S25FL064LABBHB033 Equivalent & Substitute Parts

Part Overview

The S25FL064LABBHB033 is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capability, designed for automotive-grade applications. This device operates at 108 MHz clock frequency and is housed in a 24-BGA package. The part is currently in Last Time Buy status, making identification of suitable substitute components essential for ongoing design support and production continuity.

Substiute Parts

S25FL064LABBHB033

Infineon TechnologiesIn Stock: 1304S25FL064LABBHB033 Datasheet

Current PartRFQ

S25FL064LABBHB023

Infineon TechnologiesIn Stock: 3841S25FL064LABBHB023 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the S25FL064LABBHB033 is determined by strict equivalence across the following critical parameters:

• Memory capacity: 64Mbit
• Memory technology: FLASH - NOR
• Memory organization: 8M x 8
• Interface protocol: SPI - Quad I/O, QPI
• Clock frequency: 108 MHz
• Supply voltage range: 2.7V ~ 3.6V
• Operating temperature range: -40°C ~ 105°C
• Package classification: 24-TBGA
• Automotive qualification: AEC-Q100
• Environmental compliance: ROHS3, REACH Unaffected

The S25FL064LABBHB023 meets all these criteria and is therefore a direct functional equivalent. The primary distinction between these parts is the BGA ball grid arrangement (6x8 versus 8x6), which does not affect electrical performance or pin functionality when the package footprint is accommodated in the PCB design.

Parameter Comparison

Engineering Selection Recommendations

The S25FL064LABBHB023 is a direct electrical and functional substitute for the S25FL064LABBHB033. Both parts are manufactured by Infineon Technologies and carry identical AEC-Q100 automotive qualification and ROHS3 compliance certifications.

The S25FL064LABBHB023 offers the advantage of Active product status, ensuring continued availability and manufacturing support, compared to the Last Time Buy status of the S25FL064LABBHB033. This makes the S25FL064LABBHB023 the preferred choice for new designs and ongoing production requirements.

The difference in BGA ball grid arrangement (6x8 versus 8x6) requires PCB footprint verification. Both configurations maintain identical electrical pin assignments and functionality; however, the physical ball placement differs. PCB design files must be updated to accommodate the alternate grid pattern if transitioning between these parts.

Frequently Asked Questions (FAQ)

Q: Are the S25FL064LABBHB033 and S25FL064LABBHB023 pin-compatible?

A: Both parts use the 24-TBGA package with identical electrical pin assignments and functionality. The difference lies in the physical ball grid arrangement (6x8 versus 8x6). Pin compatibility is confirmed; however, PCB footprint design must match the specific BGA configuration of the selected part.

Q: Can I use the S25FL064LABBHB023 as a direct replacement without design changes?

A: Electrical substitution is direct. PCB footprint modification is required due to the different BGA ball grid arrangement. Verify that your PCB design accommodates the 8x6 grid pattern before component placement.

Q: What is the significance of the Last Time Buy status for the S25FL064LABBHB033?

A: Last Time Buy status indicates that the manufacturer will no longer accept new orders after a specified date. Existing inventory may be available, but long-term supply is not guaranteed. The S25FL064LABBHB023, with Active status, provides assured continued availability.

Q: Are both parts qualified for automotive applications?

A: Yes. Both the S25FL064LABBHB033 and S25FL064LABBHB023 carry AEC-Q100 automotive qualification and are suitable for automotive-grade applications within the specified operating temperature range of -40°C to 105°C.

Q: Do both parts meet the same environmental compliance standards?

A: Yes. Both parts are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.