S25FL064LABBHB030 Equivalent & Substitute Parts

Part Overview

The S25FL064LABBHB030 is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capabilities, operating at 108 MHz. Manufactured by Infineon Technologies, this component is qualified to AEC-Q100 automotive standards and packaged in a 24-BGA (6x8) configuration. The part is currently in Last Time Buy status, making identification of functionally equivalent alternatives essential for design continuity and supply chain planning.

Substiute Parts

S25FL064LABBHB030

Infineon TechnologiesIn Stock: 1169S25FL064LABBHB030 Datasheet

Current PartRFQ

S25FL064LABBHB020

Infineon TechnologiesIn Stock: 995S25FL064LABBHB020 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the S25FL064LABBHB030 is determined by strict equivalence across the following critical parameters:

• Memory capacity and organization (64Mbit, 8M x 8)
• Interface protocol (SPI - Quad I/O, QPI)
• Operating frequency (108 MHz)
• Supply voltage range (2.7V ~ 3.6V)
• Temperature rating (-40°C ~ 105°C)
• Automotive qualification (AEC-Q100)
• Package family (24-TBGA)
• RoHS compliance status (ROHS3)

The S25FL064LABBHB020 meets all substitution criteria. The primary distinction between these parts is the BGA ball grid layout (6x8 versus 8x6), which represents a physical arrangement variation within the same 24-TBGA package family. Both parts share identical electrical specifications, memory architecture, and qualification status.

Parameter Comparison

Engineering Selection Recommendations

The S25FL064LABBHB020 is a direct functional equivalent to the S25FL064LABBHB030. Both parts are manufactured by Infineon Technologies under the FL-L series and maintain identical electrical and memory specifications. The S25FL064LABBHB020 carries Active product status, providing extended availability compared to the Last Time Buy designation of the S25FL064LABBHB030.

Selection between these parts depends on PCB layout constraints. The BGA ball grid arrangement (6x8 versus 8x6) affects footprint geometry and trace routing. Verify that the substitute part's ball grid layout is compatible with existing PCB design files and assembly equipment capabilities before implementation.

Both parts satisfy AEC-Q100 automotive qualification requirements and maintain ROHS3 compliance, ensuring regulatory and environmental standards are met in either configuration.

Frequently Asked Questions (FAQ)

Q: Can the S25FL064LABBHB020 replace the S25FL064LABBHB030 in existing designs?

A: Yes, provided the PCB footprint accommodates the 8x6 ball grid layout. The electrical interface, memory capacity, and performance characteristics are identical. Verify footprint compatibility with your PCB design before component procurement.

Q: What is the difference between the 6x8 and 8x6 BGA configurations?

A: Both configurations contain 24 balls in a TBGA package. The difference is the physical arrangement of these balls on the package substrate. The 6x8 layout has 6 columns and 8 rows, while the 8x6 layout has 8 columns and 6 rows. This affects PCB footprint dimensions and trace routing patterns.

Q: Are both parts qualified to the same automotive standards?

A: Yes. Both the S25FL064LABBHB030 and S25FL064LABBHB020 are AEC-Q100 qualified and suitable for automotive applications within the specified temperature range of -40°C to 105°C.

Q: Why is the S25FL064LABBHB030 in Last Time Buy status?

A: Last Time Buy status indicates that Infineon Technologies is discontinuing this specific part number variant. The S25FL064LABBHB020, which maintains Active status, is the recommended alternative for new designs and ongoing production.

Q: Do both parts support the same interface protocols?

A: Yes. Both parts support SPI, Quad I/O, and QPI interface modes at 108 MHz clock frequency with identical voltage and timing specifications.