RDD023N50TL Equivalent & Substitute Parts Reference

Part Overview

RDD023N50TL is an N-channel MOSFET from Rohm Semiconductor categorized under Transistors, FETs, MOSFETs. It features a drain-to-source voltage (Vdss) of 500V and a continuous drain current (Id) of 2A (Tc), with a maximum power dissipation of 20W (Tc). The device is supplied in a TO-252-3, DPAK (2 Leads + Tab), SC-63 surface-mount package. This product is currently active and compliant with ROHS3 and REACH regulations.

Identifying suitable substitutes for RDD023N50TL becomes necessary in various scenarios such as inventory shortages or supply chain interruptions. Substitute parts must be evaluated strictly based on matching key electrical and mechanical parameters as defined for this product category.

Substiute Parts

RDD023N50TL
Rohm SemiconductorIn Stock: 1267RDD023N50TL Datasheet
RDD023N50TL
Current Part
R6002END3TL1
Rohm SemiconductorIn Stock: 52704R6002END3TL1 Datasheet
R6002END3TL1
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IRFR420TRPBF
Vishay SiliconixIn Stock: 17410IRFR420TRPBF Datasheet
IRFR420TRPBF
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IXTY08N50D2
IXYSIn Stock: 1216IXTY08N50D2 Datasheet
IXTY08N50D2
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Key Parameters

Parameter Description Main Part Value
FET Type N-Channel MOSFET construction N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) Maximum voltage between drain and source 500V
Current - Continuous Drain (Id) @ 25°C Maximum continuous drain current at 25°C 2A (Tc)
Rds On (Max) @ Id, Vgs Maximum on-resistance at specified Id and Vgs 5.4Ω @ 1A, 10V
Vgs(th) (Max) @ Id Maximum gate threshold voltage 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs Maximum gate charge at Vgs 11nC @ 10V
Vgs (Max) Maximum allowable gate-to-source voltage ±20V
Input Capacitance (Ciss) (Max) @ Vds Maximum input capacitance at specified Vds 151pF @ 25V
Power Dissipation (Max) Maximum continuous power dissipation 20W (Tc)
Operating Temperature Maximum junction temperature 150°C (TJ)
Mounting Type Surface Mount/Through Hole Surface Mount
Package / Case Package style TO-252-3, DPAK (2 Leads + Tab), SC-63

Substitute Part Grouping Explanation

Substitute MOSFETs are selected based on strict matching of the following key parameters:

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss)
  • Current - Continuous Drain (Id) @ 25°C
  • Maximum Rds On at similar conditions
  • Maximum Gate-Source Voltage (Vgs)
  • Input Capacitance (Ciss)
  • Package / Case compatibility
  • Compliance with regulatory certifications

Only parts that satisfy these essential electrical and mechanical specifications can be grouped as direct equivalents or substitutes in the Transistors, FETs, MOSFETs category.

Parameter Comparison

Parameter RDD023N50TL R6002END3TL1 IRFR420TRPBF IXTY08N50D2
Manufacturer Rohm Semiconductor Rohm Semiconductor Vishay Siliconix IXYS
FET Type N-Channel N-Channel N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 500V 600V 500V 500V
Current - Continuous Drain (Id) @ 25°C 2A (Tc) 1.7A (Tc) 2.4A (Tc) 800mA (Tc)
Rds On (Max) @ Id, Vgs 5.4Ω @ 1A, 10V 3.4Ω @ 500mA, 10V 3Ω @ 1.4A, 10V 4.6Ω @ 400mA, 0V
Vgs(th) (Max) @ Id 2V @ 1mA 4V @ 1mA 4V @ 250µA -
Gate Charge (Qg) (Max) @ Vgs 11nC @ 10V 6.5nC @ 10V 19nC @ 10V 12.7nC @ 5V
Vgs (Max) ±20V ±20V ±20V ±20V
Input Capacitance (Ciss) (Max) @ Vds 151pF @ 25V 65pF @ 25V 360pF @ 25V 312pF @ 25V
Power Dissipation (Max) 20W (Tc) 26W (Tc) 42W (Tc) 60W (Tc)
Operating Temperature 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case TO-252-3, DPAK (2 Leads + Tab), SC-63 TO-252-3, DPAK (2 Leads + Tab), SC-63 TO-252-3, DPAK (2 Leads + Tab), SC-63 TO-252-3, DPAK (2 Leads + Tab), SC-63
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Affected REACH Unaffected
Product Status Active Active Active Active

Engineering Selection Recommendations

All listed substitute parts (R6002END3TL1, IRFR420TRPBF, IXTY08N50D2) are active and compliant with ROHS3. RDD023N50TL, R6002END3TL1, and IXTY08N50D2 are REACH unaffected, while IRFR420TRPBF is REACH affected. Each substitute shares the same package type (TO-252-3, DPAK (2 Leads + Tab), SC-63) and surface-mount configuration. These factors support the consideration of these substitutes for direct replacement strictly based on product status and regulatory compliance.

Frequently Asked Questions (FAQ)

Q1: What makes a MOSFET suitable as a substitute for RDD023N50TL?
A1: To be considered a substitute, the MOSFET must have matching or comparable electrical parameters (FET type, Vdss, Id, Rds On, Vgs) and mechanical compatibility (package type, mounting method). Compliance with ROHS and REACH is also necessary.

Q2: Are package and mounting considerations important in MOSFET substitution?
A2: Yes, the substitute part must have the same or mechanically equivalent package and mounting type (TO-252-3, DPAK (2 Leads + Tab), SC-63, surface mount) for direct board placement.

Q3: How does product status affect substitution?
A3: Only active products are listed as substitutes to ensure reliable sourcing and long-term availability.

Q4: Why does compliance status matter for substitute parts?
A4: Regulatory compliance such as ROHS3 and REACH affects the legality and environmental acceptability of components in production environments. Only compliant substitutes are suitable for regulated markets.

Q5: Can all substitute MOSFETs be used without further verification?
A5: Substitution suitability is established strictly based on the parameters and compliance data provided, with no assumptions or unverified compatibility considered.

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