S32K322NHT0MPBST Equivalent & Substitute Parts

Part Overview

The S32K322NHT0MPBST is an ARM® Cortex®-M7 based 32-bit dual-core microcontroller from NXP USA Inc., designed for automotive applications. This device integrates 2MB of FLASH program memory, 256KB of RAM, and 128KB of EEPROM, operating at 160MHz with comprehensive connectivity options including CANbus, I2C, I3C, LINbus, SPI, and UART/USART interfaces. The part is classified as Active product status and carries AEC-Q100 automotive qualification. Finding equivalent substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and maintain alternative sourcing options for production environments.

Substiute Parts

S32K322NHT0MPBST
NXP USA Inc.In Stock: 894S32K322NHT0MPBST Datasheet
S32K322NHT0MPBST
Current Part
S32K322EHT0MPBST
NXP USA Inc.In Stock: 1366S32K322EHT0MPBST Datasheet
S32K322EHT0MPBST
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer NXP USA Inc.
Series S32K3
Core Processor ARM® Cortex®-M7
Core Size 32-Bit Dual-Core
Speed 160MHz
Program Memory Size 2MB (2M x 8) FLASH
EEPROM Size 128K x 8
RAM Size 256K x 8
Voltage Supply (Vcc/Vdd) 2.97V ~ 5.5V
Data Converters A/D 24x12b SAR
Number of I/O 143
Package / Case 172-QFP (16x16)
Operating Temperature -40°C ~ 125°C (TA)
Grade Automotive
Qualification AEC-Q100
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the S32K322NHT0MPBST are identified based on strict parameter equivalence within the S32K3 microcontroller series. The substitution criteria are defined by the following mandatory parameters:

Core Substitution Parameters:

  • Manufacturer: NXP USA Inc.
  • Series: S32K3
  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 160MHz
  • Program Memory Size: 2MB (2M x 8) FLASH
  • EEPROM Size: 128K x 8
  • RAM Size: 256K x 8
  • Voltage Supply Range: 2.97V ~ 5.5V
  • Package / Case: 172-QFP (16x16)
  • Operating Temperature Range: -40°C ~ 125°C (TA)
  • Grade: Automotive
  • Qualification: AEC-Q100

Parts meeting all these parameters are classified as parametric equivalents and direct substitutes. Variations in packaging type (Tray vs. alternative packaging) or moisture sensitivity level do not affect functional substitutability when all electrical and mechanical parameters remain identical.

Parameter Comparison

Parameter S32K322NHT0MPBST S32K322EHT0MPBST
Manufacturer NXP USA Inc. NXP USA Inc.
Series S32K3 S32K3
Core Processor ARM® Cortex®-M7 ARM® Cortex®-M7
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Speed 160MHz 160MHz
Program Memory Size 2MB (2M x 8) FLASH 2MB (2M x 8) FLASH
EEPROM Size 128K x 8 128K x 8
RAM Size 256K x 8 256K x 8
Voltage Supply (Vcc/Vdd) 2.97V ~ 5.5V 2.97V ~ 5.5V
Data Converters A/D 24x12b SAR A/D 24x12b SAR
Number of I/O 143 143
Connectivity CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals DMA, I2S, WDT DMA, I2S, WDT
Package / Case 172-QFP (16x16) 172-QFP (16x16)
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Grade Automotive Automotive
Qualification AEC-Q100 AEC-Q100
RoHS Status ROHS3 Compliant ROHS3 Compliant
Product Status Active Active

Engineering Selection Recommendations

The S32K322EHT0MPBST is a direct parametric equivalent to the S32K322NHT0MPBST. Both devices are manufactured by NXP USA Inc. within the S32K3 series and share identical electrical specifications, memory configurations, operating parameters, and automotive qualifications.

Selection Basis:

Both parts maintain Active product status, ensuring long-term availability and manufacturer support. Both carry AEC-Q100 automotive qualification and ROHS3 compliance, meeting regulatory requirements for automotive applications. The identical 172-QFP (16x16) package ensures mechanical compatibility with existing PCB designs and assembly processes.

The S32K322EHT0MPBST carries an MSL (Moisture Sensitivity Level) rating of 3 (168 Hours), which is provided in the substitute part specification. This parameter does not affect functional substitutability but may influence storage and handling procedures in manufacturing environments.

Selection between these two parts should be based on supply chain availability, inventory levels, and procurement lead times, as both devices are functionally and electrically interchangeable.

Frequently Asked Questions (FAQ)

Q: Can S32K322EHT0MPBST be used as a direct replacement for S32K322NHT0MPBST?

A: Yes. Both parts are parametric equivalents with identical core processor architecture, memory configuration, operating frequency, voltage supply range, package type, and automotive qualification. They are direct substitutes for each other.

Q: Are there any differences in connectivity or peripheral support between these parts?

A: No. Both parts provide identical connectivity options (CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART) and peripheral support (DMA, I2S, WDT).

Q: What is the significance of the MSL rating on the S32K322EHT0MPBST?

A: MSL (Moisture Sensitivity Level) 3 indicates the part requires controlled storage conditions with a maximum floor life of 168 hours at 30°C/60% RH after the moisture barrier bag is opened. This affects handling and storage procedures but does not impact functional performance or substitutability.

Q: Are both parts suitable for automotive applications?

A: Yes. Both S32K322NHT0MPBST and S32K322EHT0MPBST are classified as Automotive grade with AEC-Q100 qualification, meeting automotive industry reliability and quality standards.

Q: Is the 172-QFP package identical for both parts?

A: Yes. Both parts use the 172-QFP (16x16) package with identical pin configuration, footprint, and mechanical dimensions, ensuring PCB compatibility.

Q: What is the operating temperature range for both parts?

A: Both parts operate across the temperature range of -40°C to 125°C (TA), suitable for automotive environmental conditions.

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