RSFKL RVG Equivalent & Substitute Parts

Part Overview

The RSFKL RVG is a general-purpose fast recovery diode manufactured by Taiwan Semiconductor Corporation, rated for 800 V DC reverse voltage and 500 mA average rectified current. This component is classified as a Surface Mount Sub SMA diode in the DO-219AB package family and maintains Active product status. The device is suitable for applications requiring fast recovery characteristics with reverse recovery time of 500 ns and forward voltage of 1.3 V at 500 mA.

Substitute parts are identified based on matching electrical specifications, mechanical compatibility, and package equivalence. Alternative sources provide equivalent performance characteristics while maintaining compliance with industry standards and regulatory requirements.

Substiute Parts

RSFKL RVG

Taiwan Semiconductor CorporationIn Stock: 990RSFKL RVG Datasheet

Current PartRFQ

RS07K-GS08

Vishay General Semiconductor - Diodes DivisionIn Stock: 50355RS07K-GS08 Datasheet

Parametric EquivalentRFQ

RS07K-GS18

Vishay General Semiconductor - Diodes DivisionIn Stock: 50878RS07K-GS18 Datasheet

Parametric EquivalentRFQ

RS07K-HM3-08

Vishay General Semiconductor - Diodes DivisionIn Stock: 12296RS07K-HM3-08 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the RSFKL RVG are qualified based on the following electrical and mechanical parameters:

Electrical Equivalence Criteria:

• Voltage - DC Reverse (Vr) (Max): 800 V
• Current - Average Rectified (Io): 500 mA
• Reverse Recovery Time (trr): ≤ 500 ns (Fast Recovery classification)
• Operating Temperature - Junction: -55°C to 150°C
• Capacitance @ Vr, F: 4 pF @ 4 V, 1 MHz

Mechanical Compatibility Criteria:

• Package / Case: DO-219AB
• Mounting Type: Surface Mount
• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)

All substitute parts listed maintain identical or superior performance in reverse recovery time (300 ns versus 500 ns) and reverse leakage current (2 µA versus 5 µA), while preserving all critical electrical ratings and environmental specifications. Packaging variations (Tape & Reel versus Cut Tape) represent distribution format differences only and do not affect functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

All three substitute parts (RS07K-GS08, RS07K-GS18, RS07K-HM3-08) are direct functional equivalents to the RSFKL RVG and are suitable for replacement in applications requiring 800 V, 500 mA fast recovery diodes in DO-219AB surface mount packages.

RS07K-GS18 is the preferred substitute when Tape & Reel packaging is required, matching the original RSFKL RVG distribution format. This part maintains identical packaging specifications while providing improved reverse recovery time (300 ns) and reduced reverse leakage current (2 µA).

RS07K-GS08 and RS07K-HM3-08 are suitable alternatives when Cut Tape or Digi-Reel® packaging formats are acceptable. RS07K-HM3-08 is designated as part of the eSMP® series. Both parts deliver equivalent electrical performance with superior reverse recovery characteristics.

All substitute parts maintain Active product status, ROHS3 compliance, and unlimited moisture sensitivity rating (MSL 1). The Vishay General Semiconductor parts include AEC-Q101 automotive qualification, providing additional quality assurance for applications requiring automotive-grade components.

Frequently Asked Questions (FAQ)

Q: Can RS07K-GS08, RS07K-GS18, and RS07K-HM3-08 be used interchangeably with RSFKL RVG?

A: Yes. All three parts meet the electrical specifications of the RSFKL RVG with identical voltage ratings (800 V), current ratings (500 mA), and operating temperature range (-55°C to 150°C). All are packaged in DO-219AB surface mount configuration. The primary difference is packaging format: RS07K-GS18 uses Tape & Reel matching the original, while RS07K-GS08 and RS07K-HM3-08 use Cut Tape or Digi-Reel® formats.

Q: What is the difference between Sub SMA and DO-219AB package designations?

A: Sub SMA is a supplier device package designation used by Taiwan Semiconductor Corporation. DO-219AB is the industry-standard package classification for the same physical form factor. These designations refer to identical mechanical and electrical package specifications. All substitute parts use the DO-219AB designation, which is functionally equivalent to the Sub SMA package of the original part.

Q: Do the substitute parts have better performance than the RSFKL RVG?

A: The substitute parts demonstrate improved reverse recovery time (300 ns versus 500 ns) and lower reverse leakage current (2 µA versus 5 µA). These represent performance enhancements while maintaining full compatibility with the original specifications. Forward voltage characteristics remain equivalent at 1.3 V maximum.

Q: Are there packaging considerations when selecting between the substitute parts?

A: Yes. RS07K-GS18 is supplied in Tape & Reel format, matching the original RSFKL RVG distribution. RS07K-GS08 and RS07K-HM3-08 are supplied in Cut Tape or Digi-Reel® formats. Selection depends on assembly line requirements and inventory management practices. All three parts are electrically and mechanically equivalent.

Q: Do all parts meet compliance requirements?

A: All parts are ROHS3 compliant, REACH unaffected, and classified as MSL 1 (unlimited moisture sensitivity). The Vishay parts include AEC-Q101 automotive qualification. All parts maintain Active product status with unlimited shelf life under MSL 1 conditions.

Q: What is the significance of the eSMP® designation on RS07K-HM3-08?

A: eSMP® is a Vishay product series designation indicating enhanced surface mount package characteristics. This designation does not affect electrical equivalence or functional compatibility with the RSFKL RVG. The part maintains identical electrical ratings and package dimensions.