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R7F7016853AFD-C#BA1 Equivalent & Substitute Parts
Part Overview
The R7F7016853AFD-C#BA1 is a 32-bit embedded microcontroller from Renesas Electronics Corporation, part of the RH850 series. This device integrates a 120MHz RH850G3KH core with 768KB FLASH program memory, 96KB RAM, and 64KB EEPROM, housed in a 100-LFQFP surface mount package. The microcontroller supports multiple communication protocols including CANbus, I2C, LINbus, SPI, and UART/USART, making it suitable for automotive and industrial embedded applications. With an active product status and 796 units in current inventory, equivalent substitute parts are available to address supply chain flexibility, packaging preferences, and application-specific qualification requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Core Processor | RH850G3KH |
| Core Size | 32-Bit |
| Operating Speed | 120MHz |
| Program Memory (FLASH) | 768KB (768K x 8) |
| RAM Size | 96K x 8 |
| EEPROM Size | 64K x 8 |
| Supply Voltage Range | 3V ~ 5.5V |
| I/O Count | 81 |
| Package Type | 100-LFQFP / 100-LQFP (14x14) |
| Operating Temperature | -40°C ~ 105°C |
| Connectivity Interfaces | CANbus, CSI, I2C, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT |
| Data Converters | A/D 20x10b, 16x12b |
| Mounting Type | Surface Mount |
Substitute Part Grouping Explanation
Substitute parts for the R7F7016853AFD-C#BA1 are determined by strict equivalence across all critical electrical and mechanical parameters. The substitution logic is based on the following key parameters:
Electrical Equivalence Criteria:
- Identical core processor (RH850G3KH)
- Matching core size (32-Bit)
- Identical operating speed (120MHz)
- Identical program memory capacity (768KB FLASH)
- Identical RAM and EEPROM sizes (96K x 8 and 64K x 8 respectively)
- Matching supply voltage range (3V ~ 5.5V)
- Identical I/O count (81 pins)
- Identical connectivity interfaces (CANbus, CSI, I2C, LINbus, SPI, UART/USART)
- Identical peripheral set (DMA, PWM, WDT)
- Identical data converter specifications (A/D 20x10b, 16x12b)
- Matching operating temperature range (-40°C ~ 105°C)
Mechanical Equivalence Criteria:
- Identical package type (100-LFQFP or 100-LQFP, 14x14mm)
- Surface mount mounting type
The identified substitute parts maintain full functional and pin compatibility with the main part number while offering variations in series designation, packaging format, and automotive qualification status.
Parameter Comparison
| Parameter | R7F7016853AFD-C#BA1 | R7F7016853AFP-C#BA1 | R7F7016203AFP-C#AA3 |
|---|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Series | RH850 | RH850/F1KM-S1 | RH850/F1K |
| Core Processor | RH850G3KH | RH850G3KH | RH850G3KH |
| Core Size | 32-Bit | 32-Bit | 32-Bit |
| Operating Speed | 120MHz | 120MHz | 120MHz |
| Program Memory (FLASH) | 768KB (768K x 8) | 768KB (768K x 8) | 768KB (768K x 8) |
| RAM Size | 96K x 8 | 96K x 8 | 96K x 8 |
| EEPROM Size | 64K x 8 | 64K x 8 | 64K x 8 |
| Supply Voltage Range | 3V ~ 5.5V | 3V ~ 5.5V | 3V ~ 5.5V |
| I/O Count | 81 | 81 | 81 |
| Connectivity Interfaces | CANbus, CSI, I2C, LINbus, SPI, UART/USART | CANbus, CSI, I2C, LINbus, SPI, UART/USART | CANbus, CSI, I2C, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT | DMA, PWM, WDT | DMA, PWM, WDT |
| Data Converters | A/D 20x10b, 16x12b | A/D 20x10b, 16x12b | A/D 20x10b, 16x12b |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 105°C |
| Package Type | 100-LFQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Product Status | Active | Active | Active |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant |
| Automotive Grade | Not specified | Not specified | Automotive (AEC-Q100) |
| Moisture Sensitivity Level | Not specified | 3 (168 Hours) | 3 (168 Hours) |
| Current Inventory | 796 Pcs | 1714 Pcs | 1246 Pcs |
Engineering Selection Recommendations
All three part numbers maintain identical electrical and functional specifications based on the RH850G3KH core processor architecture. Selection between these equivalent parts is determined by application-specific requirements and supply chain considerations:
R7F7016853AFD-C#BA1 (Main Part): This part is suitable for general embedded applications requiring the RH850 32-bit microcontroller. The part maintains active product status with 796 units in inventory.
R7F7016853AFP-C#BA1 (Substitute): This variant is functionally equivalent with identical electrical specifications. It offers higher inventory availability (1714 units) and includes RoHS3 compliance certification and MSL-3 moisture sensitivity rating. The packaging format is 100-LQFP, which is mechanically compatible with the main part. This substitute is appropriate for applications requiring RoHS compliance documentation.
R7F7016203AFP-C#AA3 (Substitute): This variant is functionally equivalent with identical electrical specifications and includes automotive-grade qualification (AEC-Q100 certified). It provides the highest inventory availability (1246 units) and includes RoHS3 compliance and MSL-3 moisture sensitivity rating. This substitute is required for automotive applications demanding AEC-Q100 qualification or when automotive-grade components are specified in design requirements.
Frequently Asked Questions (FAQ)
Q: Are these parts pin-compatible? A: Yes. All three parts use the same 100-pin LFQFP/LQFP package (14x14mm) with identical pin assignments and I/O configurations. The 81 I/O pins are functionally equivalent across all variants.
Q: What is the difference between 100-LFQFP and 100-LQFP packaging? A: Both designations refer to the same 100-pin Low-profile Quad Flat Package with 14x14mm dimensions. The packaging is mechanically and electrically interchangeable for PCB assembly purposes.
Q: Can I substitute R7F7016203AFP-C#AA3 in a non-automotive application? A: Yes. The R7F7016203AFP-C#AA3 is functionally equivalent and can be used in any application where the R7F7016853AFD-C#BA1 is specified. The automotive qualification is an additional certification that does not restrict use in other applications.
Q: What does AEC-Q100 qualification mean? A: AEC-Q100 is an automotive electronics qualification standard. The R7F7016203AFP-C#AA3 meets this qualification, making it suitable for automotive applications requiring certified components. Non-automotive applications do not require this certification.
Q: Are there differences in memory specifications between these parts? A: No. All three parts have identical memory configurations: 768KB FLASH program memory, 96KB RAM, and 64KB EEPROM. Memory capacity and type are fully equivalent.
Q: What is the significance of RoHS3 compliance? A: RoHS3 compliance indicates the part meets Restriction of Hazardous Substances regulations. The R7F7016853AFP-C#BA1 and R7F7016203AFP-C#AA3 both carry RoHS3 certification. If RoHS compliance documentation is required, these variants are appropriate selections.
Q: Do these parts have identical connectivity interfaces? A: Yes. All three parts support identical communication protocols: CANbus, CSI, I2C, LINbus, SPI, and UART/USART. Peripheral support (DMA, PWM, WDT) and data converter specifications (A/D 20x10b, 16x12b) are also identical.
Q: What is Moisture Sensitivity Level (MSL)? A: MSL-3 indicates the component can be stored in dry conditions for up to 168 hours before soldering. The R7F7016853AFP-C#BA1 and R7F7016203AFP-C#AA3 both carry MSL-3 rating, requiring standard moisture control during storage and assembly.
Q: Can I use these parts interchangeably in production? A: Yes, provided your application does not have specific requirements for automotive qualification or RoHS compliance documentation. If your design specifies one part number, the other equivalent parts can be used as direct substitutes without circuit modifications.
Q: What is the operating temperature range for all variants? A: All three parts operate across the identical temperature range of -40°C to 105°C (TA), suitable for industrial and automotive environments.
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