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RN41N-I/RM477 Equivalent & Substitute Parts
Part Overview
The RN41N-I/RM477 is a Bluetooth v2.1 +EDR Class 1 transceiver module manufactured by Microchip Technology, designed for 2.4GHz RF applications requiring surface mount integration. This module operates with a supply voltage range of 3V to 3.6V and delivers 11.9dBm output power with -86dBm sensitivity. The product is classified as obsolete, necessitating identification of active equivalent components for new designs and ongoing production requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Technology |
| RF Family/Standard | Bluetooth |
| Frequency | 2.4GHz |
| Mounting Type | Surface Mount |
| Package Type | 35-SMD Module |
| Voltage Supply Range | 3V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the RN41N-I/RM477 is determined by the following critical parameters:
RF Standard Compatibility: Both the main part and substitute operate within the Bluetooth RF family at 2.4GHz frequency, enabling functional replacement in wireless communication applications.
Mounting Technology: Surface mount configuration is maintained across both components, ensuring compatibility with existing PCB assembly processes and design layouts.
Manufacturer Continuity: Microchip Technology manufactures both the obsolete RN41N-I/RM477 and the active substitute RN4678-V/RM122, providing design support and supply chain consistency.
Supply Voltage Overlap: The substitute operates at 3.3V to 4.2V, which encompasses the original 3V to 3.6V range, allowing operation within the specified voltage window.
The RN4678-V/RM122 is identified as the manufacturer-recommended substitute, transitioning from Bluetooth v2.1 +EDR to Bluetooth v5.0 protocol with enhanced performance characteristics and active product status.
Parameter Comparison
| Parameter | RN41N-I/RM477 | RN4678-V/RM122 |
|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology |
| RF Family/Standard | Bluetooth | Bluetooth |
| Protocol | Bluetooth v2.1 +EDR, Class 1 | Bluetooth v5.0 |
| Frequency | 2.4GHz | 2.4GHz |
| Data Rate | 3Mbps | 1Mbps |
| Power Output | 11.9dBm | 1.5dBm |
| Sensitivity | -86dBm | -92dBm |
| Serial Interfaces | SPI, UART | UART |
| Antenna Type | Antenna Not Included | Integrated, Chip |
| Voltage Supply | 3V ~ 3.6V | 3.3V ~ 4.2V |
| Current Receiving | 35mA | 37mA |
| Current Transmitting | 65mA | 43mA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -20°C ~ 70°C |
| Package/Case | 35-SMD Module | 33-SMD Module |
| Product Status | Obsolete | Active |
| RoHS Status | Not Specified | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Product Status Consideration: The RN41N-I/RM477 is classified as obsolete, making the active RN4678-V/RM122 the appropriate selection for new designs and production continuity. The substitute maintains active product status with Microchip Technology, ensuring ongoing technical support and supply availability.
Compliance and Certification: The RN4678-V/RM122 is ROHS3 compliant and carries REACH Unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution. Both components maintain REACH Unaffected classification.
Supply Chain Availability: Current inventory indicates 1134 units of the RN4678-V/RM122 available as new original stock, compared to 661 units of the obsolete RN41N-I/RM477. The substitute provides superior supply chain security for ongoing production requirements.
Functional Compatibility: Both components operate at 2.4GHz with surface mount configuration and Microchip Technology manufacturing. The substitute's Bluetooth v5.0 protocol represents an advancement from the original v2.1 +EDR specification, providing enhanced performance characteristics within the same RF family.
Frequently Asked Questions (FAQ)
Q: Can the RN4678-V/RM122 directly replace the RN41N-I/RM477 in existing designs?
A: Direct replacement requires evaluation of application-specific requirements. Both components operate at 2.4GHz with surface mount configuration and compatible supply voltage ranges. However, differences in package type (35-SMD versus 33-SMD), serial interfaces (SPI removal in substitute), and operating temperature ranges (-40°C to 85°C versus -20°C to 70°C) must be assessed against design specifications.
Q: What are the key differences in electrical performance between these modules?
A: The RN4678-V/RM122 provides improved sensitivity (-92dBm versus -86dBm) and reduced transmitting current (43mA versus 65mA). The original RN41N-I/RM477 offers higher data rate (3Mbps versus 1Mbps) and greater output power (11.9dBm versus 1.5dBm). Protocol advancement from Bluetooth v2.1 +EDR to v5.0 in the substitute provides enhanced range and reliability.
Q: Are there serial interface compatibility considerations?
A: The RN41N-I/RM477 supports both SPI and UART interfaces, while the RN4678-V/RM122 supports UART only. Applications requiring SPI communication must implement alternative interface solutions or select different substitute components.
Q: What is the significance of the antenna configuration difference?
A: The RN41N-I/RM477 requires external antenna integration (Antenna Not Included), while the RN4678-V/RM122 features integrated chip antenna. This eliminates external antenna design and layout considerations in the substitute, simplifying PCB integration.
Q: How do the package differences affect PCB layout?
A: The RN41N-I/RM477 uses 35-SMD Module packaging while the RN4678-V/RM122 uses 33-SMD Module packaging. PCB footprint modifications are required for substitution. Physical dimensions and pin configurations must be verified against design layout constraints.
Q: What is the operating temperature range impact?
A: The RN41N-I/RM477 operates from -40°C to 85°C, while the RN4678-V/RM122 operates from -20°C to 70°C. Applications requiring operation below -20°C or above 70°C cannot use the substitute without thermal management modifications or alternative component selection.
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