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RSFKL MHG Equivalent & Substitute Parts
Part Overview
The RSFKL MHG is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 800 V DC reverse voltage and 500 mA average rectified current. This surface mount component operates in the fast recovery category with a reverse recovery time of 500 ns and is housed in a DO-219AB (Sub SMA) package. The device is Active product status and RoHS3 compliant, suitable for applications requiring high-voltage rectification in compact form factors.
Substitute parts become necessary when the primary manufacturer part is unavailable, when alternative packaging formats are required for production processes, or when supply chain optimization demands component standardization across multiple qualified sources.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 800 | V |
| Current - Average Rectified (Io) | 500 | mA |
| Voltage - Forward (Vf) (Max) @ If | 1.3 V @ 500 mA | V |
| Speed Classification | Fast Recovery ≤ 500ns, > 200mA (Io) | — |
| Reverse Recovery Time (trr) | 500 | ns |
| Current - Reverse Leakage @ Vr | 5 | µA @ 800 V |
| Capacitance @ Vr, F | 4 | pF @ 4V, 1MHz |
| Mounting Type | Surface Mount | — |
| Package / Case | DO-219AB | — |
| Operating Temperature - Junction | -55 to 150 | °C |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the RSFKL MHG is determined by strict equivalence across the following critical parameters:
Mandatory Equivalence Criteria:
- Voltage - DC Reverse (Vr) (Max): 800 V
- Current - Average Rectified (Io): 500 mA
- Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
- Mounting Type: Surface Mount
- Package / Case: DO-219AB
- Operating Temperature Range: -55°C to 150°C
- RoHS Status: ROHS3 Compliant
- Moisture Sensitivity Level: 1 (Unlimited)
All three substitute parts listed (RS07K-GS08, RS07K-GS18, RS07K-HM3-08) meet these mandatory criteria. Differences in packaging format (Cut Tape & Digi-Reel® versus Tape & Reel) and reverse recovery time (300 ns versus 500 ns) represent secondary variations that do not affect functional equivalence within the specified electrical parameters.
Parameter Comparison
| Parameter | RSFKL MHG | RS07K-GS08 | RS07K-GS18 | RS07K-HM3-08 |
|---|---|---|---|---|
| Manufacturer | Taiwan Semiconductor Corporation | Vishay General Semiconductor - Diodes Division | Vishay General Semiconductor - Diodes Division | Vishay General Semiconductor - Diodes Division |
| Voltage - DC Reverse (Vr) (Max) | 800 V | 800 V | 800 V | 800 V |
| Current - Average Rectified (Io) | 500 mA | 500 mA | 500 mA | 500 mA |
| Voltage - Forward (Vf) (Max) @ If | 1.3 V @ 500 mA | 1.3 V @ 1 A | 1.3 V @ 1 A | 1.3 V @ 1 A |
| Speed Classification | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 500 ns | 300 ns | 300 ns | 300 ns |
| Current - Reverse Leakage @ Vr | 5 µA @ 800 V | 2 µA @ 800 V | 2 µA @ 800 V | 2 µA @ 800 V |
| Capacitance @ Vr, F | 4 pF @ 4V, 1MHz | 4 pF @ 4V, 1MHz | 4 pF @ 4V, 1MHz | 4 pF @ 4V, 1MHz |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | DO-219AB | DO-219AB | DO-219AB | DO-219AB |
| Operating Temperature - Junction | -55°C to 150°C | -55°C to 150°C | -55°C to 150°C | -55°C to 150°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| Packaging Format | Sub SMA | Cut Tape (CT) & Digi-Reel® | Tape & Reel (TR) | Cut Tape (CT) & Digi-Reel® |
| Grade | — | Automotive | Automotive | Automotive |
| Qualification | — | AEC-Q101 | AEC-Q101 | AEC-Q101 |
| Series | — | — | — | eSMP® |
Engineering Selection Recommendations
All three substitute parts are Active product status and maintain full RoHS3 compliance and REACH unaffected status, matching the regulatory requirements of the RSFKL MHG.
RS07K-GS08 and RS07K-HM3-08 are supplied in Cut Tape & Digi-Reel® packaging format, suitable for automated pick-and-place assembly operations requiring individual component feeding. RS07K-HM3-08 is designated as part of the eSMP® series.
RS07K-GS18 is supplied in Tape & Reel (TR) format, optimized for high-volume production environments utilizing standard reel-based component handling systems.
All substitute parts carry Automotive grade designation and AEC-Q101 qualification, indicating suitability for automotive applications. The substitute parts exhibit lower reverse leakage current (2 µA versus 5 µA) and faster reverse recovery time (300 ns versus 500 ns), representing improved performance characteristics within the same functional specification envelope.
Selection between substitute parts should be based on production process requirements and packaging format compatibility with existing assembly infrastructure.
Frequently Asked Questions (FAQ)
Q: Can RS07K-GS08, RS07K-GS18, and RS07K-HM3-08 be used interchangeably with RSFKL MHG?
A: Yes. All three parts meet the mandatory electrical and mechanical equivalence criteria: 800 V reverse voltage rating, 500 mA average rectified current, fast recovery speed classification, DO-219AB package, surface mount configuration, and identical operating temperature range. Differences in packaging format and reverse recovery time do not affect functional substitution within the specified parameters.
Q: What is the difference between Cut Tape & Digi-Reel® and Tape & Reel packaging?
A: Cut Tape & Digi-Reel® format supplies components on individual tape segments suitable for manual or semi-automated assembly processes. Tape & Reel (TR) format supplies components on continuous reels optimized for fully automated high-volume production lines. Both formats contain identical components; the difference is in supply presentation and handling methodology.
Q: Why do the substitute parts have lower reverse leakage current and faster reverse recovery time?
A: These represent manufacturing improvements in the Vishay RS07 series compared to the Taiwan Semiconductor RSFKL series. Lower reverse leakage current (2 µA versus 5 µA) and faster reverse recovery time (300 ns versus 500 ns) indicate enhanced device performance. These improvements are compatible with applications designed for the RSFKL MHG specifications.
Q: Are the substitute parts suitable for automotive applications?
A: RS07K-GS08, RS07K-GS18, and RS07K-HM3-08 carry Automotive grade designation and AEC-Q101 qualification. The RSFKL MHG does not specify automotive qualification. Automotive-qualified substitutes are suitable for both automotive and general industrial applications.
Q: What is the significance of the eSMP® designation on RS07K-HM3-08?
A: eSMP® is a Vishay product series designation. This designation does not affect electrical equivalence or substitution suitability. RS07K-HM3-08 maintains identical electrical parameters and package specifications as the other substitute parts.
Q: Can I mix substitute parts from different manufacturers in the same production run?
A: Yes. All substitute parts meet identical electrical specifications, package requirements, and compliance standards. Component selection can be based on availability, packaging format requirements, and supply chain optimization without affecting circuit performance or reliability.
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