S25FL064LABBHV030 Equivalent & Substitute Parts

Part Overview

The S25FL064LABBHV030 is a 64Mbit NOR Flash memory IC manufactured by Infineon Technologies, designed for SPI and Quad I/O applications with QPI support. This non-volatile memory device operates at 108 MHz and is housed in a 24-BGA (6x8) surface mount package. The part is currently in active production status with 642 units available in inventory. Substitute parts are identified when electrical specifications, memory capacity, interface protocols, and package compatibility remain functionally equivalent, enabling seamless integration in applications where the original part becomes unavailable or supply constraints necessitate alternative sourcing.

Key Parameters

Parameter	Value
Manufacturer Part Number	S25FL064LABBHV030
Manufacturer	Infineon Technologies
Memory Size	64Mbit
Memory Organization	8M x 8
Memory Type	Non-Volatile FLASH
Technology	FLASH - NOR
Memory Interface	SPI - Quad I/O, QPI
Clock Frequency	108 MHz
Voltage Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)
Package Type	24-TBGA
Supplier Device Package	24-BGA (6x8)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the S25FL064LABBHV030 is determined by strict equivalence across the following critical parameters:

Memory capacity: 64Mbit (8M x 8 organization)
Memory technology: FLASH - NOR
Interface protocol: SPI - Quad I/O, QPI
Operating frequency: 108 MHz
Supply voltage range: 2.7V ~ 3.6V
Operating temperature range: -40°C ~ 105°C
Package type: 24-TBGA
Compliance certifications: ROHS3, REACH Unaffected

The S25FL064LABBHV020 qualifies as a direct substitute based on identical electrical specifications, memory capacity, interface capabilities, and compliance status. The only variation is the physical BGA ball grid arrangement (8x6 versus 6x8), which represents a different layout of the same 24-pin ball grid array footprint. Both configurations maintain electrical and functional equivalence for circuit integration.

Parameter Comparison

Parameter	S25FL064LABBHV030	S25FL064LABBHV020	Match Status
Manufacturer	Infineon Technologies	Infineon Technologies	Identical
Memory Size	64Mbit	64Mbit	Identical
Memory Organization	8M x 8	8M x 8	Identical
Memory Type	Non-Volatile FLASH	Non-Volatile FLASH	Identical
Technology	FLASH - NOR	FLASH - NOR	Identical
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI	Identical
Clock Frequency	108 MHz	108 MHz	Identical
Voltage Supply	2.7V ~ 3.6V	2.7V ~ 3.6V	Identical
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)	Identical
Package Type	24-TBGA	24-TBGA	Identical
Supplier Device Package	24-BGA (6x8)	24-BGA (8x6)	Functionally Equivalent
Mounting Type	Surface Mount	Surface Mount	Identical
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Identical
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)	Identical

Engineering Selection Recommendations

Both the S25FL064LABBHV030 and S25FL064LABBHV020 maintain active product status with Infineon Technologies and are ROHS3 compliant and REACH unaffected. Selection between these parts should be based on PCB layout requirements and BGA footprint compatibility. The S25FL064LABBHV030 features a 6x8 ball grid arrangement, while the S25FL064LABBHV020 uses an 8x6 arrangement. Both configurations deliver identical electrical performance and functional capability. Verify that the selected part's BGA footprint matches the PCB design specifications before procurement. Current inventory availability shows 642 units for the S25FL064LABBHV030 and 1487 units for the S25FL064LABBHV020.

Frequently Asked Questions (FAQ)

Q: Can the S25FL064LABBHV020 directly replace the S25FL064LABBHV030 in existing designs?

A: Electrical and functional replacement is possible. However, the BGA ball grid arrangement differs (8x6 versus 6x8). PCB footprint compatibility must be verified before substitution. If the PCB layout accommodates the alternative BGA configuration, direct replacement is feasible.

Q: What is the significance of the BGA package variation between these parts?

A: The 24-BGA package is available in two physical configurations: 6x8 (S25FL064LABBHV030) and 8x6 (S25FL064LABBHV020). Both contain 24 ball positions with identical electrical pin assignments. The difference is the physical arrangement of balls on the package substrate. PCB design must match the specific BGA configuration.

Q: Are there any compliance or certification differences between these substitute parts?

A: No. Both parts carry identical ROHS3 compliance and REACH unaffected status. Moisture sensitivity level (MSL 3, 168 hours) is identical for both parts.

Q: What are the critical parameters that determine substitution eligibility?

A: Memory capacity (64Mbit), memory organization (8M x 8), technology (FLASH - NOR), interface protocol (SPI - Quad I/O, QPI), operating frequency (108 MHz), supply voltage (2.7V ~ 3.6V), and operating temperature range (-40°C ~ 105°C) must remain constant. Package type (24-TBGA) must be compatible with PCB design.

Q: How should BGA footprint compatibility be confirmed?

A: Obtain the PCB layout documentation and compare the BGA ball grid pattern with the datasheet specifications for each candidate part. Verify that pin assignments and ball positions align with the PCB design. Consult the PCB design files and component placement data to confirm compatibility.

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