SC16C554IB80 Equivalent & Substitute Parts

Part Overview

The SC16C554IB80 is a quad UART interface IC manufactured by NXP USA Inc., designed for multi-channel serial communication applications. This device integrates four independent UART channels with 16-byte FIFOs, supporting data rates up to 5 Mbps and operating across multiple voltage supplies (2.5V, 3.3V, 5V). The part is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.

Substiute Parts

SC16C554IB80,557

NXP USA Inc.In Stock: 926SC16C554IB80,557 Datasheet

Current PartRFQ

TL16C554APN

Texas InstrumentsIn Stock: 2262TL16C554APN Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SC16C554IB80 is determined by the following critical parameters:

• Channel Configuration: Four independent UART channels (QUART)
• FIFO Capacity: 16-byte buffer per channel
• Package Compatibility: 80-LQFP (12x12) surface mount form factor
• Functional Features: Auto flow control, false start bit detection, and modem control capability
• Voltage Compatibility: Operating range that encompasses the original supply voltages

The TL16C554APN from Texas Instruments meets these core substitution criteria. Both devices share identical channel count, FIFO depth, and package specifications. Functional compatibility is maintained through equivalent auto flow control, false start bit detection, and modem control implementations. Voltage supply ranges are compatible within the operational envelope of the original design.

Parameter Comparison

Engineering Selection Recommendations

The TL16C554APN is the manufacturer-recommended substitute for the obsolete SC16C554IB80. Both devices maintain ROHS3 compliance and identical MSL ratings, ensuring compatibility with current manufacturing and environmental standards. The TL16C554APN is in active production status, providing long-term availability and supply chain stability compared to the obsolete NXP part.

The primary design consideration is the maximum data rate specification: the SC16C554IB80 supports 5 Mbps, while the TL16C554APN is rated for 1 Mbps. Applications operating at data rates exceeding 1 Mbps require verification that the reduced maximum rate does not impact system performance. The voltage supply range of the TL16C554APN (3V ~ 5.25V) is compatible with the 3.3V and 5V operating points of the original design; however, designs requiring 2.5V operation must implement appropriate voltage regulation or alternative solutions.

Frequently Asked Questions (FAQ)

Q: Can the TL16C554APN directly replace the SC16C554IB80 in existing designs?

A: Direct pin-compatible replacement is possible due to identical 80-LQFP packaging and matching pinout. Functional compatibility is maintained for channel count, FIFO depth, auto flow control, false start bit detection, and modem control. Design verification is required for applications utilizing the 5 Mbps maximum data rate capability or 2.5V supply voltage of the original part.

Q: What is the impact of the reduced maximum data rate on substitution?

A: The TL16C554APN maximum data rate of 1 Mbps is lower than the SC16C554IB80 specification of 5 Mbps. Applications operating below 1 Mbps are unaffected. Systems requiring higher data rates must evaluate alternative solutions or confirm that actual operating conditions remain within the TL16C554APN specification.

Q: Are there voltage supply compatibility issues?

A: The TL16C554APN operates within the 3V to 5.25V range, covering the 3.3V and 5V supply points of the original design. Designs utilizing 2.5V supply voltage require alternative substitutes or voltage conversion circuitry.

Q: Is the IrDA encoder/decoder functionality critical for substitution?

A: The SC16C554IB80 includes integrated IrDA encoder/decoder capability. The TL16C554APN does not specify this feature. Applications requiring IrDA functionality must implement external encoding/decoding or identify alternative parts with this capability.

Q: Are packaging and mounting considerations identical?

A: Both devices use 80-LQFP (12x12) surface mount packaging with identical pinout and footprint. PCB layout and assembly processes require no modification for physical substitution.