S25FL064LABBHN030 Equivalent & Substitute Parts

Part Overview

The S25FL064LABBHN030 is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capability, operating at 108 MHz. Manufactured by Infineon Technologies, this component is classified as Last Time Buy, indicating end-of-life status. The part is housed in a 24-BGA (6x8) package and operates across an industrial temperature range of -40°C to 125°C with a supply voltage range of 2.7V to 3.6V. Due to its Last Time Buy status, identifying functionally equivalent alternatives is essential for design continuity and long-term supply chain planning.

Substiute Parts

S25FL064LABBHN030
Infineon TechnologiesIn Stock: 958S25FL064LABBHN030 Datasheet
S25FL064LABBHN030
Current Part
S25FL064LABBHN020
Cypress Semiconductor CorpIn Stock: 1479S25FL064LABBHN020 Datasheet
S25FL064LABBHN020
MFR Recommended

Key Parameters

Parameter Value
Memory Size 64Mbit
Memory Type Non-Volatile FLASH
Memory Technology FLASH - NOR
Memory Interface SPI - Quad I/O, QPI
Clock Frequency 108 MHz
Memory Organization 8M x 8
Voltage Supply Range 2.7V ~ 3.6V
Operating Temperature -40°C ~ 125°C
Package Type 24-TBGA
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution eligibility for the S25FL064LABBHN030 is determined by the following critical parameters:

  • Memory capacity: 64Mbit
  • Memory technology: FLASH - NOR
  • Interface protocol: SPI with Quad I/O and QPI support
  • Operating frequency: 108 MHz
  • Supply voltage compatibility: 2.7V ~ 3.6V
  • Temperature range: -40°C ~ 125°C
  • Package form factor: 24-BGA with surface mount capability
  • Memory organization: 8M x 8 configuration

The S25FL064LABBHN020 meets all electrical and mechanical substitution criteria. Both parts share identical memory specifications, interface protocols, frequency ratings, voltage requirements, and temperature operating ranges. Package variations (6x8 versus 8x6 BGA configuration) represent different physical arrangements of the same 24-pin ball grid array and do not affect electrical compatibility or PCB footprint compatibility for standard applications.

Parameter Comparison

Parameter S25FL064LABBHN030 (Main) S25FL064LABBHN020 (Substitute)
Manufacturer Infineon Technologies Cypress Semiconductor Corp
Memory Size 64Mbit 64Mbit
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Memory Technology FLASH - NOR FLASH - NOR
Memory Organization 8M x 8 8M x 8
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 108 MHz 108 MHz
Voltage Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C
Package / Case 24-TBGA 24-TBGA
Supplier Device Package 24-BGA (6x8) 24-BGA (8x6)
Mounting Type Surface Mount Surface Mount
Product Status Last Time Buy Active
RoHS Status ROHS3 Compliant RoHS non-compliant

Engineering Selection Recommendations

The S25FL064LABBHN020 is electrically and mechanically equivalent to the S25FL064LABBHN030 across all functional parameters. The primary distinction lies in product lifecycle status and regulatory compliance:

The S25FL064LABBHN030 maintains ROHS3 compliance and carries active inventory status as Last Time Buy, suitable for designs requiring regulatory adherence to RoHS directives. The S25FL064LABBHN020, manufactured by Cypress Semiconductor Corp, is in Active product status with higher available inventory (1434 Pcs versus 945 Pcs), but does not meet RoHS compliance requirements.

Selection between these parts should be based on regulatory requirements of the target application and supply chain availability. Both parts are functionally interchangeable from an electrical and interface perspective.

Frequently Asked Questions (FAQ)

Q: Are the S25FL064LABBHN030 and S25FL064LABBHN020 pin-compatible?

A: Yes. Both parts use 24-pin BGA packages with identical electrical pin assignments. The BGA ball grid arrangement differs (6x8 versus 8x6), but this represents a physical rearrangement of the same 24-pin configuration and does not affect PCB footprint compatibility for standard applications.

Q: What is the significance of the different BGA configurations (6x8 versus 8x6)?

A: The BGA configuration notation indicates the physical arrangement of solder balls on the package substrate. Both configurations contain 24 pins with identical electrical connections. The different arrangements may have minor implications for thermal distribution and mechanical stress, but electrical functionality and interface compatibility remain unchanged.

Q: Can the S25FL064LABBHN020 be used as a direct replacement in designs currently using the S25FL064LABBHN030?

A: From an electrical and functional standpoint, yes. Both parts share identical memory capacity, interface protocols, frequency ratings, voltage specifications, and temperature ranges. The primary consideration is RoHS compliance status, which differs between the two parts.

Q: Why does the S25FL064LABBHN030 have Last Time Buy status?

A: Last Time Buy status indicates that the manufacturer (Infineon Technologies) is discontinuing this part number. This is a standard lifecycle notification and does not reflect product quality or performance issues. The S25FL064LABBHN020 from Cypress Semiconductor Corp remains in Active status and represents a viable long-term alternative.

Q: Are there any performance differences between these two parts?

A: No. Both parts operate at 108 MHz, support identical SPI Quad I/O and QPI interface protocols, and maintain the same voltage supply range (2.7V ~ 3.6V) and temperature operating range (-40°C ~ 125°C).

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