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S25FL064LABBHI033 Equivalent & Substitute Parts
Part Overview
The S25FL064LABBHI033 is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capability, operating at 108 MHz. This component is classified as Last Time Buy, indicating end-of-life status with limited availability. The identification of equivalent substitute parts is necessary to ensure design continuity and procurement flexibility for applications requiring this memory technology.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Size | 64Mbit |
| Memory Type | Non-Volatile FLASH |
| Technology | FLASH - NOR |
| Memory Organization | 8M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 108 MHz |
| Voltage Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Package Type | 24-TBGA |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
| MSL Rating | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution eligibility for the S25FL064LABBHI033 is determined by strict equivalence across the following critical parameters:
Memory capacity (64Mbit), memory organization (8M x 8), interface protocol (SPI - Quad I/O, QPI), clock frequency (108 MHz), supply voltage range (2.7V ~ 3.6V), operating temperature range (-40°C ~ 85°C), package type (24-TBGA), and compliance certifications (ROHS3, REACH Unaffected).
The S25FL064LABBHI023 meets all electrical and functional requirements for direct substitution. The primary distinction between these parts is the physical BGA ball grid arrangement (6x8 versus 8x6), which does not affect electrical performance or functional compatibility when the PCB layout accommodates the alternative ball grid pattern.
Parameter Comparison
| Parameter | S25FL064LABBHI033 | S25FL064LABBHI023 | Match Status |
|---|---|---|---|
| Memory Size | 64Mbit | 64Mbit | Identical |
| Memory Organization | 8M x 8 | 8M x 8 | Identical |
| Memory Interface | SPI - Quad I/O, QPI | SPI - Quad I/O, QPI | Identical |
| Clock Frequency | 108 MHz | 108 MHz | Identical |
| Voltage Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | Identical |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | Identical |
| Package Type | 24-TBGA | 24-TBGA | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| MSL Rating | 3 (168 Hours) | 3 (168 Hours) | Identical |
| BGA Ball Grid | 6x8 | 8x6 | Different |
| Product Status | Last Time Buy | Active | Substitute is Active |
Engineering Selection Recommendations
The S25FL064LABBHI023 is the qualified substitute for the S25FL064LABBHI033. Both parts maintain identical electrical specifications, memory capacity, interface protocols, and compliance certifications. The S25FL064LABBHI023 carries Active product status, ensuring continued availability and supply chain stability compared to the Last Time Buy status of the original part.
Selection of the S25FL064LABBHI023 requires PCB layout verification to accommodate the 8x6 ball grid arrangement in place of the 6x8 configuration. Pin-to-pin electrical compatibility is maintained across both BGA configurations when the footprint is appropriately adjusted.
Frequently Asked Questions (FAQ)
Q: Can the S25FL064LABBHI023 be used as a direct replacement for the S25FL064LABBHI033?
A: Electrical and functional compatibility is complete. PCB layout modification is required to accommodate the different BGA ball grid pattern (8x6 versus 6x8). The footprint must be updated accordingly.
Q: What is the primary reason for substitution?
A: The S25FL064LABBHI033 is designated Last Time Buy, indicating end-of-life status. The S25FL064LABBHI023 provides equivalent functionality with Active product status and improved supply availability.
Q: Are the memory specifications identical between these parts?
A: Yes. Both parts provide 64Mbit capacity with 8M x 8 organization, SPI Quad I/O interface, 108 MHz operation, and identical voltage and temperature specifications.
Q: What compliance certifications apply to both parts?
A: Both parts are ROHS3 Compliant and REACH Unaffected, with identical MSL ratings of 3 (168 Hours).
Q: Does the BGA ball grid difference affect electrical performance?
A: No. The ball grid arrangement difference is a physical layout consideration only. Electrical performance and signal integrity remain equivalent when the PCB footprint is properly designed for the 8x6 configuration.
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