply voltage and current specifications identical?

A: Yes. Both parts operate at 2.5V to 3.3V supply voltage with 6mA maximum supply current and identical -40°C to 95°C operating temperature range.

Q: What protocols and interfaces does the substitute support?

A: The SC16IS760IBS,128 supports RS232 and RS485 protocols with I2C, SPI, and UART interface options, identical to the original part.