R7F7016213AFP-C#BA3 Equivalent & Substitute Parts

Part Overview

The R7F7016213AFP-C#BA3 is a 32-bit microcontroller from Renesas Electronics Corporation's RH850/F1K series, designed for automotive applications. This device integrates a RH850G3KH core operating at 120MHz with 1MB of Flash program memory, 128KB of RAM, and 64KB of EEPROM. The microcontroller provides comprehensive connectivity options including CANbus, CSI, I2C, LINbus, SPI, and UART/USART interfaces, along with integrated peripherals such as DMA, PWM, and WDT functionality. Currently in active production status with AEC-Q100 automotive qualification, this component is widely used in automotive control systems requiring robust real-time processing capabilities.

Key Parameters

Parameter	Value
Manufacturer	Renesas Electronics Corporation
Series	RH850/F1K
Core Processor	RH850G3KH
Core Size	32-Bit
Speed	120MHz
Program Memory Size	1MB (1M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	128K x 8
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V
Number of I/O	81
Package / Case	100-LQFP (14x14)
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 105°C (TA)
Grade	Automotive
Qualification	AEC-Q100
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the R7F7016213AFP-C#BA3 is determined by strict equivalence across the following critical parameters:

Core Substitution Criteria:

Identical RH850/F1K series classification
RH850G3KH core processor
32-bit architecture
120MHz operating frequency
1MB Flash program memory capacity
128KB RAM capacity
64KB EEPROM capacity
100-LQFP (14x14) package configuration
81 I/O pins
3V ~ 5.5V supply voltage range
-40°C ~ 105°C operating temperature range
Automotive grade with AEC-Q100 qualification
ROHS3 compliance

The substitute part R7F7016213AFP-C#AA3 meets all these criteria, differing only in packaging designation (tray vs. alternative tray specification) and minor documentation attributes that do not affect functional or electrical performance.

Parameter Comparison

Parameter	R7F7016213AFP-C#BA3	R7F7016213AFP-C#AA3	Match
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	✓
Series	RH850/F1K	RH850/F1K	✓
Core Processor	RH850G3KH	RH850G3KH	✓
Core Size	32-Bit	32-Bit	✓
Speed	120MHz	120MHz	✓
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)	✓
Program Memory Type	FLASH	FLASH	✓
EEPROM Size	64K x 8	64K x 8	✓
RAM Size	128K x 8	128K x 8	✓
Voltage Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V	✓
Number of I/O	81	81	✓
Data Converters	A/D 20x10b, 16x12b	A/D 20x10b, 16x12b	✓
Connectivity	CANbus, CSI, I2C, LINbus, SPI, UART/USART	CANbus, CSI, I2C, LINbus, SPI, UART/USART	✓
Peripherals	DMA, PWM, WDT	DMA, PWM, WDT	✓
Package / Case	100-LQFP (14x14)	100-LQFP (14x14)	✓
Mounting Type	Surface Mount	Surface Mount	✓
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)	✓
Grade	Automotive	Automotive	✓
Qualification	AEC-Q100	AEC-Q100	✓
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	✓
REACH Status	REACH Unaffected	REACH Unaffected	✓

Engineering Selection Recommendations

Both the R7F7016213AFP-C#BA3 and R7F7016213AFP-C#AA3 are functionally equivalent devices suitable for direct substitution in automotive applications. Selection between these parts should be based on the following factors:

Product Status: Both components maintain active production status with Renesas Electronics Corporation, ensuring long-term availability and supply chain stability.

Compliance and Certification: Both parts carry identical automotive-grade qualification with AEC-Q100 certification, meeting stringent automotive reliability and quality standards. Both are ROHS3 compliant and REACH unaffected, satisfying regulatory requirements for automotive component procurement.

Inventory Availability: The R7F7016213AFP-C#AA3 currently maintains higher inventory levels (1279 pieces) compared to the R7F7016213AFP-C#BA3 (718 pieces), which may influence procurement decisions based on project timeline and volume requirements.

Packaging Designation: The difference in part number suffix (-C#BA3 versus -C#AA3) reflects packaging specification variations that do not impact electrical performance, functional capability, or physical form factor. Both utilize identical 100-LQFP (14x14) surface mount packaging.

Frequently Asked Questions (FAQ)

Q: Are R7F7016213AFP-C#BA3 and R7F7016213AFP-C#AA3 pin-compatible?

A: Yes. Both devices utilize the identical 100-LQFP (14x14) package with 81 I/O pins in the same configuration. PCB layouts designed for one part require no modification for the other.

Q: Can I substitute R7F7016213AFP-C#AA3 for R7F7016213AFP-C#BA3 in production?

A: Yes. The devices are functionally equivalent across all electrical and mechanical parameters. No firmware, software, or hardware modifications are required for substitution.

Q: What does the suffix difference (-C#BA3 vs -C#AA3) indicate?

A: The suffix designates packaging and handling specifications. Both suffixes represent valid Renesas packaging designations for the same microcontroller die and do not affect performance or compatibility.

Q: Are both parts qualified for automotive applications?

A: Yes. Both the R7F7016213AFP-C#BA3 and R7F7016213AFP-C#AA3 carry automotive-grade classification with AEC-Q100 qualification, meeting automotive industry reliability and quality standards.

Q: Do these parts have identical memory configurations?

A: Yes. Both devices feature 1MB Flash program memory, 128KB RAM, and 64KB EEPROM with identical access characteristics and performance specifications.

Q: What is the operating temperature range for both parts?

A: Both parts operate across the identical temperature range of -40°C to 105°C (TA), suitable for automotive under-hood and cabin applications.

Q: Are there any differences in connectivity or peripheral support?

A: No. Both parts provide identical connectivity options (CANbus, CSI, I2C, LINbus, SPI, UART/USART) and peripheral support (DMA, PWM, WDT).

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