SBRF30150CT Equivalent & Substitute Parts

Part Overview

The SBRF30150CT is a Schottky diode array manufactured by SMC Diode Solutions, configured as a 1 Pair Common Cathode arrangement with a maximum reverse voltage rating of 150 V. This component is packaged in a TO-220-3 Full Pack with isolated tab configuration for through-hole mounting applications. The part is currently in active production status with 776 units in stock.

Equivalent and substitute parts are identified to provide design flexibility, accommodate supply chain variations, and support component sourcing strategies when the primary part becomes unavailable or when alternative specifications better suit specific application requirements.

Substiute Parts

SBRF30150CT

SMC Diode SolutionsIn Stock: 865SBRF30150CT Datasheet

Current PartRFQ

MBRF30150CT

Taiwan Semiconductor CorporationIn Stock: 1396MBRF30150CT Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the SBRF30150CT is determined by strict adherence to the following electrical and mechanical parameters:

Critical Matching Parameters:

• Diode Configuration: 1 Pair Common Cathode
• Technology: Schottky
• Voltage - DC Reverse (Vr) (Max): 150 V
• Package / Case: TO-220-3 Full Pack, Isolated Tab
• Supplier Device Package: ITO-220AB
• Mounting Type: Through Hole
• Operating Temperature Range: -55°C ~ 150°C

Allowable Variation Parameters:

• Voltage - Forward (Vf) (Max) @ If: Forward voltage may vary within acceptable limits for the specified current rating
• Current - Reverse Leakage @ Vr: Reverse leakage current may vary within acceptable limits
• Current - Average Rectified (Io) (per Diode): Current rating may be equal to or exceed the primary part specification

The MBRF30150CT from Taiwan Semiconductor Corporation meets all critical matching parameters and is classified as a parametric equivalent. This substitute maintains identical reverse voltage rating, diode configuration, package type, and thermal operating range while providing enhanced current handling capability and comparable fast recovery speed characteristics.

Parameter Comparison

Engineering Selection Recommendations

SBRF30150CT (Primary Part): The SBRF30150CT is the original specified component and remains the preferred selection when available. This part is in active production status with established supply inventory of 776 units. The component is ROHS3 compliant and REACH affected, meeting current environmental and regulatory requirements.

MBRF30150CT (Substitute Part): The MBRF30150CT is a direct parametric equivalent suitable for substitution in applications where the SBRF30150CT is unavailable. This substitute maintains identical electrical specifications for reverse voltage, diode configuration, and thermal operating range. The MBRF30150CT is also ROHS3 compliant and carries EAR99 classification. The substitute offers improved reverse leakage characteristics (200 µA versus 1 mA at 150 V) and higher current capacity (30 A rating), making it suitable for applications requiring enhanced performance margins. The MBRF30150CT is REACH unaffected, which may provide regulatory advantages in certain supply chain scenarios. Current inventory availability is 1382 units.

Both parts are functionally interchangeable at the circuit level when mounted in TO-220-3 Full Pack, Isolated Tab configurations with through-hole PCB assembly methods.

Frequently Asked Questions (FAQ)

Q: Can the MBRF30150CT be used as a direct replacement for the SBRF30150CT?

A: Yes. The MBRF30150CT is a parametric equivalent that maintains all critical electrical and mechanical specifications. Both components feature identical 150 V reverse voltage rating, 1 Pair Common Cathode configuration, TO-220-3 Full Pack Isolated Tab package, and -55°C to 150°C operating temperature range. The substitute is suitable for direct PCB substitution without circuit modification.

Q: What are the differences between these two parts?

A: The primary differences are manufacturer origin and performance characteristics. The MBRF30150CT provides lower reverse leakage current (200 µA versus 1 mA at 150 V) and a specified current rating of 30 A. Forward voltage at rated current is slightly higher for the substitute (1.05 V @ 30 A versus 1 V @ 15 A for the primary part). Both parts maintain identical fast recovery speed characteristics and thermal operating range.

Q: Are the package dimensions identical between SBRF30150CT and MBRF30150CT?

A: Yes. Both components use the TO-220-3 Full Pack, Isolated Tab package with ITO-220AB supplier device package designation. Physical dimensions and PCB footprint requirements are identical, enabling direct mechanical substitution.

Q: What is the significance of the isolated tab feature?

A: The isolated tab configuration in the TO-220-3 Full Pack means the tab is electrically isolated from the internal diode circuit. This allows the component to be mounted directly to a heatsink without requiring electrical isolation hardware, simplifying thermal management in high-current applications.

Q: Are both parts RoHS compliant?

A: Yes. Both the SBRF30150CT and MBRF30150CT are ROHS3 compliant, meeting current environmental regulations for restricted substances in electrical and electronic equipment.

Q: What is the difference in REACH status between these parts?

A: The SBRF30150CT is REACH affected, indicating it contains substances of concern under REACH regulations. The MBRF30150CT is REACH unaffected, meaning it does not contain such substances. This distinction may influence supply chain decisions in regions with strict REACH compliance requirements.

Q: Can these diodes be used in parallel for increased current capacity?

A: Parallel operation is not addressed in the provided specifications. Circuit design considerations for parallel diode configurations require additional technical analysis beyond the scope of this substitution reference.

Q: What mounting method is required for these components?

A: Both components are through-hole mounted devices. They require PCB holes sized for TO-220-3 lead dimensions and are soldered using standard through-hole assembly processes.