R7F7016223AFP-C#BA3 Equivalent & Substitute Parts

Part Overview

The R7F7016223AFP-C#BA3 is a 32-bit microcontroller from Renesas Electronics Corporation's RH850/F1K series, designed for automotive applications. This embedded device integrates a RH850G3KH core operating at 120MHz with 768KB of Flash program memory, 96KB of RAM, and 64KB of EEPROM. The part is actively produced and maintains full automotive-grade qualification under AEC-Q100 standards. Substitute parts are identified when electrical specifications, memory configurations, package types, and compliance certifications remain identical across different manufacturing batches or variant codes.

Substiute Parts

R7F7016223AFP-C#BA3

Renesas Electronics CorporationIn Stock: 1119R7F7016223AFP-C#BA3 Datasheet

Current PartRFQ

R7F7016223AFP-C#AA3

Renesas Electronics CorporationIn Stock: 1130R7F7016223AFP-C#AA3 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the R7F7016223AFP-C#BA3 is determined by strict equivalence across the following parameters:

• Core processor architecture and model (RH850G3KH)
• Operating frequency (120MHz)
• Program memory capacity and type (768KB FLASH)
• RAM and EEPROM sizes (96KB RAM, 64KB EEPROM)
• Package type and pin count (144-LQFP, 20x20mm)
• Supply voltage range (3V ~ 5.5V)
• Operating temperature range (-40°C ~ 105°C)
• Automotive grade and AEC-Q100 qualification
• RoHS3 compliance status

The identified substitute part R7F7016223AFP-C#AA3 maintains identical electrical and mechanical specifications. The difference between these part numbers reflects manufacturing batch coding or internal Renesas variant designation, not functional or performance differences.

Parameter Comparison

Engineering Selection Recommendations

Both R7F7016223AFP-C#BA3 and R7F7016223AFP-C#AA3 are active production parts with identical functional specifications and automotive compliance. Selection between these parts is based on availability and supply chain requirements rather than technical differentiation. Both parts carry AEC-Q100 qualification and ROHS3 compliance, meeting automotive industry standards for reliability and environmental compliance. The 144-LQFP package format and surface mount configuration are consistent across both variants, ensuring PCB layout and assembly compatibility.

Frequently Asked Questions (FAQ)

Q: Are R7F7016223AFP-C#BA3 and R7F7016223AFP-C#AA3 functionally identical?

A: Yes. Both parts share identical core processor architecture, clock speed, memory configuration, I/O count, connectivity options, and package specifications. The suffix variation reflects internal Renesas manufacturing or batch designation only.

Q: Can I substitute R7F7016223AFP-C#AA3 for R7F7016223AFP-C#BA3 in production?

A: Yes. The parts are electrically and mechanically equivalent. No firmware modifications, PCB redesign, or assembly process changes are required.

Q: What connectivity options are available on both parts?

A: Both variants support CANbus, CSI, I2C, LINbus, SPI, and UART/USART interfaces, with integrated DMA, PWM, and WDT peripherals.

Q: Are both parts suitable for automotive applications?

A: Yes. Both parts carry Automotive grade classification and AEC-Q100 qualification, meeting automotive reliability and quality standards.

Q: What is the package pin count and form factor?

A: Both parts use a 144-pin LQFP package with 20x20mm dimensions, configured for surface mount assembly.

Q: What is the operating temperature range?

A: Both parts operate across -40°C to 105°C ambient temperature range, suitable for automotive under-hood and cabin environments.

Q: Are there any compliance or environmental differences?

A: No. Both parts are ROHS3 compliant and REACH unaffected, with identical environmental and regulatory compliance status.