RC28F256P30BFE Equivalent & Substitute Parts

Part Overview

The RC28F256P30BFE is a 256Mbit parallel NOR Flash memory IC manufactured by Micron Technology Inc., designed for non-volatile storage applications requiring high-speed parallel access. This component features a 64-EasyBGA package with 52 MHz clock frequency and 100 ns access time, operating across the -40°C to 85°C temperature range.

The RC28F256P30BFE is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain system functionality, ensure supply chain continuity, and support legacy device maintenance or redesign initiatives.

Key Parameters

Parameter	Value
Memory Size	256Mbit
Memory Organization	16M x 16
Memory Interface	Parallel
Technology	FLASH - NOR
Clock Frequency	52 MHz
Access Time	100 ns
Write Cycle Time	100 ns
Voltage Supply	1.7V ~ 2V
Package Type	64-TBGA (64-EasyBGA 10x13)
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 85°C
RoHS Status	RoHS non-compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the RC28F256P30BFE is determined by the following critical parameters:

Memory Capacity: 256Mbit capacity is the primary functional requirement
Memory Type & Technology: Non-volatile FLASH - NOR technology must be maintained
Memory Interface: Parallel interface architecture is mandatory for system compatibility
Memory Organization: 16M x 16 organization or compatible alternatives (32M x 8) that support the same addressing scheme
Operating Temperature Range: -40°C to 85°C minimum coverage required
Package Compatibility: Physical and electrical compatibility with 64-pin BGA footprints
Voltage Supply Range: Supply voltage specifications must encompass or be compatible with system requirements

The MT28EW256ABA1LPC-0SIT qualifies as a substitute based on matching memory capacity, technology, interface type, and operating temperature range. However, differences in voltage supply range, access time, package designation, and compliance status must be evaluated for specific application requirements.

Parameter Comparison

Parameter	RC28F256P30BFE (Main Part)	MT28EW256ABA1LPC-0SIT (Substitute)
Manufacturer	Micron Technology Inc.	Micron Technology Inc.
Memory Size	256Mbit	256Mbit
Memory Organization	16M x 16	32M x 8, 16M x 16
Memory Interface	Parallel	Parallel
Technology	FLASH - NOR	FLASH - NOR
Clock Frequency	52 MHz	Not specified
Access Time	100 ns	75 ns
Write Cycle Time	100 ns	60 ns
Voltage Supply	1.7V ~ 2V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	64-TBGA (64-EasyBGA 10x13)	64-LBGA (11x13)
Mounting Type	Surface Mount	Surface Mount
RoHS Status	RoHS non-compliant	ROHS3 Compliant
MSL Rating	3 (168 Hours)	3 (168 Hours)
Product Status	Obsolete	Active

Engineering Selection Recommendations

RC28F256P30BFE (Main Part): Obsolete status with RoHS non-compliance limits applicability to legacy system maintenance only. Inventory availability is limited (2000 pcs).

MT28EW256ABA1LPC-0SIT (Substitute): Active product status with ROHS3 compliance and verified programmability support. Superior access time (75 ns vs. 100 ns) and write cycle time (60 ns vs. 100 ns) provide performance improvement. Larger inventory availability (6888 pcs) supports supply chain continuity.

Critical consideration: Voltage supply range differs significantly (2.7V ~ 3.6V vs. 1.7V ~ 2V). Direct substitution requires system-level voltage compatibility verification. Package footprint differs (64-LBGA 11x13 vs. 64-EasyBGA 10x13), necessitating PCB layout evaluation.

Frequently Asked Questions (FAQ)

Q: Can MT28EW256ABA1LPC-0SIT directly replace RC28F256P30BFE without PCB modifications?

A: No. The substitute part uses a different package footprint (64-LBGA 11x13 vs. 64-EasyBGA 10x13). PCB layout modifications are required. Additionally, voltage supply range compatibility must be verified at the system level.

Q: What are the key functional similarities between these parts?

A: Both parts share 256Mbit capacity, parallel NOR Flash technology, 16M x 16 memory organization option, and identical operating temperature range (-40°C to 85°C). Both are surface-mount BGA packages with MSL rating 3.

Q: Why does the substitute part have faster access and write times?

A: The MT28EW256ABA1LPC-0SIT represents a newer generation of the same memory technology from Micron, incorporating process improvements that reduce access time from 100 ns to 75 ns and write cycle time from 100 ns to 60 ns.

Q: Is the voltage supply difference a critical factor?

A: Yes. The main part operates at 1.7V ~ 2V while the substitute requires 2.7V ~ 3.6V. System power supply architecture must support the substitute's voltage requirements. Direct substitution is not possible if the system is designed exclusively for the lower voltage range.

Q: What does RoHS3 compliance mean for the substitute part?

A: ROHS3 compliance indicates the substitute part meets Restriction of Hazardous Substances Directive requirements, restricting lead and other hazardous materials. The main part is RoHS non-compliant. This is relevant for applications subject to environmental regulations.

Q: Are there any package compatibility considerations?

A: Yes. Both parts use 64-pin BGA packages but with different dimensions (10x13 mm vs. 11x13 mm). Existing PCB designs with RC28F256P30BFE footprints cannot accommodate MT28EW256ABA1LPC-0SIT without layout redesign.

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