S8010VTP Equivalent & Substitute Parts

Part Overview

The S8010VTP is a standard recovery SCR (Silicon Controlled Rectifier) rated for 800V off-state voltage and 10A RMS on-state current, manufactured by Littelfuse Inc. in TO-251 through-hole packaging. This component is currently active in production with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified when equivalent electrical performance can be maintained within the specified parameter ranges while accommodating different packaging or mounting technologies.

Substiute Parts

S8010VTP

Littelfuse Inc.In Stock: 1235S8010VTP Datasheet

Current PartRFQ

MCR12DSN-1G

Littelfuse Inc.In Stock: 2816MCR12DSN-1G Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The MCR12DSN-1G qualifies as a manufacturer-recommended substitute based on the following electrical parameter alignment:

Matching Parameters:

• Voltage - Off State: 800V (identical)
• Current - Off State: 10µA maximum (identical)
• RoHS3 Compliance: Both parts meet ROHS3 requirements
• REACH Status: Both parts are REACH Unaffected
• ECCN Classification: Both classified as EAR99

Allowable Variations:

• Current - On State (It RMS): 12A (MCR12DSN-1G) vs 10A (S8010VTP) — higher rating provides margin
• Voltage - On State (Vtm) Max: 1.9V (MCR12DSN-1G) vs 1.6V (S8010VTP) — within acceptable tolerance for 800V class devices
• SCR Type: Sensitive Gate (MCR12DSN-1G) vs Standard Recovery (S8010VTP) — both are standard thyristor classifications
• Operating Temperature: -40 to 110°C (MCR12DSN-1G) vs -40 to 125°C (S8010VTP) — lower maximum does not restrict typical applications

Packaging Difference:

• S8010VTP: Through-hole TO-251 (V-Pak/I-Pak)
• MCR12DSN-1G: Surface mount TO-252 (DPAK)

Parameter Comparison

Engineering Selection Recommendations

Both S8010VTP and MCR12DSN-1G are active production components with identical RoHS3 compliance and REACH unaffected status. Selection between these parts depends on circuit board design requirements:

S8010VTP Selection Criteria:

• Through-hole mounting required for legacy or high-reliability applications
• Operating temperature must reach 125°C
• Standard recovery SCR characteristics required
• Gate trigger current tolerance of 15mA acceptable

MCR12DSN-1G Selection Criteria:

• Surface mount assembly process in use
• Sensitive gate operation acceptable (lower gate trigger current: 200µA vs 15mA)
• Operating temperature maximum of 110°C sufficient
• Higher on-state current rating (12A vs 10A) provides additional margin
• Compact DPAK footprint required for space-constrained designs

Both parts maintain 800V off-state voltage rating and 10µA maximum off-state leakage current, ensuring equivalent blocking performance in 800V applications.

Frequently Asked Questions (FAQ)

Q: Can MCR12DSN-1G directly replace S8010VTP in existing through-hole designs?

A: No. MCR12DSN-1G uses surface mount TO-252 (DPAK) packaging while S8010VTP uses through-hole TO-251. PCB layout and assembly process modifications are required. However, electrical performance is equivalent for 800V applications.

Q: What is the significance of "Sensitive Gate" vs "Standard Recovery" classification?

A: Both are standard thyristor types. MCR12DSN-1G (Sensitive Gate) requires lower gate trigger current (200µA vs 15mA), making it more responsive to gate signals. This is an allowable variation for substitution purposes.

Q: Are there temperature limitations when using MCR12DSN-1G as a substitute?

A: MCR12DSN-1G maximum operating temperature is 110°C versus 125°C for S8010VTP. Applications requiring sustained operation above 110°C must use S8010VTP.

Q: Does the higher on-state current rating of MCR12DSN-1G (12A vs 10A) affect compatibility?

A: No. Higher current rating provides additional design margin and does not compromise compatibility. The part will operate safely in circuits designed for 10A RMS current.

Q: What packaging considerations apply when switching between these parts?

A: S8010VTP (through-hole TO-251) requires PCB holes and wave or selective soldering. MCR12DSN-1G (surface mount TO-252/DPAK) requires SMT assembly equipment and reflow soldering. Board layout, thermal management, and assembly process must be evaluated independently.