R7F7016853AFE-C#BA1 Equivalent & Substitute Parts

Part Overview

The R7F7016853AFE-C#BA1 is a 32-bit embedded microcontroller from Renesas Electronics Corporation, part of the RH850 series. This device integrates a 120MHz RH850G3KH core with 768KB FLASH program memory, 96KB RAM, and 64KB EEPROM, housed in a 100-LFQFP surface mount package. The microcontroller supports multiple communication protocols including CANbus, CSI, I2C, LINbus, SPI, and UART/USART, with integrated DMA, PWM, and watchdog timer peripherals. The product maintains Active status within Renesas Electronics' portfolio. Identifying equivalent and substitute parts becomes necessary when addressing supply chain constraints, packaging requirements, or specific automotive qualification needs while maintaining functional compatibility.

Substiute Parts

R7F7016853AFE-C#BA1
Renesas Electronics CorporationIn Stock: 913R7F7016853AFE-C#BA1 Datasheet
R7F7016853AFE-C#BA1
Current Part
R7F7016203AFP-C#AA3
Renesas Electronics CorporationIn Stock: 1259R7F7016203AFP-C#AA3 Datasheet
R7F7016203AFP-C#AA3
Parametric Equivalent
R7F7016853AFP-C#BA1
Renesas Electronics CorporationIn Stock: 1767R7F7016853AFP-C#BA1 Datasheet
R7F7016853AFP-C#BA1
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Core Processor RH850G3KH
Core Size 32-Bit
Speed 120MHz
Program Memory Size 768KB (768K x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 96K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 81
Connectivity CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals DMA, PWM, WDT
Data Converters A/D 20x10b, 16x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 100-LFQFP (14x14)
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the R7F7016853AFE-C#BA1 are identified based on strict parametric equivalence across core functional specifications. The substitution logic is based on the following critical parameters:

Core Functional Parameters:

  • Identical RH850G3KH processor core
  • Matching 32-bit architecture and 120MHz clock speed
  • Equivalent 768KB FLASH program memory capacity
  • Identical 96KB RAM and 64KB EEPROM configuration
  • Matching 81 I/O pin count
  • Identical connectivity interfaces (CANbus, CSI, I2C, LINbus, SPI, UART/USART)
  • Equivalent peripheral set (DMA, PWM, WDT)
  • Matching data converter specifications (A/D 20x10b, 16x12b)
  • Identical supply voltage range (3V ~ 5.5V)
  • Matching operating temperature range (-40°C ~ 105°C)
  • Identical 100-LFQFP/100-LQFP package footprint

Packaging and Compliance Variations: Substitute parts may differ in packaging format (Tray vs. standard), automotive qualification status (AEC-Q100), RoHS compliance level, and moisture sensitivity rating, while maintaining full electrical and functional equivalence.

Parameter Comparison

Parameter R7F7016853AFE-C#BA1 R7F7016853AFP-C#BA1 R7F7016203AFP-C#AA3
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Series RH850 RH850/F1KM-S1 RH850/F1K
Core Processor RH850G3KH RH850G3KH RH850G3KH
Core Size 32-Bit 32-Bit 32-Bit
Speed 120MHz 120MHz 120MHz
Program Memory Size 768KB (768K x 8) 768KB (768K x 8) 768KB (768K x 8)
Program Memory Type FLASH FLASH FLASH
EEPROM Size 64K x 8 64K x 8 64K x 8
RAM Size 96K x 8 96K x 8 96K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Number of I/O 81 81 81
Connectivity CANbus, CSI, I2C, LINbus, SPI, UART/USART CANbus, CSI, I2C, LINbus, SPI, UART/USART CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals DMA, PWM, WDT DMA, PWM, WDT DMA, PWM, WDT
Data Converters A/D 20x10b, 16x12b A/D 20x10b, 16x12b A/D 20x10b, 16x12b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 100-LFQFP (14x14) 100-LQFP (14x14) 100-LQFP (14x14)
Product Status Active Active Active
Packaging Format Not specified Tray Tray
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not specified 3 (168 Hours) 3 (168 Hours)
Automotive Qualification Not specified Not specified AEC-Q100

Engineering Selection Recommendations

All three parts maintain Active product status within Renesas Electronics' portfolio and share identical core electrical and functional specifications. Selection between these parts is determined by specific application requirements and compliance mandates:

R7F7016853AFE-C#BA1 serves as the baseline reference part with standard specifications and no specified automotive qualification or RoHS compliance documentation.

R7F7016853AFP-C#BA1 provides an equivalent alternative with documented ROHS3 compliance and MSL 3 moisture sensitivity rating in Tray packaging format. This part is suitable for applications requiring RoHS compliance without automotive-specific qualification requirements.

R7F7016203AFP-C#AA3 is qualified to AEC-Q100 automotive standards with ROHS3 compliance and MSL 3 moisture sensitivity rating in Tray packaging. This part is specified for automotive applications requiring formal qualification documentation and environmental compliance certifications.

Selection should be based on end-application requirements: general industrial applications may use any part; RoHS-compliant applications require either R7F7016853AFP-C#BA1 or R7F7016203AFP-C#AA3; automotive applications with qualification requirements mandate R7F7016203AFP-C#AA3.

Frequently Asked Questions (FAQ)

Q: Are these parts pin-compatible?

A: Yes. All three parts use identical 100-pin LFQFP/LQFP packages with 14x14mm footprints. Pin assignments and functionality are equivalent across all substitute parts.

Q: What is the difference between LFQFP and LQFP package designations?

A: Both designations refer to Low-profile Quad Flat Package formats with identical 14x14mm dimensions and 100-pin configurations. The parts are mechanically and electrically interchangeable at the PCB level.

Q: Can R7F7016203AFP-C#AA3 be used in non-automotive applications?

A: Yes. The R7F7016203AFP-C#AA3 meets all functional and electrical specifications for general applications. Automotive qualification is an additional certification that does not restrict use in other applications.

Q: What does AEC-Q100 qualification mean?

A: AEC-Q100 is an automotive industry qualification standard. Parts bearing this qualification have undergone specific reliability and environmental testing required for automotive applications. This certification is not required for non-automotive use.

Q: Are there memory or performance differences between these parts?

A: No. All three parts contain identical 768KB FLASH, 96KB RAM, and 64KB EEPROM configurations. Processing speed, I/O count, and peripheral functionality are identical across all parts.

Q: What is Moisture Sensitivity Level (MSL) 3?

A: MSL 3 indicates the part can be exposed to moisture for up to 168 hours at specified temperature and humidity conditions before soldering. This specification applies to R7F7016853AFP-C#BA1 and R7F7016203AFP-C#AA3.

Q: Can these parts be used interchangeably in existing designs?

A: Yes, provided the design does not have specific requirements for automotive qualification or RoHS compliance. If the original design specified R7F7016853AFE-C#BA1, either substitute part will function identically in the circuit.

Q: What is the difference in supply voltage between these parts?

A: There is no difference. All three parts operate across the identical 3V to 5.5V supply voltage range.

Q: Are there any differences in connectivity or peripheral support?

A: No. All parts support identical CANbus, CSI, I2C, LINbus, SPI, and UART/USART connectivity, with equivalent DMA, PWM, and watchdog timer peripherals.

Q: Which part should be selected for new automotive designs?

A: R7F7016203AFP-C#AA3 is specified for new automotive designs due to AEC-Q100 qualification and documented ROHS3 compliance, meeting automotive industry standards and environmental regulations.

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