S25FL064LABBHI033 Equivalent & Substitute Parts

Part Overview

The S25FL064LABBHI033 is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capability, operating at 108 MHz. This component is classified as Last Time Buy, indicating end-of-life status with limited availability. The identification of equivalent substitute parts is necessary to ensure design continuity and procurement flexibility for applications requiring this memory technology.

Substiute Parts

S25FL064LABBHI033
Infineon TechnologiesIn Stock: 1952S25FL064LABBHI033 Datasheet
S25FL064LABBHI033
Current Part
S25FL064LABBHI023
Infineon TechnologiesIn Stock: 3245S25FL064LABBHI023 Datasheet
S25FL064LABBHI023
MFR Recommended

Key Parameters

Parameter Value
Memory Size 64Mbit
Memory Type Non-Volatile FLASH
Technology FLASH - NOR
Memory Organization 8M x 8
Memory Interface SPI - Quad I/O, QPI
Clock Frequency 108 MHz
Voltage Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Package Type 24-TBGA
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the S25FL064LABBHI033 is determined by strict equivalence across the following critical parameters:

Memory capacity (64Mbit), memory organization (8M x 8), interface protocol (SPI - Quad I/O, QPI), clock frequency (108 MHz), supply voltage range (2.7V ~ 3.6V), operating temperature range (-40°C ~ 85°C), package type (24-TBGA), and compliance certifications (ROHS3, REACH Unaffected).

The S25FL064LABBHI023 meets all electrical and functional requirements for direct substitution. The primary distinction between these parts is the physical BGA ball grid arrangement (6x8 versus 8x6), which does not affect electrical performance or functional compatibility when the PCB layout accommodates the alternative ball grid pattern.

Parameter Comparison

Parameter S25FL064LABBHI033 S25FL064LABBHI023 Match Status
Memory Size 64Mbit 64Mbit Identical
Memory Organization 8M x 8 8M x 8 Identical
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI Identical
Clock Frequency 108 MHz 108 MHz Identical
Voltage Supply 2.7V ~ 3.6V 2.7V ~ 3.6V Identical
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C Identical
Package Type 24-TBGA 24-TBGA Identical
Mounting Type Surface Mount Surface Mount Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
MSL Rating 3 (168 Hours) 3 (168 Hours) Identical
BGA Ball Grid 6x8 8x6 Different
Product Status Last Time Buy Active Substitute is Active

Engineering Selection Recommendations

The S25FL064LABBHI023 is the qualified substitute for the S25FL064LABBHI033. Both parts maintain identical electrical specifications, memory capacity, interface protocols, and compliance certifications. The S25FL064LABBHI023 carries Active product status, ensuring continued availability and supply chain stability compared to the Last Time Buy status of the original part.

Selection of the S25FL064LABBHI023 requires PCB layout verification to accommodate the 8x6 ball grid arrangement in place of the 6x8 configuration. Pin-to-pin electrical compatibility is maintained across both BGA configurations when the footprint is appropriately adjusted.

Frequently Asked Questions (FAQ)

Q: Can the S25FL064LABBHI023 be used as a direct replacement for the S25FL064LABBHI033?

A: Electrical and functional compatibility is complete. PCB layout modification is required to accommodate the different BGA ball grid pattern (8x6 versus 6x8). The footprint must be updated accordingly.

Q: What is the primary reason for substitution?

A: The S25FL064LABBHI033 is designated Last Time Buy, indicating end-of-life status. The S25FL064LABBHI023 provides equivalent functionality with Active product status and improved supply availability.

Q: Are the memory specifications identical between these parts?

A: Yes. Both parts provide 64Mbit capacity with 8M x 8 organization, SPI Quad I/O interface, 108 MHz operation, and identical voltage and temperature specifications.

Q: What compliance certifications apply to both parts?

A: Both parts are ROHS3 Compliant and REACH Unaffected, with identical MSL ratings of 3 (168 Hours).

Q: Does the BGA ball grid difference affect electrical performance?

A: No. The ball grid arrangement difference is a physical layout consideration only. Electrical performance and signal integrity remain equivalent when the PCB footprint is properly designed for the 8x6 configuration.

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