RTQ040P02TR P-Channel MOSFET 20V 4A Equivalent & Substitute Parts

Part Overview

The RTQ040P02TR is a P-Channel MOSFET manufactured by Rohm Semiconductor, rated for 20V drain-to-source voltage and 4A continuous drain current at 25°C. The device is housed in a TSMT6 (SC-95) surface mount package and dissipates a maximum of 1.25W at ambient temperature. This part carries a "Not For New Designs" product status, indicating that alternative components should be evaluated for new circuit implementations. Identifying equivalent and substitute parts is necessary to ensure design continuity, improve component availability, and optimize performance characteristics for specific application requirements.

Substiute Parts

RTQ040P02TR
Rohm SemiconductorIn Stock: 6308RTQ040P02TR Datasheet
RTQ040P02TR
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AO6409A
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FDC604P
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FDC638APZ
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Key Parameters

Parameter Value Unit
FET Type P-Channel
Drain-to-Source Voltage (Vdss) 20 V
Continuous Drain Current (Id) @ 25°C 4 A
On-Resistance (Rds On) @ 4A, 4.5V 50 mOhm
Gate Threshold Voltage (Vgs(th)) @ 1mA 2 V
Gate Charge (Qg) @ 4.5V 12.2 nC
Maximum Gate Voltage (Vgs) ±12 V
Input Capacitance (Ciss) @ 10V 1350 pF
Power Dissipation (Max) 1.25 W
Operating Temperature (TJ) 150 °C
Package Type SOT-23-6 Thin (TSOT-23-6)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the RTQ040P02TR is determined by strict alignment of electrical and mechanical parameters. The following criteria establish valid substitute relationships:

Primary Substitution Criteria:

  • FET Type: P-Channel (mandatory match)
  • Drain-to-Source Voltage (Vdss): 20V (mandatory match)
  • Continuous Drain Current (Id): Equal to or greater than 4A
  • Package Type: SOT-23-6 Thin (TSOT-23-6) or mechanically compatible surface mount packages
  • Surface Mount Technology: Required for PCB assembly compatibility
  • RoHS3 Compliance: Required for regulatory alignment
  • Moisture Sensitivity Level: MSL 1 (Unlimited) preferred for handling consistency

Secondary Electrical Parameters:

  • On-Resistance (Rds On): Lower values indicate improved performance; values within ±30% of 50mOhm are acceptable
  • Gate Threshold Voltage (Vgs(th)): Range of 900mV to 2V accommodates different drive circuit designs
  • Maximum Gate Voltage (Vgs): ±8V or ±12V both acceptable; ±12V provides greater design margin
  • Power Dissipation: Equal to or greater than 1.25W ensures thermal compatibility
  • Operating Temperature: 150°C maximum junction temperature (TJ) is standard across all candidates

Substitute parts may differ in package designation (SuperSOT-6, 6-TSOP, SOT-26, SOT-23-3) provided mechanical footprint compatibility is verified during design integration. Parts with "Active" product status are preferred over "Not For New Designs" status for long-term supply assurance.

Parameter Comparison

Manufacturer Part Number Manufacturer Vdss (V) Id @ 25°C (A) Rds On @ Id, 4.5V (mOhm) Vgs(th) (V) Qg @ 4.5V (nC) Vgs Max (V) Ciss @ 10V (pF) Power Diss (W) Package Product Status
RTQ040P02TR Rohm Semiconductor 20 4.0 50 2.0 12.2 ±12 1350 1.25 TSMT6 (SC-95) Not For New Designs
AO6409A Alpha & Omega Semiconductor Inc. 20 5.5 41 0.9 11 ±8 905 2.1 6-TSOP (SC-74) Not For New Designs
BSL211SPH6327XTSA1 Infineon Technologies 20 4.7 67 1.2 12.4 ±12 654 2.0 PG-TSOP6-6 Active
DMP2066LDM-7 Diodes Incorporated 20 4.6 40 1.2 10.1 ±12 820 1.25 SOT-26 Active
DMP2305UVT-7 Diodes Incorporated 20 4.2 60 0.9 7.6 ±8 727 1.4 SOT-23-3 Active
FDC602P onsemi 20 5.5 35 1.5 20 ±12 1456 1.6 SuperSOT-6 Active
FDC604P onsemi 20 5.5 33 1.5 30 ±8 1926 1.6 SuperSOT-6 Active
FDC608PZ onsemi 20 5.8 30 1.5 23 ±12 1330 1.6 SuperSOT-6 Active
FDC638APZ onsemi 20 4.5 43 1.5 12 ±12 1000 1.6 SuperSOT-6 Active
FDC640P onsemi 20 4.5 53 1.5 13 ±12 890 1.6 SuperSOT-6 Active
FDC642P onsemi 20 4.0 65 1.5 16 ±8 925 1.6 SuperSOT-6 Active

Engineering Selection Recommendations

Recommended Primary Substitutes (Active Product Status):

The following parts are recommended as primary substitutes due to active product status, ensuring long-term availability and supply chain stability:

FDC640P (onsemi) — Closest electrical match with 4.5A continuous drain current, 53mOhm on-resistance, and ±12V gate voltage rating. SuperSOT-6 package provides mechanical compatibility with TSMT6 footprint. Active product status supports new design integration.

DMP2066LDM-7 (Diodes Incorporated) — Delivers 4.6A continuous drain current with superior 40mOhm on-resistance, reducing power dissipation. SOT-26 package requires footprint verification. Active product status and ±12V gate voltage rating provide design flexibility.

FDC638APZ (onsemi) — Rated for 4.5A continuous drain current with 43mOhm on-resistance. SuperSOT-6 package maintains mechanical compatibility. Gate charge of 12nC closely matches RTQ040P02TR specification. Active product status recommended for new designs.

Secondary Substitutes (Higher Current Capability):

FDC608PZ (onsemi) — Provides 5.8A continuous drain current with 30mOhm on-resistance, offering performance margin above RTQ040P02TR requirements. SuperSOT-6 package compatible. Active product status. Suitable for applications requiring enhanced current handling.

FDC602P (onsemi) — Rated for 5.5A continuous drain current with 35mOhm on-resistance. SuperSOT-6 package. Active product status. Higher input capacitance (1456pF) requires gate drive circuit evaluation.

Conditional Substitutes (Package Compatibility Required):

BSL211SPH6327XTSA1 (Infineon Technologies) — Active product status with OptiMOS™ series designation. 4.7A continuous drain current and ±12V gate voltage. PG-TSOP6-6 package requires mechanical footprint verification before selection.

DMP2305UVT-7 (Diodes Incorporated) — Active product status. 4.2A continuous drain current. SOT-23-3 package differs from TSMT6; footprint compatibility must be confirmed. Lower gate charge (7.6nC) reduces drive circuit power consumption.

Not Recommended for New Designs:

AO6409A (Alpha & Omega Semiconductor Inc.) — "Not For New Designs" product status. Although electrical parameters are acceptable, obsolescence risk and limited future availability make this unsuitable for new circuit implementations.

Frequently Asked Questions (FAQ)

Q: Can I directly replace RTQ040P02TR with any of these substitute parts without PCB modification?

A: Direct replacement without PCB modification is possible only with parts sharing identical package designations. RTQ040P02TR uses TSMT6 (SC-95) packaging. FDC640P, FDC638APZ, FDC608PZ, FDC604P, and FDC602P use SuperSOT-6 packaging, which may have compatible footprints. DMP2066LDM-7 uses SOT-26 packaging, and DMP2305UVT-7 uses SOT-23-3 packaging, both requiring footprint verification. BSL211SPH6327XTSA1 uses PG-TSOP6-6 packaging. Mechanical compatibility must be confirmed against PCB layout specifications before implementation.

Q: What is the significance of the "Not For New Designs" product status on RTQ040P02TR?

A: "Not For New Designs" status indicates that Rohm Semiconductor is not recommending this part for new circuit implementations. This classification typically reflects end-of-life planning, reduced manufacturing priority, or availability constraints. For new designs, parts with "Active" product status are preferred to ensure long-term supply chain stability and manufacturer support.

Q: Which substitute part offers the best on-resistance performance?

A: FDC604P delivers the lowest on-resistance at 33mOhm when operating at 5.5A and 4.5V gate voltage. FDC608PZ follows closely at 30mOhm at 5.8A and 4.5V. Lower on-resistance reduces power dissipation and heat generation, improving overall circuit efficiency. However, gate charge and input capacitance specifications must also be evaluated for compatibility with the gate drive circuit.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed in this reference carry RoHS3 compliance certification, matching the RTQ040P02TR specification. All parts also maintain MSL 1 (Unlimited) moisture sensitivity level, ensuring consistent handling and storage requirements.

Q: What is the difference between ±8V and ±12V maximum gate voltage ratings?

A: RTQ040P02TR is rated for ±12V maximum gate voltage, providing a wider operating margin for gate drive circuits. Substitute parts with ±8V ratings (AO6409A, DMP2305UVT-7, FDC604P, FDC642P) require gate drive circuits that maintain gate voltage within ±8V limits. Parts with ±12V ratings (BSL211SPH6327XTSA1, DMP2066LDM-7, FDC602P, FDC608PZ, FDC638APZ, FDC640P) offer greater design flexibility and are preferred for applications with variable gate drive voltages.

Q: How does gate charge (Qg) affect circuit performance?

A: Gate charge represents the total charge required to switch the MOSFET from off to on state. RTQ040P02TR specifies 12.2nC at 4.5V. Substitute parts range from 7.6nC (DMP2305UVT-7) to 30nC (FDC604P). Lower gate charge reduces switching losses and allows faster switching speeds, beneficial for high-frequency applications. Higher gate charge increases gate drive circuit power consumption but may provide improved noise immunity. Selection depends on specific application switching frequency and gate drive circuit design.

Q: What is the importance of input capacitance (Ciss) in MOSFET selection?

A: Input capacitance affects gate drive circuit design and switching performance. RTQ040P02TR specifies 1350pF at 10V. Substitute parts range from 654pF (BSL211SPH6327XTSA1) to 1926pF (FDC604P). Higher input capacitance requires greater gate charge and increases switching transition time. Lower input capacitance enables faster switching and reduces gate drive power requirements. Selection should align with gate drive circuit capabilities and application switching frequency requirements.

Q: Can I use a substitute part with higher continuous drain current rating than RTQ040P02TR?

A: Yes. Substitute parts with higher continuous drain current ratings (5.5A or 5.8A) are electrically compatible and provide performance margin above RTQ040P02TR requirements. Higher current ratings do not create compatibility issues; they simply indicate the part can handle greater current loads. However, on-resistance, gate charge, and input capacitance specifications must still be evaluated for circuit performance impact.

Q: What packaging considerations should I evaluate before selecting a substitute?

A: Package type affects PCB footprint, thermal performance, and assembly compatibility. RTQ040P02TR uses TSMT6 (SC-95) packaging. Substitute parts use SuperSOT-6, 6-TSOP, SOT-26, or SOT-23-3 packages. Verify that the selected substitute package footprint matches PCB layout or can be accommodated through minor layout modifications. Thermal performance may vary between packages; verify power dissipation requirements are met. Assembly equipment compatibility should be confirmed with manufacturing partners.

Q: Are there any electrical parameter mismatches I should be aware of when substituting?

A: All substitute parts maintain 20V drain-to-source voltage and 4A or greater continuous drain current ratings, ensuring basic electrical compatibility. However, on-resistance values vary from 30mOhm to 67mOhm, affecting power dissipation. Gate threshold voltage ranges from 0.9V to 2V, potentially requiring gate drive circuit adjustment. Maximum gate voltage ratings differ (±8V vs. ±12V), affecting gate drive circuit design margins. Input capacitance and gate charge specifications vary significantly, impacting switching performance. Evaluate these parameters against specific application requirements before final selection.

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