Equivalent & Substitute Parts for RFN3BM2STL

Part Overview

The RFN3BM2STL is a general-purpose rectifier diode manufactured by Rohm Semiconductor, designed for surface mount applications in the TO-252 package. This fast recovery diode operates at 200 V DC reverse voltage with 3 A average rectified current, suitable for power supply and switching applications requiring efficient reverse recovery characteristics. The part is Active in product status and fully compliant with RoHS3 and REACH regulations. Alternative equivalent parts may be required due to supply chain availability, regional sourcing preferences, or specific packaging variant requirements while maintaining identical electrical performance.

Substiute Parts

RFN3BM2STL

Rohm SemiconductorIn Stock: 3945RFN3BM2STL Datasheet

Current PartRFQ

RFN3BGE2STL

Rohm SemiconductorIn Stock: 3354RFN3BGE2STL Datasheet

Parametric EquivalentRFQ

RFN3BM2STL

Rohm SemiconductorIn Stock: 3945RFN3BM2STL Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the RFN3BM2STL is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

• Voltage - DC Reverse (Vr) (Max): 200 V
• Current - Average Rectified (Io): 3 A
• Voltage - Forward (Vf) (Max) @ If: 980 mV @ 3 A
• Reverse Recovery Time (trr): 25 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 200 V
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)

Mechanical & Packaging Equivalence Criteria:

• Mounting Type: Surface Mount
• Package / Case: TO-252-3, DPAK (2 Leads + Tab), SC-63
• Operating Temperature - Junction (Max): 150°C

Compliance Equivalence Criteria:

• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)
• Manufacturer: Rohm Semiconductor

The identified substitute part RFN3BGE2STL meets all electrical, mechanical, and compliance parameters. The primary distinction is the supplier device package designation (TO-252GE versus TO-252), which represents a packaging variant within the same TO-252-3 DPAK footprint classification.

Parameter Comparison

Engineering Selection Recommendations

Both RFN3BM2STL and RFN3BGE2STL are Active products from Rohm Semiconductor with full ROHS3 compliance and REACH Unaffected status. Selection between these parts should be based on:

Availability: RFN3BM2STL maintains higher inventory (3900 pcs) compared to RFN3BGE2STL (3295 pcs). For high-volume production, RFN3BM2STL is the primary choice.

Packaging Variant: The supplier device package designation differs (TO-252 versus TO-252GE), but both conform to the identical TO-252-3 DPAK footprint and pin configuration. This variant designation reflects internal Rohm Semiconductor packaging specifications and does not affect PCB layout, thermal performance, or electrical operation.

Compliance & Reliability: Both parts carry identical compliance certifications (ROHS3, REACH Unaffected, MSL 1) and are suitable for applications requiring unrestricted moisture handling and environmental compliance.

Electrical Performance: All critical electrical parameters are identical, including reverse voltage rating (200 V), rectified current (3 A), forward voltage drop (980 mV @ 3 A), and reverse recovery time (25 ns). No performance trade-offs exist between the two parts.

Frequently Asked Questions (FAQ)

Q: Can RFN3BGE2STL be used as a direct replacement for RFN3BM2STL in existing designs?

A: Yes. Both parts are electrically and mechanically equivalent. The TO-252GE packaging variant designation does not affect PCB compatibility, thermal characteristics, or electrical performance. Direct substitution is valid for all applications currently using RFN3BM2STL.

Q: What is the difference between TO-252 and TO-252GE package designations?

A: Both designations refer to the same TO-252-3 DPAK (2 Leads + Tab) footprint with SC-63 case code. The "GE" suffix in TO-252GE represents an internal Rohm Semiconductor packaging variant classification. No differences in lead spacing, thermal pad dimensions, or electrical characteristics exist between the two designations.

Q: Are there any thermal performance differences between RFN3BM2STL and RFN3BGE2STL?

A: No. Both parts share identical operating temperature ratings (150°C junction maximum) and are housed in the same TO-252-3 DPAK package with identical thermal characteristics. Thermal performance in circuit applications is equivalent.

Q: Which part should be selected for new designs?

A: RFN3BM2STL is recommended for new designs due to higher current inventory availability (3900 pcs versus 3295 pcs). However, RFN3BGE2STL is an equally valid choice from an engineering standpoint, as all electrical, mechanical, and compliance parameters are identical.

Q: Do both parts require the same PCB layout and thermal management considerations?

A: Yes. Both parts use the identical TO-252-3 DPAK footprint and thermal pad configuration. PCB layout, trace routing, thermal via placement, and heat dissipation strategies are interchangeable between RFN3BM2STL and RFN3BGE2STL.

Q: Are there any supply chain or lead time considerations between these parts?

A: Both parts are manufactured by Rohm Semiconductor and carry Active product status. Selection should be based on current inventory levels and supplier availability. RFN3BM2STL currently shows higher stock levels, which may provide shorter lead times for immediate procurement.

Q: What compliance certifications apply to both parts?

A: Both RFN3BM2STL and RFN3BGE2STL are ROHS3 Compliant, REACH Unaffected, and carry MSL 1 (Unlimited) moisture sensitivity rating. No environmental or regulatory restrictions apply to either part for commercial or industrial applications.