RFX5000B Equivalent & Substitute Parts

Part Overview

The RFX5000B is an RF front-end module manufactured by Skyworks Solutions Inc., designed for IEEE 802.11a/n wireless applications operating in the 4.9GHz to 5.85GHz frequency band. This component integrates RF signal processing functionality in a compact 16-QFN (3x3) package with exposed pad.

The RFX5000B has reached obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production or maintenance requirements for systems utilizing this RF front-end module.

Substiute Parts

RFX5000B

Skyworks Solutions Inc.In Stock: 33061RFX5000B Datasheet

Current PartRFQ

SE5007T-R

Skyworks Solutions Inc.In Stock: 39072SE5007T-R Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the RFX5000B is determined by the following critical parameters:

• RF Type Compatibility: The substitute must support 802.11a/n or extended standards (802.11a/g/n) that include 802.11a/n functionality
• Frequency Range: The substitute must cover the 4.9GHz to 5.85GHz operating band
• Package Compatibility: The substitute must use the 16-UFQFN Exposed Pad package in 16-QFN (3x3) form factor to ensure PCB layout and thermal management compatibility
• RoHS Compliance: The substitute must maintain ROHS3 compliance for regulatory consistency
• Moisture Sensitivity: The substitute must have MSL rating of 1 (Unlimited) or equivalent for handling and storage compatibility

The SE5007T-R meets all substitution criteria. It is manufactured by the same supplier (Skyworks Solutions Inc.), operates across the identical frequency range, uses the same package, maintains equivalent RoHS and MSL ratings, and supports an extended RF standard set (802.11a/g/n) that includes full backward compatibility with 802.11a/n applications.

Parameter Comparison

Engineering Selection Recommendations

The SE5007T-R is the qualified substitute for the RFX5000B based on the following engineering criteria:

Regulatory Compliance: Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring no additional compliance burden or handling requirement changes.

Product Lifecycle Status: The SE5007T-R carries Active product status, providing assured long-term availability and supply chain stability compared to the Obsolete RFX5000B.

Functional Compatibility: The SE5007T-R supports 802.11a/g/n standards, which encompasses full 802.11a/n functionality. The extended standard support does not introduce incompatibility; it represents a superset of the original part's RF capabilities within the same frequency band.

Physical and Thermal Compatibility: Identical package specifications (16-UFQFN Exposed Pad, 16-QFN 3x3) ensure direct PCB footprint compatibility and equivalent thermal performance characteristics.

Frequently Asked Questions (FAQ)

Q: Can SE5007T-R be used as a direct replacement for RFX5000B in existing designs?

A: Yes. The SE5007T-R shares identical package geometry, frequency range, and RoHS/MSL compliance. The PCB footprint and thermal pad layout are compatible. The extended RF standard support (802.11a/g/n vs. 802.11a/n) does not create incompatibility; it provides additional protocol support within the same frequency band.

Q: What is the primary reason for substitution?

A: The RFX5000B is obsolete. The SE5007T-R is an active product from the same manufacturer with identical electrical and mechanical specifications, ensuring continued availability and supply chain support.

Q: Are there any handling or storage differences between these parts?

A: No. Both parts have MSL rating of 1 (Unlimited), indicating identical moisture sensitivity and storage requirements.

Q: Does the SE5007T-R support the same frequency range?

A: Yes. Both parts operate across 4.9GHz to 5.85GHz. The SE5007T-R supports additional 802.11g protocols within this band but does not restrict operation to any subset of the frequency range.

Q: Is the packaging identical?

A: Yes. Both use 16-UFQFN Exposed Pad packaging in 16-QFN (3x3) form factor, ensuring identical PCB layout requirements and thermal management characteristics.