RN1111MFV,L3F Equivalent & Substitute Parts

Part Overview

The RN1111MFV,L3F is a pre-biased NPN bipolar junction transistor (BJT) manufactured by Toshiba Semiconductor and Storage. This surface mount component operates at 50 V collector-emitter breakdown voltage with a maximum collector current of 100 mA and 150 mW power dissipation. The device features integrated base biasing resistors (10 kOhms) and is packaged in the VESM (SOT-723) form factor. The part maintains Active product status with ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Substitute parts are identified when equivalent electrical performance parameters align with the main part specifications, enabling direct replacement in circuit applications where package compatibility and electrical characteristics match design requirements.

Substiute Parts

RN1111MFV,L3F

Toshiba Semiconductor and StorageIn Stock: 8204RN1111MFV,L3F Datasheet

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DTC114TM3T5G

onsemiIn Stock: 45388DTC114TM3T5G Datasheet

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DTC114TMT2L

Rohm SemiconductorIn Stock: 125404DTC114TMT2L Datasheet

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NSBC114TF3T5G

onsemiIn Stock: 626NSBC114TF3T5G Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the RN1111MFV,L3F is determined by alignment of the following critical parameters:

Primary Substitution Criteria:

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) Max: 100 mA
• Voltage - Collector Emitter Breakdown (Max): 50 V
• Resistor - Base (R1): 10 kOhms
• Mounting Type: Surface Mount
• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)

Package Compatibility:

• Primary package: SOT-723 (VESM supplier designation)
• Alternative package: SOT-1123 (larger footprint, requires PCB layout modification)

All identified substitute parts meet the primary electrical criteria. Package selection depends on PCB layout constraints and available board space. Parts with SOT-723 packaging provide direct footprint compatibility. The SOT-1123 variant requires design review for mechanical fit.

Parameter Comparison

Engineering Selection Recommendations

DTC114TM3T5G (onsemi): This part provides direct electrical and mechanical compatibility with the RN1111MFV,L3F. Both devices operate at identical voltage and current specifications with matching 10 kOhms base resistor values. The SOT-723 package ensures footprint compatibility. The DTC114TM3T5G offers higher power dissipation capability (260 mW versus 150 mW), providing additional thermal margin. Product status is Active with ROHS3 compliance and unlimited MSL rating. Inventory availability is substantial (45,300 units).

DTC114TMT2L (Rohm Semiconductor): This part meets all primary electrical substitution criteria with identical voltage, current, and base resistor specifications. The SOT-723 package provides direct footprint compatibility. Power rating matches the main part at 150 mW. The device includes transition frequency specification (250 MHz) not provided for the main part. Product status is Active with ROHS3 compliance and unlimited MSL rating. Inventory availability is high (125,300 units). Packaging is supplied as Cut Tape (CT) and Digi-Reel format.

NSBC114TF3T5G (onsemi): This part meets all primary electrical substitution criteria with identical voltage, current, and base resistor specifications. However, the package differs from the main part: SOT-1123 versus SOT-723. The larger SOT-1123 footprint requires PCB layout modification and is not a direct drop-in replacement. Product status is Last Time Buy, indicating limited future availability. ROHS3 compliance and unlimited MSL rating are maintained. Inventory is limited (611 units). This part is suitable only when PCB layout accommodates the larger package footprint.

Frequently Asked Questions (FAQ)

Q: Can DTC114TM3T5G replace RN1111MFV,L3F in existing designs without PCB modification?

A: Yes. Both parts share identical electrical specifications (50 V, 100 mA, 10 kOhms base resistor) and SOT-723 packaging. Direct footprint compatibility is confirmed. No PCB layout changes are required.

Q: What is the difference between SOT-723 and SOT-1123 packages?

A: SOT-723 is a smaller surface mount package suitable for space-constrained applications. SOT-1123 is a larger package variant. The NSBC114TF3T5G uses SOT-1123 packaging and requires PCB redesign for mechanical fit. Direct substitution is not possible without layout modification.

Q: Why does DTC114TM3T5G have higher power dissipation (260 mW) than the main part (150 mW)?

A: Higher power rating indicates greater thermal capability. This provides additional design margin and does not affect electrical compatibility. The device operates within the same voltage and current envelope as the main part.

Q: Is NSBC114TF3T5G recommended for new designs?

A: NSBC114TF3T5G carries Last Time Buy status, indicating discontinued production. This part is not recommended for new designs requiring long-term component availability. DTC114TM3T5G or DTC114TMT2L are preferred for ongoing production.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All identified substitute parts (DTC114TM3T5G, DTC114TMT2L, NSBC114TF3T5G) maintain ROHS3 compliance matching the main part specification.

Q: What is the significance of MSL 1 (Unlimited) rating?

A: MSL 1 indicates unlimited shelf life without moisture baking requirements. All parts in this comparison share this rating, confirming equivalent moisture sensitivity handling.

Q: Can DTC114TMT2L be used as a direct replacement despite different packaging format (Cut Tape vs. Tape & Reel)?

A: Yes. Packaging format (Cut Tape, Digi-Reel, or Tape & Reel) refers to supply method, not component form factor. All three formats contain the same SOT-723 package. Component-level compatibility is identical. Packaging format selection depends on assembly process requirements and inventory management.