Equivalent & Substitute Parts for RFD16N05LSM

Part Overview

The RFD16N05LSM is an N-Channel MOSFET manufactured by onsemi, rated for 50V drain-to-source voltage and 16A continuous drain current in a Surface Mount TO-252AA package. This device is classified as Obsolete, necessitating identification of equivalent and substitute components for ongoing design requirements and production continuity. Substitute parts are selected based on electrical performance parameters, mechanical compatibility, and package specifications that permit direct functional replacement in circuit applications.

Substiute Parts

RFD16N05LSM
onsemiIn Stock: 5968RFD16N05LSM Datasheet
RFD16N05LSM
Current Part
RFD16N05LSM9A
onsemiIn Stock: 9060RFD16N05LSM9A Datasheet
RFD16N05LSM9A
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STD20NF06LT4
STMicroelectronicsIn Stock: 2278STD20NF06LT4 Datasheet
STD20NF06LT4
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STD20NF06T4
STMicroelectronicsIn Stock: 27104STD20NF06T4 Datasheet
STD20NF06T4
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Key Parameters

Parameter Value Unit
FET Type N-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 50 V
Current - Continuous Drain (Id) @ 25°C 16 A (Tc)
Rds On (Max) @ Id, Vgs 47 mOhm @ 16A, 5V
Power Dissipation (Max) 60 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Surface Mount
Package / Case TO-252-3, DPAK (2 Leads + Tab), SC-63
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the RFD16N05LSM are identified based on the following electrical and mechanical criteria:

Primary Substitution Criteria:

  • FET Type: N-Channel topology
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): Equal to or greater than 50V
  • Current - Continuous Drain (Id): Equal to or greater than 16A
  • Power Dissipation (Max): Equal to or greater than 60W
  • Mounting Type: Surface Mount
  • Package Compatibility: TO-252-3 / DPAK (2 Leads + Tab) / SC-63

Substitute Categories:

Category 1: Direct Equivalent (Identical Electrical Specifications) RFD16N05LSM9A is a direct equivalent manufactured by onsemi with identical electrical parameters and package specifications. This part maintains all critical performance characteristics while offering Active product status and improved availability.

Category 2: Enhanced Performance Substitutes (Higher Voltage and Current Ratings) STD20NF06LT4 and STD20NF06T4 are manufactured by STMicroelectronics and provide enhanced electrical performance with higher Vdss (60V) and Id (24A) ratings while maintaining the same package form factor and power dissipation specification. These parts are suitable for applications where the RFD16N05LSM electrical specifications represent the minimum requirement.

Parameter Comparison

Parameter RFD16N05LSM RFD16N05LSM9A STD20NF06LT4 STD20NF06T4
Manufacturer onsemi onsemi STMicroelectronics STMicroelectronics
FET Type N-Channel N-Channel N-Channel N-Channel
Drain to Source Voltage (Vdss) 50 V 50 V 60 V 60 V
Current - Continuous Drain (Id) @ 25°C 16 A (Tc) 16 A (Tc) 24 A (Tc) 24 A (Tc)
Rds On (Max) @ Id, Vgs 47 mOhm @ 16A, 5V 47 mOhm @ 16A, 5V 40 mOhm @ 12A, 10V 40 mOhm @ 12A, 10V
Vgs(th) (Max) @ Id 2 V @ 250mA 2 V @ 250mA 2.5 V @ 250µA 4 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 80 nC @ 10 V 80 nC @ 10 V 13 nC @ 10 V 31 nC @ 10 V
Vgs (Max) ±10 V ±10 V ±18 V ±20 V
Power Dissipation (Max) 60 W (Tc) 60 W (Tc) 60 W (Tc) 60 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ) -55 to 150 °C (TJ) -55 to 175 °C (TJ) -55 to 175 °C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case TO-252-3, DPAK TO-252-3, DPAK TO-252-3, DPAK TO-252-3, DPAK
Product Status Obsolete Active Active Active
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

For Direct Replacement (Identical Specifications): RFD16N05LSM9A is the recommended substitute when exact electrical and thermal specifications must be maintained. This part is manufactured by onsemi with Active product status, ensuring long-term availability and supply chain continuity. RFD16N05LSM9A carries ROHS3 compliance certification, meeting current regulatory requirements. The part is available in Cut Tape and Digi-Reel packaging formats with higher inventory levels (9030 units) compared to the obsolete RFD16N05LSM.

For Enhanced Performance Applications: STD20NF06LT4 and STD20NF06T4 are suitable substitutes when circuit design permits operation with higher voltage and current ratings. Both parts are manufactured by STMicroelectronics under the STripFET™ II series with Active product status. These devices provide superior gate charge characteristics (13 nC and 31 nC respectively versus 80 nC for the original part), enabling faster switching performance. Both parts carry ROHS3 compliance and support extended operating temperature ranges (-55 to 175°C). STD20NF06T4 offers significantly higher inventory availability (27055 units) for production applications.

Compliance and Regulatory Considerations: All substitute parts maintain REACH Unaffected status and ECCN EAR99 classification consistent with the original RFD16N05LSM. Moisture Sensitivity Level 1 (Unlimited) is maintained across all substitutes, eliminating special handling requirements. ROHS3 compliance is confirmed for all active substitute parts.

Frequently Asked Questions (FAQ)

Q: Can RFD16N05LSM9A be used as a direct replacement for RFD16N05LSM? A: Yes. RFD16N05LSM9A is a direct equivalent with identical electrical specifications, thermal ratings, and package configuration. The primary advantage is Active product status and improved availability. Both parts share the same Vdss (50V), Id (16A), Rds On (47 mOhm @ 16A, 5V), and power dissipation (60W) specifications.

Q: What are the key differences between RFD16N05LSM and the STMicroelectronics substitutes? A: STD20NF06LT4 and STD20NF06T4 provide higher voltage (60V versus 50V) and current (24A versus 16A) ratings. Both maintain the same 60W power dissipation and TO-252-3 DPAK package. The STMicroelectronics parts feature lower gate charge (13 nC and 31 nC respectively versus 80 nC), enabling faster switching. Operating temperature range extends to 175°C compared to 150°C for the original part.

Q: Are all substitute parts compatible with the same PCB layout? A: Yes. All substitute parts use the TO-252-3 DPAK (2 Leads + Tab) package configuration, designated as SC-63. Pin-to-pin compatibility is maintained across all parts, permitting direct PCB substitution without layout modifications.

Q: What is the significance of the Obsolete product status for RFD16N05LSM? A: Obsolete status indicates the manufacturer has discontinued production and support for this part. Substitution is necessary for new designs and ongoing production to ensure supply chain continuity and access to technical support. RFD16N05LSM9A and the STMicroelectronics alternatives maintain Active status with confirmed long-term availability.

Q: Do the substitute parts require different gate drive voltage levels? A: RFD16N05LSM9A maintains identical gate drive specifications (4V, 5V) as the original part. STD20NF06LT4 and STD20NF06T4 operate with 5V and 10V drive voltages respectively, with higher maximum gate voltage ratings (±18V and ±20V versus ±10V). Existing gate drive circuits designed for the RFD16N05LSM are compatible with RFD16N05LSM9A without modification.

Q: Are moisture sensitivity and handling requirements identical across all parts? A: Yes. All parts maintain Moisture Sensitivity Level 1 (Unlimited), eliminating special storage, handling, or baking requirements. REACH Unaffected status is consistent across all parts, confirming compliance with hazardous substance restrictions.

Q: Which substitute part offers the best availability for high-volume production? A: STD20NF06T4 provides the highest inventory availability at 27055 units. RFD16N05LSM9A offers 9030 units with identical electrical specifications to the original part. Both parts are available in Cut Tape and Digi-Reel packaging suitable for automated assembly processes.

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