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RDD023N50TL Equivalent & Substitute Parts Reference
Part Overview
RDD023N50TL is an N-channel MOSFET from Rohm Semiconductor categorized under Transistors, FETs, MOSFETs. It features a drain-to-source voltage (Vdss) of 500V and a continuous drain current (Id) of 2A (Tc), with a maximum power dissipation of 20W (Tc). The device is supplied in a TO-252-3, DPAK (2 Leads + Tab), SC-63 surface-mount package. This product is currently active and compliant with ROHS3 and REACH regulations.
Identifying suitable substitutes for RDD023N50TL becomes necessary in various scenarios such as inventory shortages or supply chain interruptions. Substitute parts must be evaluated strictly based on matching key electrical and mechanical parameters as defined for this product category.
Substiute Parts
Key Parameters
| Parameter | Description | Main Part Value |
|---|---|---|
| FET Type | N-Channel MOSFET construction | N-Channel |
| Technology | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | Maximum voltage between drain and source | 500V |
| Current - Continuous Drain (Id) @ 25°C | Maximum continuous drain current at 25°C | 2A (Tc) |
| Rds On (Max) @ Id, Vgs | Maximum on-resistance at specified Id and Vgs | 5.4Ω @ 1A, 10V |
| Vgs(th) (Max) @ Id | Maximum gate threshold voltage | 2V @ 1mA |
| Gate Charge (Qg) (Max) @ Vgs | Maximum gate charge at Vgs | 11nC @ 10V |
| Vgs (Max) | Maximum allowable gate-to-source voltage | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | Maximum input capacitance at specified Vds | 151pF @ 25V |
| Power Dissipation (Max) | Maximum continuous power dissipation | 20W (Tc) |
| Operating Temperature | Maximum junction temperature | 150°C (TJ) |
| Mounting Type | Surface Mount/Through Hole | Surface Mount |
| Package / Case | Package style | TO-252-3, DPAK (2 Leads + Tab), SC-63 |
Substitute Part Grouping Explanation
Substitute MOSFETs are selected based on strict matching of the following key parameters:
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)
- Current - Continuous Drain (Id) @ 25°C
- Maximum Rds On at similar conditions
- Maximum Gate-Source Voltage (Vgs)
- Input Capacitance (Ciss)
- Package / Case compatibility
- Compliance with regulatory certifications
Only parts that satisfy these essential electrical and mechanical specifications can be grouped as direct equivalents or substitutes in the Transistors, FETs, MOSFETs category.
Parameter Comparison
| Parameter | RDD023N50TL | R6002END3TL1 | IRFR420TRPBF | IXTY08N50D2 |
|---|---|---|---|---|
| Manufacturer | Rohm Semiconductor | Rohm Semiconductor | Vishay Siliconix | IXYS |
| FET Type | N-Channel | N-Channel | N-Channel | N-Channel |
| Technology | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 500V | 600V | 500V | 500V |
| Current - Continuous Drain (Id) @ 25°C | 2A (Tc) | 1.7A (Tc) | 2.4A (Tc) | 800mA (Tc) |
| Rds On (Max) @ Id, Vgs | 5.4Ω @ 1A, 10V | 3.4Ω @ 500mA, 10V | 3Ω @ 1.4A, 10V | 4.6Ω @ 400mA, 0V |
| Vgs(th) (Max) @ Id | 2V @ 1mA | 4V @ 1mA | 4V @ 250µA | - |
| Gate Charge (Qg) (Max) @ Vgs | 11nC @ 10V | 6.5nC @ 10V | 19nC @ 10V | 12.7nC @ 5V |
| Vgs (Max) | ±20V | ±20V | ±20V | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | 151pF @ 25V | 65pF @ 25V | 360pF @ 25V | 312pF @ 25V |
| Power Dissipation (Max) | 20W (Tc) | 26W (Tc) | 42W (Tc) | 60W (Tc) |
| Operating Temperature | 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | TO-252-3, DPAK (2 Leads + Tab), SC-63 | TO-252-3, DPAK (2 Leads + Tab), SC-63 | TO-252-3, DPAK (2 Leads + Tab), SC-63 | TO-252-3, DPAK (2 Leads + Tab), SC-63 |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Affected | REACH Unaffected |
| Product Status | Active | Active | Active | Active |
Engineering Selection Recommendations
All listed substitute parts (R6002END3TL1, IRFR420TRPBF, IXTY08N50D2) are active and compliant with ROHS3. RDD023N50TL, R6002END3TL1, and IXTY08N50D2 are REACH unaffected, while IRFR420TRPBF is REACH affected. Each substitute shares the same package type (TO-252-3, DPAK (2 Leads + Tab), SC-63) and surface-mount configuration. These factors support the consideration of these substitutes for direct replacement strictly based on product status and regulatory compliance.
Frequently Asked Questions (FAQ)
Q1: What makes a MOSFET suitable as a substitute for RDD023N50TL?
A1: To be considered a substitute, the MOSFET must have matching or comparable electrical parameters (FET type, Vdss, Id, Rds On, Vgs) and mechanical compatibility (package type, mounting method). Compliance with ROHS and REACH is also necessary.
Q2: Are package and mounting considerations important in MOSFET substitution?
A2: Yes, the substitute part must have the same or mechanically equivalent package and mounting type (TO-252-3, DPAK (2 Leads + Tab), SC-63, surface mount) for direct board placement.
Q3: How does product status affect substitution?
A3: Only active products are listed as substitutes to ensure reliable sourcing and long-term availability.
Q4: Why does compliance status matter for substitute parts?
A4: Regulatory compliance such as ROHS3 and REACH affects the legality and environmental acceptability of components in production environments. Only compliant substitutes are suitable for regulated markets.
Q5: Can all substitute MOSFETs be used without further verification?
A5: Substitution suitability is established strictly based on the parameters and compliance data provided, with no assumptions or unverified compatibility considered.
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