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Equivalent & Substitute Parts for S3D-M3/57T
Part Overview
The S3D-M3/57T is a general-purpose rectifier diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 200 V DC reverse voltage and 3 A average rectified current in a surface mount DO-214AB (SMC) package. This diode is designed for standard recovery applications and is currently in active production status with full RoHS3 compliance.
Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or packaging format preferences while maintaining identical functional specifications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 200 | V |
| Current - Average Rectified (Io) | 3 | A |
| Voltage - Forward (Vf) (Max) @ If | 1.15 @ 2.5 | V @ A |
| Reverse Recovery Time (trr) | 2.5 | µs |
| Current - Reverse Leakage @ Vr | 10 @ 200 | µA @ V |
| Capacitance @ Vr, F | 60 @ 4V, 1MHz | pF |
| Operating Temperature - Junction | -55 to 150 | °C |
| Package / Case | DO-214AB (SMC) | — |
| Mounting Type | Surface Mount | — |
| Technology | Standard | — |
Substitute Part Grouping Explanation
Substitution eligibility for the S3D-M3/57T is determined by strict equivalence across the following critical parameters:
- Voltage Rating: DC reverse voltage must equal 200 V maximum
- Current Rating: Average rectified current must equal 3 A
- Forward Voltage Drop: Maximum forward voltage at 2.5 A must equal 1.15 V
- Reverse Recovery Time: Must equal 2.5 µs
- Reverse Leakage Current: Must equal 10 µA at 200 V
- Package Type: Must be DO-214AB (SMC) surface mount
- Operating Temperature Range: Must support -55°C to 150°C junction temperature
- Technology Classification: Must be Standard recovery type
The S3D-M3/57T is supplied in Tape & Reel (TR) packaging format. Equivalent parts with identical electrical specifications but different packaging formats (such as Cut Tape) are considered direct substitutes for applications where packaging format does not impose mechanical or assembly constraints.
Parameter Comparison
| Parameter | S3D-M3/57T | S3D-E3/57T |
|---|---|---|
| Manufacturer | Vishay General Semiconductor - Diodes Division | Vishay General Semiconductor - Diodes Division |
| Category | Diodes, Rectifiers | Diodes, Rectifiers |
| Voltage - DC Reverse (Vr) (Max) | 200 V | 200 V |
| Current - Average Rectified (Io) | 3 A | 3 A |
| Voltage - Forward (Vf) (Max) @ If | 1.15 V @ 2.5 A | 1.15 V @ 2.5 A |
| Reverse Recovery Time (trr) | 2.5 µs | 2.5 µs |
| Current - Reverse Leakage @ Vr | 10 µA @ 200 V | 10 µA @ 200 V |
| Capacitance @ Vr, F | 60 pF @ 4V, 1MHz | 60 pF @ 4V, 1MHz |
| Operating Temperature - Junction | -55°C to 150°C | -55°C to 150°C |
| Package / Case | DO-214AB (SMC) | DO-214AB (SMC) |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | Standard | Standard |
| Packaging Format | Tape & Reel (TR) | Cut Tape (CT) |
| Product Status | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Both the S3D-M3/57T and S3D-E3/57T are active production parts from Vishay General Semiconductor - Diodes Division with identical electrical and thermal specifications. Both parts maintain full RoHS3 compliance and REACH unaffected status, meeting regulatory requirements for industrial and commercial applications.
The primary distinction between these parts is packaging format: S3D-M3/57T is supplied in Tape & Reel format, while S3D-E3/57T is supplied in Cut Tape format. Selection between these variants depends on assembly process requirements and equipment compatibility rather than electrical performance.
Both parts support the full operating temperature range of -55°C to 150°C junction temperature and are classified as standard recovery diodes with 2.5 µs reverse recovery time, suitable for general-purpose rectification applications at 200 V and 3 A ratings.
Frequently Asked Questions (FAQ)
Q: Can S3D-E3/57T replace S3D-M3/57T in my application?
A: Yes. Both parts are electrically identical with matching voltage ratings (200 V), current ratings (3 A), forward voltage characteristics (1.15 V @ 2.5 A), and reverse recovery time (2.5 µs). The only difference is packaging format: S3D-M3/57T uses Tape & Reel while S3D-E3/57T uses Cut Tape. Substitution is valid if your assembly equipment accepts Cut Tape format.
Q: What does the packaging format difference mean for my assembly process?
A: Tape & Reel (TR) packaging is optimized for high-volume automated pick-and-place assembly. Cut Tape (CT) packaging is supplied in individual tape segments and is typically used for lower-volume applications or manual assembly processes. Verify your assembly equipment specifications before selecting between these formats.
Q: Are both parts compliant with environmental regulations?
A: Yes. Both S3D-M3/57T and S3D-E3/57T are RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components in industrial and commercial applications.
Q: What is the reverse recovery time specification, and why does it matter?
A: Both parts have a reverse recovery time (trr) of 2.5 µs, which defines the time required for the diode to transition from forward conduction to reverse blocking state. This parameter is critical for switching applications and determines switching losses in rectifier circuits.
Q: Can these diodes operate across the full temperature range in my application?
A: Both parts support junction temperatures from -55°C to 150°C. Verify that your circuit design accounts for temperature-dependent parameter variations, particularly forward voltage drop and leakage current, across this operating range.
Q: What is the moisture sensitivity level, and does it affect storage or handling?
A: Both parts have MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. These components can be stored and handled under standard conditions without special moisture control measures or baking requirements prior to assembly.
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