RNC55H3012FPRSL Equivalent & Substitute Parts

Part Overview

The RNC55H3012FPRSL is a 30.1 kOhms ±1% metal film through-hole resistor rated at 0.125W (1/8W) in axial package configuration. This component is manufactured by Vishay Dale and conforms to military specification MIL-PRF-55182/01. The part is currently active in production with 764 units in stock. Substitute parts are identified when packaging format differs while maintaining identical electrical and mechanical specifications, enabling procurement flexibility across supply chain variations.

Substiute Parts

RNC55H3012FPRSL

Vishay DaleIn Stock: 807RNC55H3012FPRSL Datasheet

Current PartRFQ

RNC55H3012FSRE6

Vishay DaleIn Stock: 1997RNC55H3012FSRE6 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the RNC55H3012FPRSL is determined by strict equivalence across the following parameters:

• Resistance value: 30.1 kOhms
• Tolerance: ±1%
• Power rating: 0.125W (1/8W)
• Composition: Metal Film
• Temperature coefficient: ±50ppm/°C
• Operating temperature range: -65°C to 175°C
• Package type: Axial
• Physical dimensions: 0.094" Dia × 0.250" L
• Series: Military, MIL-PRF-55182/01, RNC55
• Number of terminations: 2

The identified substitute part RNC55H3012FSRE6 maintains complete electrical and mechanical equivalence. The only difference between the main part and substitute is the packaging format: the main part is supplied in Tape & Reel (TR) configuration, while the substitute is supplied in Cut Tape (CT) configuration. Both parts share identical component specifications and are manufactured by Vishay Dale under the same military series designation.

Parameter Comparison

Engineering Selection Recommendations

Both RNC55H3012FPRSL and RNC55H3012FSRE6 are active production components manufactured by Vishay Dale. Selection between these parts is based on packaging and procurement requirements rather than electrical performance.

The RNC55H3012FPRSL in Tape & Reel format is suitable for high-volume automated assembly operations where continuous reel feeding is required. The RNC55H3012FSRE6 in Cut Tape format provides flexibility for lower-volume applications, kit assembly, or situations where individual component handling is preferred.

The substitute part RNC55H3012FSRE6 demonstrates a lower failure rate specification (S at 0.001% versus P at 0.1%), indicating enhanced reliability characteristics under the same military standard MIL-PRF-55182/01. Both parts are RoHS non-compliant and carry identical ECCN and HTSUS classifications.

Frequently Asked Questions (FAQ)

Q: Can RNC55H3012FSRE6 be used as a direct replacement for RNC55H3012FPRSL in circuit design?

A: Yes. Both parts are electrically and mechanically identical with matching resistance values, tolerances, power ratings, temperature coefficients, and operating ranges. The only difference is packaging format (Cut Tape versus Tape & Reel).

Q: What is the difference between Tape & Reel and Cut Tape packaging?

A: Tape & Reel packaging supplies components on continuous reels suitable for automated pick-and-place assembly. Cut Tape packaging provides components pre-cut from tape, typically used for manual assembly, lower-volume production, or component kits.

Q: Are there any compliance or certification differences between these parts?

A: Both parts share identical military series designation (MIL-PRF-55182/01, RNC55), ECCN classification (EAR99), and HTSUS code (8533.21.0090). Both are RoHS non-compliant and not subject to Moisture Sensitivity Level classification.

Q: What does the failure rate designation mean?

A: Failure rate is specified under military standards. The RNC55H3012FSRE6 carries designation S (0.001%), indicating lower predicted failure rate compared to the RNC55H3012FPRSL designation P (0.1%), both under MIL-PRF-55182/01 conditions.

Q: Can these parts be used interchangeably in military or aerospace applications?

A: Both parts conform to military specification MIL-PRF-55182/01. Application suitability depends on specific procurement requirements, assembly process capabilities, and documented design specifications for your application.