RFD3055LE N-Channel MOSFET 60V 11A Equivalent & Substitute Parts

Part Overview

The RFD3055LE is an N-Channel MOSFET manufactured by onsemi, rated for 60V drain-to-source voltage and 11A continuous drain current in a Through Hole I-PAK package. This device is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity. The RFD3055LE is suitable for switching applications requiring moderate voltage and current ratings with thermal management capabilities up to 38W power dissipation.

Substiute Parts

RFD3055LE

onsemiIn Stock: 15509RFD3055LE Datasheet

Current PartRFQ

STD12NF06L-1

STMicroelectronicsIn Stock: 17247STD12NF06L-1 Datasheet

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TSM900N06CH X0G

Taiwan Semiconductor CorporationIn Stock: 50030TSM900N06CH X0G Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the RFD3055LE is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Drain-to-Source Voltage (Vdss) must equal or exceed 60V
• Continuous Drain Current (Id) must equal or exceed 11A at 25°C
• Gate Threshold Voltage (Vgs(th)) must be compatible with existing drive circuits
• On-state resistance (Rds On) should not significantly degrade circuit performance
• Maximum Gate Voltage (Vgs Max) must accommodate drive voltage requirements
• Operating temperature range must support application requirements

Mechanical Compatibility Criteria:

• Package type must be Through Hole I-PAK (TO-251-3)
• Lead configuration must be compatible with existing PCB layouts
• Mounting orientation must match the original design

Regulatory Compliance:

• RoHS3 compliance required
• REACH unaffected status required
• ECCN EAR99 classification maintained

The substitute parts listed below meet these criteria and are classified as active products, providing long-term availability and design support.

Parameter Comparison

Engineering Selection Recommendations

STD12NF06L-1 (STMicroelectronics): This substitute provides improved electrical performance with 12A continuous drain current, exceeding the RFD3055LE specification by 1A. The device maintains identical 60V Vdss rating and offers superior power dissipation capability at 42.8W. The STD12NF06L-1 is classified as an active product with full manufacturing support. It is RoHS3 compliant and REACH unaffected. The STripFET™ II series designation indicates advanced process technology. This part is suitable for direct replacement in applications where the higher current rating and improved thermal performance provide design margin.

TSM900N06CH X0G (Taiwan Semiconductor Corporation): This substitute matches the RFD3055LE in continuous drain current at 11A and maintains the 60V Vdss rating. The device features lower on-state resistance (90 mOhm @ 6A, 10V) compared to the RFD3055LE (107 mOhm @ 8A, 5V), resulting in reduced power dissipation in switching applications. The TSM900N06CH X0G is classified as an active product with ongoing manufacturing support. It is RoHS3 compliant and REACH unaffected. The maximum gate voltage rating of ±20V provides additional design flexibility. Note that the maximum operating temperature is 150°C, which is 25°C lower than the RFD3055LE. This part is suitable for replacement in applications operating within the -55°C to 150°C temperature range.

Both substitute parts are available in active production status, ensuring long-term procurement availability and design continuity for applications previously using the obsolete RFD3055LE.

Frequently Asked Questions (FAQ)

Q: Can the STD12NF06L-1 be used as a direct replacement for the RFD3055LE?

A: The STD12NF06L-1 is electrically and mechanically compatible with the RFD3055LE. Both devices share identical 60V Vdss rating, Through Hole I-PAK packaging, and operating temperature range of -55°C to 175°C. The STD12NF06L-1 provides higher continuous drain current (12A versus 11A) and improved power dissipation capability (42.8W versus 38W). PCB layout compatibility depends on lead configuration; both use TO-251-3 Short Leads.

Q: What are the differences between the two substitute parts?

A: The STD12NF06L-1 offers higher current rating (12A) and power dissipation (42.8W), making it suitable for applications requiring additional thermal margin. The TSM900N06CH X0G matches the RFD3055LE current rating (11A) but features lower on-state resistance (90 mOhm) and operates to a maximum temperature of 150°C rather than 175°C. Selection depends on application thermal requirements and operating temperature specifications.

Q: Are both substitute parts RoHS3 compliant?

A: Yes, both the STD12NF06L-1 and TSM900N06CH X0G are RoHS3 compliant and REACH unaffected, matching the compliance status of the RFD3055LE.

Q: What is the significance of the different lead configurations (Short Leads versus Stub Leads)?

A: The RFD3055LE and STD12NF06L-1 use TO-251-3 Short Leads, while the TSM900N06CH X0G uses TO-251-3 Stub Leads. Both configurations are Through Hole I-PAK packages. Lead length differences may affect PCB hole sizing and mounting clearance. Verify PCB design specifications before substitution.

Q: Can the TSM900N06CH X0G be used in applications requiring operation above 150°C?

A: No. The TSM900N06CH X0G maximum operating temperature is 150°C, which is 25°C lower than the RFD3055LE and STD12NF06L-1. Applications requiring operation between 150°C and 175°C must use the STD12NF06L-1 or equivalent devices with higher temperature ratings.

Q: How do the on-state resistance values compare between these devices?

A: The RFD3055LE specifies 107 mOhm @ 8A, 5V. The STD12NF06L-1 specifies 100 mOhm @ 6A, 10V. The TSM900N06CH X0G specifies 90 mOhm @ 6A, 10V. Lower on-state resistance reduces power dissipation in switching applications. Direct comparison requires evaluation at identical test conditions; the values provided are manufacturer specifications at different operating points.

Q: What is the product status significance for long-term design support?

A: The RFD3055LE is classified as obsolete, indicating discontinued manufacturing and limited availability. Both substitute parts are classified as active products, ensuring ongoing manufacturing support, availability, and design continuity for new and existing applications.